公开(公告)号：US20090166771A1

公开(公告)日：2009-07-02

申请号：US11913585

申请日：2006-04-27

申请人： Hans M.B. Boeve ,  Teunis J. Ikkink ,  Nicolaas J.A. Van Veen

发明人： Hans M.B. Boeve ,  Teunis J. Ikkink ,  Nicolaas J.A. Van Veen

IPC分类号： H01L29/82 ,  H01L23/498 ,  H01L29/84 ,  H01L21/98

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device (1) comprising a sensor module (2) with a package (3) is produced at reduced costs by providing the package (3) with two or more substrates (4,5) each with a functional layer (14,15), at least one sensor (24,25) such as a magnetometer and/or an accelerometer being located in at least one functional layer (14,15), and by providing the package (3) with a system comprising solder bumps (7-12) for aligning the functional layers (14,15). The system either comprises a first number of solder bumps (7,8) for coupling the functional layers (14,15) electrically and mechanically to each other via first bonding elements (31) or comprises a third substrate (6) with a third functional layer (16) and a second number of solder bumps (9,10) for coupling the first and third functional layers (14,16) electrically and mechanically to each other via second bonding elements (32) and a third number of solder bumps (11,12) for coupling the second and third functional layers (15,16) electrically and mechanically to each other via third bonding elements (33). Mechanically and/or electrically dummy solder bumps improve the alignment of the functional layers (14,15).

摘要翻译： 通过为封装（3）提供两个或多个具有功能层（14,15）的基板（4,5），以降低的成本制造包括具有封装（3）的传感器模块（2）的装置（1） 至少一个传感器（24,25），例如磁力计和/或加速度计位于至少一个功能层（14,15）中，并且通过为包装（3）提供包括焊料凸块（7- 12），用于对准功能层（14,15）。 该系统还包括第一数量的焊料凸块（7,8），用于通过第一接合元件（31）将功能层（14,15）电和机械地彼此耦合，或包括具有第三功能层 层（16）和第二数量的焊料凸块（9,10），用于经由第二接合元件（32）和第三数量的焊料凸块（32）将第一和第三功能层（14,16）电和机械地彼此耦合 11,12），用于经由第三接合元件（33）将第二和第三功能层（15,16）电和机械地彼此耦合。 机械和/或电虚拟焊料凸起改善了功能层（14,15）的对准。

公开(公告)号：US20100308450A1

公开(公告)日：2010-12-09

申请号：US12702041

申请日：2010-02-08

申请人： Fabrice Verjus ,  Jean-Marc Yan-Nou ,  David Chevrie ,  Francois LeCornec ,  Nicolaas J.A. Van Veen

发明人： Fabrice Verjus ,  Jean-Marc Yan-Nou ,  David Chevrie ,  Francois LeCornec ,  Nicolaas J.A. Van Veen

IPC分类号： H01L23/538 ,  H01L21/60 ,  H01L23/488

CPC分类号： H01L24/10 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/315 ,  H01L24/13 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A device substrate has a device major surface, a semiconductor element on the device major surface, and electrically conductive device connectors extending across the device major surface. An interconnection substrate has an interconnection substrate having an interconnection major surface, the interconnection substrate defining at least one sealing recess recessed from the interconnection major surface, the sealing recess being surrounded by a sealing ring. The device substrate is mounted on the interconnection substrate with the interconnection major surface facing the device major surface, the sealing ring around the semiconductor element and with the device major surface sealed against the sealing ring so that the recess forms a sealed cavity containing the semiconductor element. Electrical interconnects extend across the interconnection major surface. Interconnection bumps are provided outside the sealing ring to electrically connect the device to the interconnect substrate.

摘要翻译： 器件衬底具有器件主表面，器件主表面上的半导体元件和延伸穿过器件主表面的导电器件连接器。 互连衬底具有互连主表面的互连衬底，所述互连衬底限定从互连主表面凹陷的至少一个密封凹槽，密封凹槽被密封环包围。 器件基板安装在互连基板上，其互连主表面面向器件主表面，围绕半导体元件的密封环和器件主表面密封抵靠密封环，使得凹部形成包含半导体元件的密封腔 。 电互连延伸穿过互连主表面。 互连凸块设置在密封环的外部，以将该装置电连接到互连基板。