公开(公告)号：US20130203274A1

公开(公告)日：2013-08-08

申请号：US13762710

申请日：2013-02-08

Applicant: Harman Becker Automotive Systems GmbH

Inventor： Guenther Kraft ,  Eric Heneka ,  Armin Ganz ,  Juergen Schroeder ,  Tilo Trumpp

IPC: H01R12/52

CPC classification number: H01R12/52 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/1572 ,  Y02P70/611

Abstract: A circuit board system, a circuit board arrangement and a method for producing a circuit board arrangement are disclosed. The system comprises a first circuit board and a second circuit board, each having a top side and a bottom side; at least one first electronic component mounted on the bottom side of the second circuit board. The first circuit board has, on its top side, a plurality of electrically conductive first contact elements. The second circuit board has, on its bottom side, a plurality of electrically conductive second contact elements. Further, a recess is formed in the first circuit board. The second circuit board is mountable on the first circuit board such that the bottom side of the second circuit board faces towards the top side of the first circuit board, that the at least one first electronic component is arranged at least partly in the recess; and that each of the first contact elements matches one of the second contact elements.

Abstract translation: 公开了一种电路板系统，电路板装置和用于制造电路板装置的方法。 该系统包括第一电路板和第二电路板，每个具有顶侧和底侧; 安装在第二电路板的底侧上的至少一个第一电子部件。 第一电路板在其顶侧上具有多个导电的第一接触元件。 第二电路板在其底侧具有多个导电的第二接触元件。 此外，在第一电路板中形成凹部。 第二电路板可安装在第一电路板上，使得第二电路板的底侧朝向第一电路板的顶侧，至少一个第一电子部件至少部分地设置在凹部中; 并且每个第一接触元件匹配第二接触元件中的一个。