Abstract:
A semiconductor memory device includes a plurality of memory cells, including an N well formed within a P type region and a P well formed within the N well, a peripheral circuit configured to perform a program, program verify, read, erase, or erase verify operation on memory cells selected from among the memory cells, a voltage supply circuit configured to generate a positive voltage and a negative voltage for the program, program verify, read, erase, or erase verify operation, and a control circuit configured to control the peripheral circuit and the voltage supply circuit so that the program, program verify, read, erase, or erase verify operation is performed and, when the program verify and read operations are performed, different voltage is supplied to the P well and the N well.
Abstract:
A method for operating a flash memory device includes applying a pass voltage to a drain pass word line, a source pass word line, and unselected word lines. The drain pass word line is provided between a drain select line and a word line. The drain pass word line has a structure in the same manner as the word lines. The source pass word line is provided between a source select line and a word line. The source pass word line has a structure in the same manner as the word lines. A program voltage is applied to a selected word line associated with a selected memory cell block. A ground voltage is applied to drain pass word lines and source pass word lines. Word lines associated with unselected memory cell blocks are set to a floating state.
Abstract:
A flash memory device includes a memory cell array on which data is stored, and page buffers that are connected to the memory cells through the bit lines and apply one of the first voltage, second voltage or third voltage between the first and second voltage, to the respective bit line when performing the program.
Abstract:
A method for programming a flash memory device includes applying a program bias to a memory cell of a plurality of memory cells within a memory cell string. Each memory cell string comprises a source select line, a plurality of memory cells and a drain select line. A first pass bias is applied to at least one of the memory cells in a source select line direction relative to the memory cell to which the program bias has been applied. A second pass bias is applied to the memory cells in a drain select line direction relative the memory cell(s) to which the first pass bias has been applied.
Abstract:
A semiconductor memory device includes cell gate lines arranged in parallel over a semiconductor substrate, gate lines for select transistors disposed over the semiconductor substrate adjacent to the gate lines of the outermost memory cells, from among the gate lines for the memory cells, and metal lines coupled to the select transistors through contacts.
Abstract:
In a program method of a flash memory device where memory cells within a string are turned on to electrically connect channel regions, all of the channel regions within a second string are precharged uniformly by applying a ground voltage to a first bit line connected to a first string including to-be-programmed cells and a program-inhibited voltage to a second bit line connected to the second string including program-inhibited cells. If a program operation is executed, channel boosting occurs in the channel regions within the second string including the program-inhibited cells. Accordingly, a channel boosting potential can be increased and a program disturbance phenomenon, in which the threshold voltage of program-inhibited cells is changed, can be prevented.
Abstract:
The present invention relates to a method of operating a non-volatile memory device. In an aspect of the present invention, the method includes performing a first program operation on the entire memory cells, measuring a first program speed of a reference memory cell, storing the first program speed in a program speed storage unit, repeatedly performing a program/erase operation until before a number of the program/erase operation corresponds to a specific reference value, when the number of the program/erase operation corresponds to the specific reference value, measuring a second program speed of the reference memory cell, calculating a difference between the first program speed and the second program speed, resetting a program start voltage according to the calculated program speed difference, and performing the program/erase operation based on the reset program start voltage.
Abstract:
In a program method of a flash memory device where memory cells within a string are turned on to electrically connect channel regions, all of the channel regions within a second string are precharged uniformly by applying a ground voltage to a first bit line connected to a first string including to-be-programmed cells and a program-inhibited voltage to a second bit line connected to the second string including program-inhibited cells. If a program operation is executed, channel boosting occurs in the channel regions within the second string including the program-inhibited cells. Accordingly, a channel boosting potential can be increased and a program disturbance phenomenon, in which the threshold voltage of program-inhibited cells is changed, can be prevented.
Abstract:
A method of programming a non-volatile memory device includes, a bit line, to which a program-inhibited cell is connected, being precharged. After precharging the bit line, a program voltage is applied to a first word line selected for program. When a memory cell connected to a second word line, which is adjacent to the first word line in a direction of a drain select line, is a cell to be programmed, a first pass voltage is applied to the second word line and a second pass voltage is applied to the remaining word lines other than the first and second word lines.
Abstract:
A cell array of a flash memory device includes first and second memory block units, and a voltage generator. Each of the first and second memory block units includes a plurality of memory blocks having a plurality of memory cells. The voltage generator outputs a source voltage, a power supply voltage and a positive bias to the first and second memory block units. The first and second memory block units are connected in parallel through a bit line.