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公开(公告)号：US08135487B2
公开(公告)日：2012-03-13
申请号：US12103276
申请日：2008-04-15
IPC分类号： G06F19/00 , H01L21/302 , H01L21/461
CPC分类号： H01L21/67248
摘要： A temperature setting method of the present invention includes the steps of: measuring states of an etching pattern within the substrate for a substrate for which a series of photolithography processing including thermal processing and an etching treatment thereafter have been finished; calculating temperature correction values for regions of a thermal processing plate from measurement result of the states of the etching pattern within the substrate using a function between correction amounts for the states of the etching pattern and the temperature correction values for the thermal processing plate; and setting the temperature for each of the regions of the thermal processing plate by each of the calculated temperature correction values.
摘要翻译： 本发明的温度设定方法包括以下步骤：测量用于其后完成了包括热处理和蚀刻处理的一系列光刻处理的基板的蚀刻图案的状态; 使用蚀刻图案的状态的校正量和热处理板的温度校正值之间的函数，从衬底内的蚀刻图案的状态的测量结果计算热处理板的区域的温度校正值; 并且通过计算的每个温度校正值来设定热处理板的每个区域的温度。
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2.发明授权公开(公告)号：US07957828B2
公开(公告)日：2011-06-07
申请号：US12099970
申请日：2008-04-09
IPC分类号： G06F19/00
CPC分类号： H01L21/67248 , G03F7/70483
摘要： In the present invention, the line widths within a substrate of an etching pattern are measured for a substrate for which photolithography processing and an etching treatment thereafter have been finished. The line width measurement results are converted into the line widths of a resist pattern using relational expressions which have been obtained in advance. From the converted line widths of the resist pattern, coefficients of a polynomial function indicating variations within the substrate are calculated. Next, a function between line width correction amounts for the resist pattern and temperature correction values is used to calculate temperature correction values for the regions of the thermal plate to bring the coefficients of the polynomial function close to zero. Based on each of the calculated temperature correction values, the temperature for each of the regions is set.
摘要翻译： 在本发明中，对于其后的光刻处理和蚀刻处理结束的基板测量蚀刻图案的基板内的线宽。 使用预先获得的关系式将线宽测量结果转换成抗蚀剂图案的线宽。 根据抗蚀剂图案的转换线宽，计算表示衬底内的变化的多项式函数的系数。 接下来，使用抗蚀剂图案的线宽校正量和温度校正值之间的函数来计算热板的区域的温度校正值，以使多项式函数的系数接近零。 基于每个计算的温度校正值，设定每个区域的温度。
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3.发明申请SUBSTRATE PROCESSING METHOD, COMPUTER-READABLE STORAGE MEDIUM AND SUBSTRATE PROCESSING SYSTEM 有权基板处理方法，计算机可读存储介质和基板处理系统公开(公告)号：US20090269686A1
公开(公告)日：2009-10-29
申请号：US12426600
申请日：2009-04-20
CPC分类号： G03F7/38 , H01L21/67225 , H01L21/67248
摘要： A processing temperature of thermal processing is corrected based on measurement of a first dimension of a resist pattern on a substrate from a previously obtained relation between a dimension of a resist pattern and a temperature of thermal processing, a second dimension of the resist pattern after thermal processing is performed at the corrected processing temperature is measured, a distribution within the substrate of the second dimension is classified into a linear component expressed by an approximated curved surface and a nonlinear component, a processing condition of exposure processing is corrected based on the linear component from a previously obtained relation between a dimension of a resist pattern and a processing condition of exposure processing, and thermal processing at the processing temperature corrected in a temperature correcting step and exposure processing under the processing condition corrected in an exposure condition correcting step are performed to form a predetermined pattern.
摘要翻译： 基于先前获得的抗蚀剂图案的尺寸和热处理温度之间的关系，基于热处理后的抗蚀剂图案的第二维度，基于基板上的抗蚀剂图案的第一尺寸的测量来校正热处理的处理温度 在校正后的处理温度下进行处理，将第二维度的基板内的分布分类成由近似曲面和非线性成分表示的线性分量，根据线性分量来校正曝光处理的处理条件 从先前获得的抗蚀剂图案的尺寸和曝光处理的处理条件之间的关系以及在温度校正步骤中校正的处理温度下的热处理和在曝光条件校正步骤中校正的处理条件下的曝光处理进行到 形成一个预先 确定模式。
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4.发明申请公开(公告)号：US20080105669A1
公开(公告)日：2008-05-08
申请号：US11926808
申请日：2007-10-29
申请人： Megumi JYOUSAKA , Shinichi Shinozuka , Kunie Ogata
发明人： Megumi JYOUSAKA , Shinichi Shinozuka , Kunie Ogata
IPC分类号： H05B3/68
CPC分类号： H01L21/67248
摘要： A thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and an in-plane tendency of the measured line widths is decomposed into a plurality of in-plane tendency components using a Zernike polynomial. From the calculated plurality of in-plane tendency components, in-plane tendency components improvable by changing the temperature correction values are extracted and added together to calculate an improvable in-plane tendency of the measured line widths within the substrate. The change of setting of the temperature correction value for each of the thermal plate regions of the thermal plate is performed only when the magnitude of the improvable in-plane tendency exceeds a threshold value set in advance.
摘要翻译： 加热单元的热板被分成多个热板区域，并且可以为每个热板区域设定温度。 可以对热板的每个热板区域设定用于调节热板内的温度的温度校正值。 测量经过光刻处理的衬底内的线宽，并且使用Zernike多项式将所测量的线宽的面内趋势分解成多个面内趋势分量。 从计算出的多个面内趋势分量中，提取通过改变温度校正值而改善的面内趋势分量并将其相加在一起，以计算衬底内测量的线宽的可改进的面内趋势。 只有当可提升的平面内趋势的大小超过预先设定的阈值时，才进行热板的每个热板区域的温度校正值的设定的变化。
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5.发明申请SUBSTRATE DEFECT INSPECTION METHOD, COMPUTER READABLE STORAGE MEDIUM, AND DEFECT INSPECTION APPARATUS 有权基板缺陷检查方法，计算机可读存储介质和缺陷检查装置公开(公告)号：US20070182955A1
公开(公告)日：2007-08-09
申请号：US11626028
申请日：2007-01-23
申请人： Hiroshi Tomita , Shinichi Shinozuka
发明人： Hiroshi Tomita , Shinichi Shinozuka
IPC分类号： G01N21/00
CPC分类号： G06T7/001 , G03F7/7065 , G06T2207/30148
摘要： In the present invention, data on a substrate image picked up by an image pickup unit is outputted to a difference calculation unit where a difference image from a normal substrate is calculated. A synthesis calculation unit calculates a synthesized image by rotating the difference image 360 degrees by every predetermined angle about the center of the substrate and synthesizing the images. A Zernike calculation unit digitizes the synthesized image by a Zernike polynomial and outputs a concentric circle component to a determination unit where the component is compared with a previously set threshold value, so that the presence or absence of a defect on the substrate is determined. The present invention can facilitate the determination of the presence or absence of a macro defect on the substrate and reduce the time required for the determination.
摘要翻译： 在本发明中，由摄像单元拾取的基板图像上的数据被输出到差分计算单元，其中计算出与正常基板的差分图像。 合成计算单元通过围绕基板的中心以预定的角度360度旋转差分图像来合成图像来计算合成图像。 Zernike计算单元通过Zernike多项式数字化合成图像，并将同心圆分量输出到确定单元，其中将分量与先前设置的阈值进行比较，从而确定基板上存在或不存在缺陷。 本发明可以有助于确定基板上的宏观缺陷的存在或不存在，并且减少确定所需的时间。
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6.发明申请TEMPERATURE CONTROL METHOD OF HEAT PROCESSING PLATE, COMPUTER STORAGE MEDIUM, AND TEMPERATURE CONTROL APPARATUS OF HEAT PROCESSING PLATE 有权热处理板的温度控制方法，计算机存储介质和加热板的温度控制装置公开(公告)号：US20120279955A1
公开(公告)日：2012-11-08
申请号：US13551307
申请日：2012-07-17
CPC分类号： H05B1/0233 , H01L21/67248
摘要： In the present invention, temperature drop amounts of heating plate regions when the substrate is mounted on a heating plate are detected to detect a warped state of the substrate. From the temperature drop amounts of the heating plate regions, correction values for set temperatures of the heating plate regions are calculated. The calculation of the correction values for the set temperatures of the heating plate regions is performed by estimating steady temperatures within the substrate to be heat-processed on the heating plate from the temperature drop amounts of the heating plate regions using a correlation obtained in advance. From the estimated steady temperatures within the substrate and the temperature drop amounts of the heating regions, the correction values for the set temperatures of the heating plate regions are calculated. Based on the correction values for the set temperatures, the set temperatures of the heating plate regions are changed.
摘要翻译： 在本发明中，检测将基板安装在加热板上时的加热板区域的温度下降量，以检测基板的翘曲状态。 根据加热板区域的温度下降量，计算加热板区域的设定温度的校正值。 通过使用预先获得的相关性，从加热板区域的温度下降量估计加热板上的待加热基板内的稳定温度来进行加热板区域的设定温度的校正值的计算。 从估计的基板内的稳定温度和加热区域的温度下降量，计算加热板区域的设定温度的校正值。 基于设定温度的校正值，改变加热板区域的设定温度。
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7.发明授权公开(公告)号：US08242417B2
公开(公告)日：2012-08-14
申请号：US11748167
申请日：2007-05-14
IPC分类号： H05B1/02
CPC分类号： H05B1/0233 , H01L21/67248
摘要： In the present invention, temperature drop amounts of heating plate regions when the substrate is mounted on a heating plate are detected to detect a warped state of the substrate. From the temperature drop amounts of the heating plate regions, correction values for set temperatures of the heating plate regions are calculated. The calculation of the correction values for the set temperatures of the heating plate regions is performed by estimating steady temperatures within the substrate to be heat-processed on the heating plate from the temperature drop amounts of the heating plate regions using a correlation obtained in advance. From the estimated steady temperatures within the substrate and the temperature drop amounts of the heating regions, the correction values for the set temperatures of the heating plate regions are calculated. Based on the correction values for the set temperatures, the set temperatures of the heating plate regions are changed.
摘要翻译： 在本发明中，检测将基板安装在加热板上时的加热板区域的温度下降量，以检测基板的翘曲状态。 根据加热板区域的温度下降量，计算加热板区域的设定温度的校正值。 通过使用预先获得的相关性，从加热板区域的温度下降量估计加热板上的待加热基板内的稳定温度来进行加热板区域的设定温度的校正值的计算。 从估计的基板内的稳定温度和加热区域的温度下降量，计算加热板区域的设定温度的校正值。 基于设定温度的校正值，改变加热板区域的设定温度。
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8.发明授权Substrate measuring method, computer-readable recording medium recording program thereon, and substrate measuring system 有权基板测量方法，其上的计算机可读记录介质记录程序和基板测量系统公开(公告)号：US08041525B2
公开(公告)日：2011-10-18
申请号：US11856308
申请日：2007-09-17
申请人： Yoshihiro Kondo , Kunie Ogata , Shinichi Shinozuka
发明人： Yoshihiro Kondo , Kunie Ogata , Shinichi Shinozuka
IPC分类号： G01N21/00
CPC分类号： H01L21/67253 , H01L21/67248
摘要： In the present invention, for measurement of line widths, for example, at 36 locations within a substrate processed in a coating and developing treatment system, the 36 measurement points are divided and, for example, six substrates are used to measure the line widths at all of measurement points. In this event, the line widths at six measurement points are measured in each of the substrate, which exist in substrate regions different for each substrate. Then, the measurement results of the line widths at the measurement points of the substrates are combined, so that the line widths at 36 measurement points are finally detected. According to the present invention, the measurements of product substrates can be performed without decreasing the throughput of processing of the product substrates.
摘要翻译： 在本发明中，为了测量线宽度，例如在涂布和显影处理系统中处理的基板内的36个位置处，36个测量点被分割，并且例如使用六个基板来测量线宽 所有测量点。 在这种情况下，在每个衬底中测量六个测量点处的线宽度，每个衬底存在于对于每个衬底不同的衬底区域中。 然后，将基板的测定点的线宽度的测定结果合并，最终检测36个测定点的线宽。 根据本发明，可以在不降低产品基板的加工生产能力的情况下进行产品基板的测量。
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9.发明授权Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate 有权热处理板的温度设定方法，其上的计算机可读记录介质记录程序和用于热处理板的温度设定装置公开(公告)号：US07897896B2
公开(公告)日：2011-03-01
申请号：US11875239
申请日：2007-10-19
申请人： Megumi Jyousaka , Shinichi Shinozuka , Kunie Ogata
发明人： Megumi Jyousaka , Shinichi Shinozuka , Kunie Ogata
IPC分类号： H05B1/02
CPC分类号： G05D23/1931 , H01L21/67248
摘要： In the present invention, a thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and, from an in-plane tendency of the measured line widths, an in-plane tendency improvable by temperature correction and an unimprovable in-plane tendency are calculated using a Zernike polynomial. An average remaining tendency of the improvable in-plane tendency after improvement obtained in advance is added to the unimprovable in-plane tendency to estimate an in-plane tendency of the line widths within the substrate after change of temperature setting.
摘要翻译： 在本发明中，加热单元的热板被分成多个热板区域，并且可以为每个热板区域设定温度。 可以对热板的每个热板区域设定用于调节热板内的温度的温度校正值。 测量经过光刻工艺的衬底内的线宽，并且根据所测量的线宽的面内趋势，通过温度校正提高的面内趋势和不可估量的面内趋势，使用 一个Zernike多项式。 将预先获得的改进后的面内趋势的平均剩余趋势加到不可估量的平面内趋势中，以估计在温度设定变化之后衬底内线宽的面内趋势。
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10.发明授权Substrate measuring method, computer-readable recording medium recording program thereon, and substrate processing system 有权基板测量方法，其上的计算机可读记录介质记录程序和基板处理系统公开(公告)号：US07822574B2
公开(公告)日：2010-10-26
申请号：US11869237
申请日：2007-10-09
申请人： Kunie Ogata , Shinichi Shinozuka , Yoshihiro Kondo
发明人： Kunie Ogata , Shinichi Shinozuka , Yoshihiro Kondo
CPC分类号： G03F7/70625 , G03F7/70525 , H01L22/20
摘要： In the present invention, substrates in a plurality of lots are successively processed in a coating and developing treatment system, and line width measurement is performed for some of substrates of the substrate which have been through processing in each lot. The line width measurement of two successive lots is performed such that the last line width measurement in the previous lot of the two successive lots has been completed at the time of completion of processing of a substrate which is first subjected to the line width measurement in the subsequent lot. According to the present invention, the measurement of product substrates can be performed without decreasing the throughput of the product substrates.
摘要翻译： 在本发明中，多个批次中的基板在涂布显影处理系统中连续地进行处理，并且对于已经通过每个批次处理的基板的一些基板进行线宽测量。 执行两个连续批次的线宽测量，使得在完成对在第一次进行线宽测量的基板的处理完成时，两个连续批次的前一批次中的最后一行宽度测量已经完成 随后很多。 根据本发明，可以在不降低产品基板的生产量的情况下进行产品基板的测量。
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