专利检索 ap:("Han Namkung" OR "Chan Gyun Shin" OR "Young Sik Ryu" OR "Bum Seok Youn" OR "Jong Yeun Kim" OR "Jong Cheol Lim") AND inv:"Han Namkung" 第 1 页

1.

发明申请
Polyamide Based Resin Composition Having Excellent Whiteness, Thermal Conductivity, and Extruding Moldability 审中-公开
标题翻译：具有优异的白度，导热性和挤出成型性的聚酰胺基树脂组合物

公开(公告)号：US20110155948A1

公开(公告)日：2011-06-30

申请号：US12981669

申请日：2010-12-30

申请人： Han Namkung , Chan Gyun Shin , Young Sik Ryu , Bum Seok Youn , Jong Yeun Kim , Jong Cheol Lim

发明人： Han Namkung , Chan Gyun Shin , Young Sik Ryu , Bum Seok Youn , Jong Yeun Kim , Jong Cheol Lim

IPC分类号： C09K5/00

CPC分类号： C08L77/00 , C08K3/013 , C08K3/38 , C08L23/00 , C08L33/12 , C08L77/06 , C08L81/04 , C08L2666/06 , C08L81/00 , C08L2666/04

摘要： The present invention provides a polyamide resin composition that can have good whiteness, thermal conductivity and extrusion molding properties, which includes (A) polyamide resin; (B) heat conductive filler; (C) filler; and (D) thermoplastic resin which is miscible with the polyamide resin and has a weight average molecular weight of about 500,000 to about 5,000,000.

摘要翻译： 本发明提供一种能够具有良好的白度，导热性和挤出成型性的聚酰胺树脂组合物，其包括（A）聚酰胺树脂; （B）导热填料; （C）填料; 和（D）可与聚酰胺树脂混溶的热塑性树脂，其重均分子量约为500,000至约5,000,000。