INTEGRATED COOLING MODULE
    2.
    发明公开

    公开(公告)号:US20240166019A1

    公开(公告)日:2024-05-23

    申请号:US18283832

    申请日:2022-07-13

    Applicant: Hanon Systems

    CPC classification number: B60H1/00885 B60H1/3227 B60H1/32284

    Abstract: The present invention relates to an integrated cooling module applied to a vehicle cooling system, and more particularly, to an integrated cooling module in which components are integrated with a manifold to eliminate a hose or pipe and reduce a size and weight of the entire cooling system, and the manifold is elongated in a gravitational direction to advantageously store a coolant therein and intensively mount the components, and an internal heat exchanger is provided in the manifold to maximize spatial efficiency.

    PLATE-TYPE HEAT EXCHANGER
    3.
    发明申请

    公开(公告)号:US20230095820A1

    公开(公告)日:2023-03-30

    申请号:US17908089

    申请日:2021-02-26

    Applicant: Hanon Systems

    Abstract: The purpose of the present invention is to provide a plate-type heat exchanger in which the formation of burrs and chips during fin processing may be eliminated by eliminating fin processing work for stacking and bonding fins and plates. In order to achieve the above purpose, a plate-type heat exchanger according to the present invention is characterized by comprising: plates which include an inlet formed on one side in the longitudinal direction, an outlet formed on the other side in the longitudinal direction, and a flow surface formed between the inlet and the outlet; and a fin part which is inserted into a plate part formed by bonding a pair of the plates and rests on the flow surface. The plates include a fin part movement preventing means to ensure that one end of the fin part in the longitudinal direction is spaced a certain distance from the inlet and the other end of the fin part in the longitudinal direction is spaced a certain distance from the outlet such that the fin part rests only on the flow surface.

    INTEGRATED COOLING MODULE
    4.
    发明公开

    公开(公告)号:US20240034126A1

    公开(公告)日:2024-02-01

    申请号:US18267881

    申请日:2022-05-19

    Applicant: Hanon Systems

    CPC classification number: B60H1/3227

    Abstract: The present invention relates to an integrated cooling module including a central manifold having a mounting space in which components may be mounted, refrigerant flow channels in which a refrigerant may flow, and communication holes for allowing the components and the refrigerant flow channels to communicate with one another, such that the components are integrated around the central manifold, thereof excluding hoses or pipes and achieving miniaturization and weight reduction of an entire cooling system.

    WATER-COOLING TYPE CONDENSER
    5.
    发明申请

    公开(公告)号:US20210283992A1

    公开(公告)日:2021-09-16

    申请号:US17258085

    申请日:2019-07-22

    Applicant: Hanon Systems

    Abstract: The present invention relates to a water-cooling type condenser, and more specifically, to a water-cooling type condenser including a fixing plate for fixing a gas and liquid separator, wherein the fixing plate is formed to enable a refrigerant and cooling water to flow by means of coupling between first and second plate portions, and is integrally formed, by brazing, with remaining components (a plate, a first inlet pipe, a first outlet pipe, a second inlet pipe, and a second outlet pipe), so as to enhance assemblability and durability and enable size reduction.

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