摘要:
In a pattern measuring unit installed in a coating and developing treatment system, the height of a pattern formed on a substrate is measured using the Scatterometry method. Based on the measured height of the pattern, an appropriate number of rotations of the substrate during application of a coating solution is calculated, so that the rotation of the substrate during the application is controlled by the calculated number of rotations of the substrate. Since the number of rotations of the substrate when the coating solution is applied to the substrate is controlled, it is unnecessary to stop the system which performs photolithography processing on the substrate, resulting in improved productivity of the substrate.
摘要:
In a pattern measuring unit installed in a coating and developing treatment system, the height of a pattern formed on a substrate is measured using the Scatterometry method. Based on the measured height of the pattern, an appropriate number of rotations of the substrate during application of a coating solution is calculated, so that the rotation of the substrate during the application is controlled by the calculated number of rotations of the substrate. Since the number of rotations of the substrate when the coating solution is applied to the substrate is controlled, it is unnecessary to stop the system which performs photolithography processing on the substrate, resulting in improved productivity of the substrate.
摘要:
A processing temperature of thermal processing is corrected based on measurement of a first dimension of a resist pattern on a substrate from a previously obtained relation between a dimension of a resist pattern and a temperature of thermal processing, a second dimension of the resist pattern after thermal processing is performed at the corrected processing temperature is measured, a distribution within the substrate of the second dimension is classified into a linear component expressed by an approximated curved surface and a nonlinear component, a processing condition of exposure processing is corrected based on the linear component from a previously obtained relation between a dimension of a resist pattern and a processing condition of exposure processing, and thermal processing at the processing temperature corrected in a temperature correcting step and exposure processing under the processing condition corrected in an exposure condition correcting step are performed to form a predetermined pattern.
摘要:
A processing temperature of thermal processing is corrected based on measurement of a first dimension of a resist pattern on a substrate from a previously obtained relation between a dimension of a resist pattern and a temperature of thermal processing, a second dimension of the resist pattern after thermal processing is performed at the corrected processing temperature is measured, a distribution within the substrate of the second dimension is classified into a linear component expressed by an approximated curved surface and a nonlinear component, a processing condition of exposure processing is corrected based on the linear component from a previously obtained relation between a dimension of a resist pattern and a processing condition of exposure processing, and thermal processing at the processing temperature corrected in a temperature correcting step and exposure processing under the processing condition corrected in an exposure condition correcting step are performed to form a predetermined pattern.
摘要:
A processing temperature of thermal processing is corrected based on measurement of a first dimension of a resist pattern on a substrate from a previously obtained relation between a dimension of a resist pattern and a temperature of thermal processing, a second dimension of the resist pattern after thermal processing is performed at the corrected processing temperature is measured, a distribution within the substrate of the second dimension is classified into a linear component expressed by an approximated curved surface and a nonlinear component, a processing condition of exposure processing is corrected based on the linear component from a previously obtained relation between a dimension of a resist pattern and a processing condition of exposure processing, and thermal processing at the processing temperature corrected in a temperature correcting step and exposure processing under the processing condition corrected in an exposure condition correcting step are performed to form a predetermined pattern.
摘要:
A thermal power plant is proposed for achieving high reliability, low material cost, and low construction cost by devising the arrangement and structures of a boiler, steam turbines, and a flue gas treatment apparatus to reduce a usage amount of high-temperature resistance material and further to reduce a thermal elongation of piping. In a thermal power plant including a 2 pass-type boiler having a furnace for burning fuel, a rear heat recovery area for recovering heat from combustion gas exhausted from the furnace, steam turbines are arranged near the rear heat recovery area.
摘要:
An oxyfuel combustion boiler plant comprising: an air separation unit for manufacturing oxygen by separating nitrogen from air, a boiler having a burner for burning the oxygen supplied from the air separation unit and pulverized coal, and a primary system pipe for supplying the pulverized coal to the burner, an exhaust gas recirculation system pipe for supplying combustion exhaust gas discharged from the boiler to the primary system pipe, and a carbon dioxide capture unit for capturing carbon dioxide in the exhaust gas discharged from the boiler, the oxyfuel combustion boiler plant is further comprising: an oxygen supply pipe for supplying the oxygen manufactured by the air separation unit to the primary system pipe in the burner, and a pipe for supplying the combustion exhaust gas discharged from the boiler to the oxygen supply pipe, wherein an injection port of the oxygen supply pipe is disposed on an upstream side of an injection portion of the burner.
摘要:
An oxyfuel combustion boiler plant having a first boiler and a second boiler for injecting gas including oxygen in higher concentration than that in the air, gas including carbon dioxide in higher concentration than that in the air, and fuel from a burner and generating steam by combustion gas in a furnace, respectively, comprising: an exhaust gas supply pipe for supplying exhaust gas discharged from the first boiler to a burner of the second boiler, and a gas flow rate control apparatus for controlling a flow rate of exhaust gas flowing through the exhaust gas supply pipe.
摘要:
PROBLEMTo provide a novel compound, a pharmaceutically acceptable salt or a hydrate thereof useful for preventing or treating for depression, anxiety disorders (such as generalized anxiety disorder, posttraumatic stress disorder, panic disorder, obsessive-compulsive disorder or social anxiety disorder), attention deficit disorder, mania, manic-depressive illness, schizophrenia, mood disorders, stress, sleep disorders, attacks, memory impairment, cognitive impairment, dementia, amnesia, delirium, obesity, eating disorder, appetite disorder, hyperphagia, bulimia, cibophobia, diabetes, cardiovascular diseases, hypertension, dyslipidemia, myocardial infarction, movement disorder (such as Parkinson's disease, epilepsy, convulsion or tremor), drug abuse, drug addiction or sexual dysfunction, based on a melanin-concentrating hormone receptor (MCH receptor) antagonistic action.SOLUTIONA compound, a pharmaceutically acceptable salt or a hydrate thereof represented by the formula (I).
摘要:
There is provided an ink jet printing apparatus in which unevenness that may occur at the edges of printing areas can be reduced also for various printing media including unspecified printing media. In the ink jet printing apparatus which uses a print head for ejecting ink and performs printing by scanning a predetermined area on a printing medium with the print head multiple times, the multiple times of scan including a forward scan and a backward scan, the apparatus comprising: a control unit that cases the print head to print patterns each of which is printed through multiple times of scan of the print head and has different portions in a time interval between the multiple times of scan, with different printing ratios for the multiple times of scan; and a setting unit that sets the printing ratios based on the test patterns.