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1.发明授权Method for making an electronics module having air bridge protection without large area ablation 失效制造具有空气桥保护而没有大面积消融的电子模块的方法
公开(公告)号：US5548099A
公开(公告)日：1996-08-20
申请号：US304920
申请日：1994-09-13
CPC分类号： H01L24/24 , H01L23/29 , H01L23/315 , H01L23/5389 , H01L23/66 , H01L24/82 , H01L2224/2402 , H01L2224/24227 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/3011 , Y10T29/4913
摘要： In a method for preserving an air bridge structure on an integrated circuit chip, without sacrificing metallization routing area in an overlying high density interconnect structure, a protective layer is sublimed over the air bridge to provide mechanical strength while preventing contamination and deformation during processing. A high density interconnect structure is applied over the chip and protective layer. A small portion of the high density interconnect structure is removed from the area over the air bridge structure, and the protective layer is then sublimed away, leaving the resultant structure with an undamaged air bridge which is free of residue.
摘要翻译： 在一种用于在集成电路芯片上保持空气桥结构的方法中，不牺牲上覆高密度互连结构中的金属化布线区域，保护层在空气桥上升华以提供机械强度，同时防止加工过程中的污染和变形。 在芯片和保护层上施加高密度互连结构。 将高密度互连结构的一小部分从空气桥结构上的区域去除，然后将保护层升华，留下所得结构与没有残留物的未损坏的空气桥。
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公开(公告)号：US5127998A
公开(公告)日：1992-07-07
申请号：US459844
申请日：1990-01-02
CPC分类号： H01L23/5389 , C25D5/022 , C25D5/50 , C25D7/123 , H01L21/4846 , H05K3/108 , H01L2924/0002 , H05K2203/0315 , H05K2203/0361 , H05K2203/107 , H05K3/388
摘要： Selective electrolytic deposition on either conductive or non-conductive bodies is provided by forming a layer of a metal which forms a plating-preventing compound on the surface of the body to be plated, and selectively interdiffusing a plating-enabling metal into the surface of that compound-forming metal in those locations where plating is desired and electroplating the body. The interdiffusion may be done before or after the plating-preventing compound has formed on the surface of the compound-forming layer. During the electroplating, the electroplating metal deposits only in those locations where the plating-enabling metal has interdiffused with the compound-forming metal. At the end of the process, the compound-forming metal may be removed in those locations where it is not covered by the electroplated metal to provide a plurality of separate plated conductors.
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公开(公告)号：US4865873A
公开(公告)日：1989-09-12
申请号：US129854
申请日：1987-12-07
CPC分类号： H05K3/184 , C23C18/1605 , C23C18/1608 , C23C18/1831 , C23C18/1879 , C23C18/206 , C23C18/30 , C23C18/31 , H05K2203/0565 , H05K2203/0577 , H05K2203/107 , H05K2203/1415 , H05K3/0017 , Y10S430/165
摘要： A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.
摘要翻译： 将金属无电镀在基材上，该基材首先涂覆有至少一个可剥离层，其被选择性地用激光辐射照射以获得用于在基材上沉积金属的图案。 在经过照射的基板涂覆有催化剂之后施加到基板上的化学镀溶液也用于去除可消泡层的未照射部分。 该方法特别适用于镀金属细线，尤其适用于非平面表面。
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公开(公告)号：US4354740A
公开(公告)日：1982-10-19
申请号：US152741
申请日：1980-05-23
申请人： Herbert S. Cole, Jr.
发明人： Herbert S. Cole, Jr.
IPC分类号： G02F1/13 , G02F1/1337
CPC分类号： G02F1/133719 , Y10S359/90
摘要： Homeotropic surface alignment is provided in liquid crystal display cells, utilizing high temperature peripheral sealing material, by fabricating the empty cell prior to introducing a solution of a homeotropic-aligning surfactant dissolved in a volatile solvent. The solvent is evaporated to provide a surfactant film on the cell cavity interior surfaces. The cell is then filled with the liquid crystal material and the cell is sealed.
摘要翻译： 在引入溶解在挥发性溶剂中的垂直取向表面活性剂的溶液之前，通过制造空容器，在液晶显示单元中提供使用高温周边密封材料的垂直表面对准。 蒸发溶剂以在电池腔内表面上提供表面活性剂膜。 然后用液晶材料填充电池，密封电池。
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公开(公告)号：US4350603A
公开(公告)日：1982-09-21
申请号：US164254
申请日：1980-06-30
CPC分类号： C09B35/35 , C09K19/601
摘要： Novel tris-azo dye compositions and a liquid crystal composition containing the tris-azo dye compositions are disclosed. The tris-azo dye composition having terminal aromatic groups has the general formula: ##STR1## wherein R.sub.1 and R.sub.2 are various aromatic compounds including aromatic amines, substituted aromatic amines, hydroxy-substituted aromatic compounds and substituted hydroxy-containing aromatic compounds. When the tris-azo dichroic dyes are used as a guest dye in a host liquid crystal material, they form a novel liquid crystal composition for use in liquid crystal displays. Examples of R.sub.1 and R.sub.2 include organic radicals of aminoquinoline, tetrahydroquinoline, N-ethyl-1-naphthylamine and 1,8-diaminonaphthalene.
摘要翻译： 公开了新的三偶氮染料组合物和含有三偶氮染料组合物的液晶组合物。 具有末端芳族基团的三偶氮染料组合物具有以下通式：其中R1和R2是各种芳族化合物，包括芳族胺，取代的芳族胺，羟基取代的芳香族化合物和取代的含羟基的芳族化合物。 当三偶氮二色性染料用作主体液晶材料中的客体染料时，它们形成用于液晶显示器的新型液晶组合物。 R 1和R 2的实例包括氨基喹啉，四氢喹啉，N-乙基-1-萘胺和1,8-二氨基萘的有机基团。
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公开(公告)号：US5455459A
公开(公告)日：1995-10-03
申请号：US250329
申请日：1994-06-09
IPC分类号： H01L23/538 , H01L25/065 , H01L23/02
CPC分类号： H01L24/24 , H01L23/5389 , H01L24/82 , H01L25/0655 , H01L2224/2402 , H01L2224/24137 , H01L2224/24227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19042 , H01L2924/19043
摘要： A reconstructible electrical circuit module includes a substrate, at least one electrical circuit component and an electrical interconnection structure. The electrical interconnection structure includes at least one multiple ply sequence stacked over the component and substrate in which the portion of the module underlying a ply in the electrical interconnection structure is substantially unimpairable by a process for removing that ply.
摘要翻译： 可重构的电路模块包括衬底，至少一个电路部件和电互连结构。 电互连结构包括堆叠在部件和基板上的至少一个多层序列，其中在电互连结构中的层下方的模块部分通过用于去除该层的工艺基本上不可修复。
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7.发明授权
公开(公告)号：US5338975A
公开(公告)日：1994-08-16
申请号：US546965
申请日：1990-07-02
IPC分类号： H01L23/522 , H01L23/48 , H01L29/46 , H01L29/54
CPC分类号： H01L24/24 , H01L23/5222 , H01L24/82 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/3011
摘要： A high frequency electronic component which is interconnected with other components through a high density interconnect structure sees only an air dielectric constant in the high density interconnect structure because a spacer structure disposed on the electronic component spaces the dielectric of the high density interconnect structure from the surface of the electronic component by a sufficient distance that the higher dielectric constant of the polymer dielectric layers of the high density interconnect structure only minimally affects the operating characteristics of the electronic components.
摘要翻译： 通过高密度互连结构与其他部件互连的高频电子部件仅在高密度互连结构中仅看到空气介电常数，因为设置在电子部件上的间隔结构将高密度互连结构的电介质从表面 的电子部件的距离使得高密度互连结构的聚合物电介质层的较高介电常数仅最小程度地影响电子部件的操作特性。
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8.发明授权Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing T.sub.G ' s 失效MUTLIPLE LAMINATION高密度互连过程和结构使用具有顺序降低的热塑性粘合剂
公开(公告)号：US5157589A
公开(公告)日：1992-10-20
申请号：US546963
申请日：1990-07-02
IPC分类号： H01L23/13 , H01L23/498 , H01L23/538 , H01L25/04 , H01L25/18 , H05K1/18 , H05K3/38 , H05K3/46
CPC分类号： H01L23/5389 , H01L23/13 , H01L23/49822 , H01L24/24 , H01L24/82 , H05K3/4635 , H05K3/4673 , H01L2224/2402 , H01L2224/24227 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H05K1/185 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K3/386 , H05K3/4644
摘要： A high density interconnect structure incorporating a plurality of laminated dieletric layers is fabricated using thermoplastic adhesive layers of progressively lower glass transition temperature in order to maintain the stability of the already fabricated structure during the addition of the later laminations. This structure also facilitates the removal of only a portion of the high density interconnect structure where a fault in the system can be corrected in one of the upper layers of the high density interconnect structure.
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9.发明授权Process for removing organic material in a patterned manner from an organic film 失效从有机膜以图案方式除去有机材料的方法
公开(公告)号：US4617085A
公开(公告)日：1986-10-14
申请号：US771956
申请日：1985-09-03
IPC分类号： H01L21/30 , G03F7/038 , G03F7/039 , G03F7/30 , G03F7/36 , H01L21/027 , H01L21/311 , H01L21/48 , B44C1/22 , B29C17/08 , C03C15/00 , C03C25/06
CPC分类号： H01L21/4803 , G03F7/039 , H01L21/31127
摘要： A method is provided for removing organic material from an organic film in a patterned manner using ultraviolet light at sufficient power density to effect the patterned ablative photodecomposition of an organic film in the form of a blend of aliphatic and aromatic organic material or a copolymer of chemically combined aliphatic units and aromatic units.
摘要翻译： 提供了一种以图案化方式从有机膜中去除有机材料的方法，其中使用紫外光以足够的功率密度来实现以脂肪族和芳族有机材料或化学共聚物共混物形式的有机薄膜的图案化消融光分解 组合脂族单元和芳族单元。
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公开(公告)号：US4228030A
公开(公告)日：1980-10-14
申请号：US15771
申请日：1979-02-28
申请人： Herbert S. Cole, Jr.
发明人： Herbert S. Cole, Jr.
CPC分类号： C09K19/44
摘要： Novel liquid crystal compositions having extended temperature ranges, without sacrifice of stability, are provided by mixing 10-25%, by weight, of a terphenyl liquid crystal material with 75-90%, by weight, of a four-component liquid crystal composition of cyclohexanes.
摘要翻译： 通过将10-25重量％的三联苯液晶材料与75-90重量％的四组分液晶组合物混合，得到具有延长温度范围而不牺牲稳定性的新型液晶组合物 环己烷。
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