公开(公告)号：US07833841B2

公开(公告)日：2010-11-16

申请号：US12187601

申请日：2008-08-07

申请人： Hidehiko Kando ,  Isao Sakama

发明人： Hidehiko Kando ,  Isao Sakama

IPC分类号： H01L21/82

CPC分类号： H01L22/34 ,  H01L2924/3011

摘要： The present invention is a method for manufacturing a semiconductor apparatus including a chip which is fabricated in large numbers on a wafer and has a plurality of information blocks. In the method, a unique information bit is written in a chip discrimination block of each chip within a shot, which is a segmented region of the wafer, by a fixed pattern method. In addition, an information bit uniquely given to each shot within the wafer is written by a mask shift method. Further, an information bit uniquely given to each wafer is written in a wafer discrimination block of the chip which is fabricated on the wafer by the mask shift method and mask combination method.

摘要翻译： 本发明是一种制造半导体装置的方法，该半导体装置包括大量制造在晶片上并具有多个信息块的芯片。 在该方法中，通过固定图案方式，在作为晶片的分割区域的镜头内的每个芯片的芯片鉴别块中写入唯一的信息位。 此外，通过掩模移位方法写入唯一给予晶片内的每个镜头的信息位。 此外，通过掩模移位方法和掩模组合方法，在晶片上制造的芯片的晶片鉴别块中写入唯一给每个晶片的信息位。

公开(公告)号：US20090159881A1

公开(公告)日：2009-06-25

申请号：US12187601

申请日：2008-08-07

申请人： Hidehiko KANDO ,  Isao Sakama

发明人： Hidehiko KANDO ,  Isao Sakama

IPC分类号： H01L23/544 ,  H01L21/26

CPC分类号： H01L22/34 ,  H01L2924/3011

摘要： The present invention is a method for manufacturing a semiconductor apparatus including a chip which is fabricated in large numbers on a wafer and has a plurality of information blocks. In the method, a unique information bit is written in a chip discrimination block of each chip 10 within a shot, which is a segmented region of the wafer, by a fixed pattern method. In addition, an information bit uniquely given to each shot within the wafer is written by a mask shift method. Further, an information bit uniquely given to each wafer is written in a wafer discrimination block of the chip 10 which is fabricated on the wafer by the mask shift method and mask combination method.

摘要翻译： 本发明是一种制造半导体装置的方法，该半导体装置包括大量制造在晶片上并具有多个信息块的芯片。 在该方法中，通过固定图案方式，在作为晶片的分割区域的镜头内的每个芯片10的芯片鉴别块中写入唯一的信息位。 此外，通过掩模移位方法写入唯一给予晶片内的每个镜头的信息位。 此外，通过掩模移位方法和掩模组合方法，在晶片上制造的芯片10的晶片鉴别块中写入唯一给每个晶片的信息位。

公开(公告)号：US07602289B2

公开(公告)日：2009-10-13

申请号：US11316805

申请日：2005-12-27

申请人： Minoru Ashizawa ,  Isao Sakama

发明人： Minoru Ashizawa ,  Isao Sakama

IPC分类号： G08B13/14

CPC分类号： H01R29/00 ,  H01R9/2475 ,  H01R13/6691 ,  H01R13/7038

摘要： A connector device used for electrical connection between electrical devices, including: a first connector; an IC chip disposed in a casing of the first connector; a first antenna disposed in the casing of the first connector, for wirelessly transmitting ID data of the IC chip stored in the IC chip in response to a signal from an external device; a second connector detachable from the first connector, electrically connecting the electrical devices when coupled to the first connector; and a second antenna disposed in a casing of the second connector, brought close to the first antenna to amplify and transmit a radio wave from the first antenna, when the first and second connectors are normally coupled together.

摘要翻译： 一种用于电气设备之间的电连接的连接器装置，包括：第一连接器; 设置在所述第一连接器的壳体中的IC芯片; 第一天线，设置在所述第一连接器的壳体中，用于响应于来自外部设备的信号，无线地发送存储在所述IC芯片中的IC芯片的ID数据; 第二连接器，其可从所述第一连接器拆卸，当连接到所述第一连接器时电连接所述电气装置; 以及当所述第一和第二连接器通常耦合在一起时，设置在所述第二连接器的壳体中的第二天线靠近所述第一天线放大并发射来自所述第一天线的无线电波。

公开(公告)号：US07523541B2

公开(公告)日：2009-04-28

申请号：US12076030

申请日：2008-03-13

申请人： Isao Sakama ,  Minoru Ashizawa

发明人： Isao Sakama ,  Minoru Ashizawa

IPC分类号： H01P11/00

CPC分类号： H01Q1/22 ,  H01Q9/285 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49169

摘要： Method for manufacturing a small radio frequency IC tag, where the radio frequency IC tag which can obtain sufficiently long communication distance with radio wave in the microwave band even if an antenna is made small and the radio frequency IC tag is embedded in metal material. An O-shaped antenna is formed to narrow the width of a neck part in which an IC chip is mounted and widen the width of radiating electrodes constituting radiating part of radio wave. The radiating electrodes are formed into offset structure on right and left sides of the feeding point so that areas of right and left radiating parts of the feeding point in which the IC chip is mounted are unsymmetrical. Further, a ground electrode is provided so that a dielectric body is held between the radiating electrodes and the ground electrode and the radiating electrode is connected to the ground electrode at the side of the dielectric body.

摘要翻译： 制造小型射频IC标签的方法，其中即使天线小，并且射频IC标签嵌入在金属材料中，即使在微波频带中也能够获得足够长的与无线电波的通信距离的射频IC标签。 形成O形天线以使安装有IC芯片的颈部的宽度变窄，并且扩大构成无线电波的辐射部分的辐射电极的宽度。 辐射电极在馈电点的左右两侧形成偏移结构，使得安装IC芯片的馈电点的左右辐射部分的区域不对称。 此外，设置接地电极，使得电介质体保持在辐射电极和接地电极之间，并且辐射电极连接到介电体侧面的接地电极。

公开(公告)号：US20080030902A1

公开(公告)日：2008-02-07

申请号：US11739257

申请日：2007-04-24

申请人： Isao Sakama ,  Minoru Ashizawa

发明人： Isao Sakama ,  Minoru Ashizawa

IPC分类号： G11B5/48

CPC分类号： G11B23/0042 ,  G06K19/045 ,  G11B23/0305 ,  H01Q1/22 ,  H01Q13/08 ,  H01Q13/10

摘要： A disk media has an IC chip which is mounted thereon at a boundary peripheral portion of a metal film layer formation region with respect to a metal film layer non-formation region. The IC chip is mounted on a top surface of the metal film layer. An “L”-shaped slit is formed in the metal film layer at the mount position of the IC chip while causing signal input/output electrodes of IC chip to be connected to portions of the metal film layer which are placed on the opposite sides of the slit. With such an arrangement, it is possible to use the metal film layer as an antenna of IC chip while enabling the impedance of IC chip to match the impedance of the antenna formed by the metal film layer.

摘要翻译： 磁盘介质在相对于金属膜层非形成区域的金属膜层形成区域的边界周边部分安装有IC芯片。 IC芯片安装在金属膜层的顶面上。 在IC芯片的安装位置的金属膜层中形成“L”形狭缝，同时使IC芯片的信号输入/输出电极连接到金属膜层的位于相对侧的部分 狭缝。 通过这样的布置，可以使金属膜层作为IC芯片的天线，同时能够使IC芯片的阻抗匹配由金属膜层形成的天线的阻抗。

公开(公告)号：US20060267843A1

公开(公告)日：2006-11-30

申请号：US11300282

申请日：2005-12-15

申请人： Isao Sakama ,  Minoru Ashizawa

发明人： Isao Sakama ,  Minoru Ashizawa

IPC分类号： H01Q1/38

CPC分类号： H01Q1/22 ,  H01Q9/285 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49169

摘要： A small radio frequency IC tag which can obtain sufficiently long communication distance with radio wave in the microwave band even if an antenna is made small and the radio frequency IC tag is embedded in metal material. An O-shaped antenna is formed to narrow the width of a neck part in which an IC chip is mounted and widen the width of radiating electrodes constituting radiating part of radio wave. The radiating electrodes are formed into offset structure on right and left sides of the feeding point so that areas of right and left radiating parts of the feeding point in which the IC chip is mounted are unsymmetrical. Further, a ground electrode is provided so that a dielectric body is held between the radiating electrodes and the ground electrode and the radiating electrode is connected to the ground electrode at the side of the dielectric body.

摘要翻译： 即使天线小，射频IC标签嵌入金属材料中，也能够在微波频带中与无线电波获得足够长的通信距离的小射频IC标签。 形成O形天线以使安装有IC芯片的颈部的宽度变窄，并且扩大构成无线电波的辐射部分的辐射电极的宽度。 辐射电极在馈电点的左右两侧形成偏移结构，使得安装IC芯片的馈电点的左右辐射部分的区域不对称。 此外，设置接地电极，使得电介质体保持在辐射电极和接地电极之间，并且辐射电极连接到介电体侧面的接地电极。

公开(公告)号：US20050275539A1

公开(公告)日：2005-12-15

申请号：US11052804

申请日：2005-02-09

申请人： Isao Sakama ,  Minoru Ashizawa

发明人： Isao Sakama ,  Minoru Ashizawa

IPC分类号： G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/28 ,  H01Q19/00 ,  G08B13/14

CPC分类号： G06K19/07786 ,  G06K19/07756 ,  H01Q1/2225 ,  H01Q7/00 ,  H01Q9/285 ,  H01Q19/00 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T156/1052

摘要： A radio frequency IC tag and a manufacturing method for the same includes an IC chip on which information is stored, and an antenna for transmitting the information that is stored on the IC chip. In the antenna, a power-feeding part on which the IC chip is mounted extends along a direction in which an electric current flows. Radiation parts are formed so that the width of the radiation parts becomes wider than that of the power-feeding part with respect to the longitudinal axis of the power-feeding part. The radiation parts extend from the power-feeding part, at both sides thereof, along the direction in which the electric current flows.

摘要翻译： 射频IC标签及其制造方法包括存储有信息的IC芯片和用于发送存储在IC芯片上的信息的天线。 在天线中，安装IC芯片的供电部分沿着电流流过的方向延伸。 辐射部分被形成为使得辐射部分的宽度相对于馈电部分的纵向轴线的宽度变得比供电部分的宽度宽。 辐射部分沿着电流流动的方向从供电部分的两侧延伸。

公开(公告)号：US08115638B2

公开(公告)日：2012-02-14

申请号：US12392158

申请日：2009-02-25

申请人： Isao Sakama

发明人： Isao Sakama

IPC分类号： G08B13/14

CPC分类号： G06K19/07749

摘要： An RFID thread which is mounted on a sheet and whose predetermined information can be read wirelessly from outside, the RFID thread includes: an IC chip recording the predetermined information; a first antenna consisting of an electrically continuous conductor which has a length corresponding to a size of the sheet and on which one or a plurality of the IC chips are mounted; and a base film made of resin for supporting the first antenna.

摘要翻译： RFID线程安装在片材上，其预定信息可以从外部无线地读取，RFID线程包括：记录预定信息的IC芯片; 由电连续导体组成的第一天线，其长度对应于片材的尺寸，并且其上安装有一个或多个IC芯片; 以及由用于支撑第一天线的树脂制成的基膜。

公开(公告)号：US08035524B2

公开(公告)日：2011-10-11

申请号：US12039453

申请日：2008-02-28

申请人： Isao Sakama ,  Koichi Tachibana

发明人： Isao Sakama ,  Koichi Tachibana

IPC分类号： G08B13/14

CPC分类号： G06K19/07749 ,  G06K19/07756 ,  G06K19/0776 ,  G06K19/07794

摘要： In an RFID tag mounting package mounted with an RFID tag and a manufacturing method thereof, in order to have sufficient communication performance without spoiling the design property of the package to which a conductive film is applied, a package is obtained by assembling a structural material in which a metallic film is formed on a base material made of paper or the like. In the package, a slot is provided in the metallic film of a folded portion, in a spot where portions (the folded portion and an external packaging portion) of the structural material overlap each other. An inlet operates as an RFID tag, includes an antenna and an IC chip connected to the antenna, and is mounted on the inner surface of the folded portion in conformity with the position of the slot.

摘要翻译： 在安装有RFID标签的RFID标签安装封装及其制造方法中，为了具有足够的通信性能而不破坏施加导电膜的封装的设计特性，通过将结构材料组装在 在由纸等制成的基材上形成金属膜。 在封装中，在折叠部分的金属膜中，在结构材料的部分（折叠部分和外部包装部分）彼此重叠的位置处设置有槽。 入口作为RFID标签进行操作，包括天线和连接到天线的IC芯片，并且根据槽的位置安装在折叠部分的内表面上。

公开(公告)号：US07535365B2

公开(公告)日：2009-05-19

申请号：US11304776

申请日：2005-12-16

申请人： Isao Sakama ,  Minoru Ashizawa

发明人： Isao Sakama ,  Minoru Ashizawa

IPC分类号： G08B13/14

CPC分类号： H01Q19/22 ,  G06K7/10178 ,  G06K19/07749 ,  G06K19/07767 ,  G06K19/07786 ,  H01Q1/2225 ,  H01Q1/38

摘要： A radio frequency IC tag is provided which is excellent in weatherability, dustproofness, waterproofness, and static protection and capable of making a communication distance long even though each antenna section is made small in configuration. A first antenna equipped with an IC chip is formed on an upper surface of a first spacer. A second antenna is formed on a lower surface of a top cover. A second spacer is shaped in hollow form. The first spacer and the top cover are disposed on both sides of the second spacer with the first antenna and the second antenna being opposite to each other. Each of the first spacer, the second spacer and the top cover is formed of a synthetic resin. Thus, the IC chip and each antenna section are not exposed to the outside and hence weatherability is enhanced.

摘要翻译： 提供了一种射频IC标签，其耐候性，防尘性，防水性和静电保护性优异，并且即使每个天线部分的结构较小，也能够使通信距离变长。 配备有IC芯片的第一天线形成在第一间隔物的上表面上。 第二天线形成在顶盖的下表面上。 第二间隔件成形为中空形状。 第一间隔件和顶盖设置在第二间隔件的两侧，第一天线和第二天线彼此相对。 第一间隔件，第二间隔件和顶盖中的每个由合成树脂形成。 因此，IC芯片和每个天线部分不暴露于外部，因此耐候性提高。