公开(公告)号：US5127998A

公开(公告)日：1992-07-07

申请号：US459844

申请日：1990-01-02

申请人： Herbert S,. Cole, Jr. ,  James W. Rose

发明人： Herbert S,. Cole, Jr. ,  James W. Rose

IPC分类号： C23C14/04 ,  C23C14/58 ,  C25D5/02 ,  H01L21/48 ,  H01L23/538 ,  H05K3/10 ,  H05K3/38

CPC分类号： H01L23/5389 ,  C25D5/022 ,  C25D5/50 ,  C25D7/123 ,  H01L21/4846 ,  H05K3/108 ,  H01L2924/0002 ,  H05K2203/0315 ,  H05K2203/0361 ,  H05K2203/107 ,  H05K3/388

摘要： Selective electrolytic deposition on either conductive or non-conductive bodies is provided by forming a layer of a metal which forms a plating-preventing compound on the surface of the body to be plated, and selectively interdiffusing a plating-enabling metal into the surface of that compound-forming metal in those locations where plating is desired and electroplating the body. The interdiffusion may be done before or after the plating-preventing compound has formed on the surface of the compound-forming layer. During the electroplating, the electroplating metal deposits only in those locations where the plating-enabling metal has interdiffused with the compound-forming metal. At the end of the process, the compound-forming metal may be removed in those locations where it is not covered by the electroplated metal to provide a plurality of separate plated conductors.