公开(公告)号：US20100003843A1

公开(公告)日：2010-01-07

申请号：US12358541

申请日：2009-01-23

Applicant: Harry YEH

Inventor： Harry YEH

IPC: H01R13/62

CPC classification number: H01R12/725 ,  H05K1/117 ,  H05K1/182 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10659 ,  H05K2203/1572

Abstract: A SMT/DIP type connector structure having at least three rows of terminals is provided. The connector structure mainly includes a printed circuit board and a connector having at least a first row of terminals, a second row of terminals and a third row of terminals. The printed circuit board is disposed centrally with respect to the connector. The first row and second row of terminals are respectively mounted to top and bottom board sides of the printed circuit board by using SMT. The third row and further rows of terminals can be mounted to the top or bottom board side of the printed circuit board selectively by using SMT or DIP. This structure can increase the speed of mounting the connector to the printed circuit board and significantly reduce the overall height of the resulted product.

Abstract translation: 提供具有至少三行端子的SMT / DIP型连接器结构。 连接器结构主要包括印刷电路板和具有至少第一排端子，第二排端子和第三排端子的连接器。 印刷电路板相对于连接器居中设置。 通过使用SMT将第一排和第二排端子分别安装到印刷电路板的顶板和底板两侧。 可以通过使用SMT或DIP选择性地将第三行和另外的端子排安装到印刷电路板的顶板或底板侧。 这种结构可以增加将连接器安装到印刷电路板上的速度，并显着降低所得产品的整体高度。