Semiconductor storage device and method of fabricating the same
    1.
    发明申请
    Semiconductor storage device and method of fabricating the same 审中-公开
    半导体存储装置及其制造方法

    公开(公告)号:US20050083756A1

    公开(公告)日:2005-04-21

    申请号:US10971115

    申请日:2004-10-25

    摘要: A semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, a first gate wiring element 3a, 3b, a second gate wiring element 3c, 3d, a first connector 5a, 5b, and a second connector 5c, 5d. Each memory cell 10 has first and second sets having a driver transistor 11, a load transistor 12, and an access transistor 13. The word lines are arranged in parallel to each other along a first direction. The bit lines are arranged in parallel to each other along a second direction perpendicular to the first direction. The first gate wiring element comprises a gate electrode of the first driver transistor and the first load transistor, and has a rectangular shape having straight line on opposite sides. The second gate wiring element comprises a gate electrode of the access transistor and has a rectangular shape having straight line on opposite sides.

    摘要翻译: 半导体存储装置包括存储单元阵列,多个字线,多个位线,第一栅极布线元件3a,3b,第二栅极布线元件3c,3d,第一连接器5a, 5b和第二连接器5c,5d。 每个存储单元10具有第一和第二组,其具有驱动晶体管11,负载晶体管12和存取晶体管13.字线沿着第一方向彼此平行布置。 位线沿垂直于第一方向的第二方向彼此平行布置。 第一栅极布线元件包括第一驱动晶体管的栅电极和第一负载晶体管,并且具有在相对侧具有直线的矩形形状。 第二栅极布线元件包括存取晶体管的栅电极,并且具有在相对侧具有直线的矩形形状。

    SEMICONDUCTOR STORAGE DEVICE AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    SEMICONDUCTOR STORAGE DEVICE AND METHOD OF FABRICATING THE SAME 有权
    半导体存储装置及其制造方法

    公开(公告)号:US20120063213A1

    公开(公告)日:2012-03-15

    申请号:US13296956

    申请日:2011-11-15

    IPC分类号: G11C11/34 G11C11/00

    摘要: A semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, a first gate wiring element 3a, 3b, a second gate wiring element 3c, 3d, a first connector 5a, 5b, and a second connector 5c, 5d. Each memory cell 10 has first and second sets having a driver transistor 11, a load transistor 12, and an access transistor 13. The word lines are arranged in parallel to each other along a first direction. The bit lines are arranged in parallel to each other along a second direction perpendicular to the first direction. The first gate wiring element comprises a gate electrode of the first driver transistor and the first load transistor, and has a rectangular shape having straight line on opposite sides. The second gate wiring element comprises a gate electrode of the access transistor and has a rectangular shape having straight line on opposite sides.

    摘要翻译: 半导体存储装置包括存储单元阵列,多个字线,多个位线,第一栅极布线元件3a,3b,第二栅极布线元件3c,3d,第一连接器5a,5b和第二栅极布线元件 连接器5c,5d。 每个存储单元10具有第一和第二组,其具有驱动晶体管11,负载晶体管12和存取晶体管13.字线沿着第一方向彼此平行布置。 位线沿垂直于第一方向的第二方向彼此平行布置。 第一栅极布线元件包括第一驱动晶体管的栅电极和第一负载晶体管,并且具有在相对侧具有直线的矩形形状。 第二栅极布线元件包括存取晶体管的栅电极,并且具有在相对侧具有直线的矩形形状。

    SEMICONDUCTOR STORAGE DEVICE AND METHOD OF FABRICATING THE SAME
    4.
    发明申请
    SEMICONDUCTOR STORAGE DEVICE AND METHOD OF FABRICATING THE SAME 审中-公开
    半导体存储装置及其制造方法

    公开(公告)号:US20090034317A1

    公开(公告)日:2009-02-05

    申请号:US12237037

    申请日:2008-09-24

    IPC分类号: G11C17/12

    摘要: A semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, a first gate wiring element 3a, 3b, a second gate wiring element 3c, 3d, a first connector 5a, 5b, and a second connector 5c, 5d. Each memory cell 10 has first and second sets having a driver transistor 11, a load transistor 12, and an access transistor 13. The word lines are arranged in parallel to each other along a first direction. The bit lines are arranged in parallel to each other along a second direction perpendicular to the first direction. The first gate wiring element comprises a gate electrode of the first driver transistor and the first load transistor, and has a rectangular shape having straight line on opposite sides. The second gate wiring element comprises a gate electrode of the access transistor and has a rectangular shape having straight line on opposite sides.

    摘要翻译: 半导体存储装置包括存储单元阵列,多个字线,多个位线,第一栅极布线元件3a,3b,第二栅极布线元件3c,3d,第一连接器5a,5b和第二栅极布线元件 连接器5c,5d。 每个存储单元10具有第一和第二组,其具有驱动晶体管11,负载晶体管12和存取晶体管13.字线沿着第一方向彼此平行布置。 位线沿垂直于第一方向的第二方向彼此平行布置。 第一栅极布线元件包括第一驱动晶体管的栅电极和第一负载晶体管,并且具有在相对侧具有直线的矩形形状。 第二栅极布线元件包括存取晶体管的栅电极,并且具有在相对侧具有直线的矩形形状。

    SEMICONDUCTOR STORAGE DEVICE AND METHOD OF FABRICATING THE SAME
    5.
    发明申请
    SEMICONDUCTOR STORAGE DEVICE AND METHOD OF FABRICATING THE SAME 有权
    半导体存储装置及其制造方法

    公开(公告)号:US20100265752A1

    公开(公告)日:2010-10-21

    申请号:US12827668

    申请日:2010-06-30

    IPC分类号: G11C5/02

    摘要: A semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, a first gate wiring element 3a, 3b, a second gate wiring element 3c, 3d, a first connector 5a, 5b, and a second connector 5c, 5d. Each memory cell 10 has first and second sets having a driver transistor 11, a load transistor 12, and an access transistor 13. The word lines are arranged in parallel to each other along a first direction. The bit lines are arranged in parallel to each other along a second direction perpendicular to the first direction. The first gate wiring element comprises a gate electrode of the first driver transistor and the first load transistor, and has a rectangular shape having straight line on opposite sides. The second gate wiring element comprises a gate electrode of the access transistor and has a rectangular shape having straight line on opposite sides.

    摘要翻译: 半导体存储装置包括存储单元阵列,多个字线,多个位线,第一栅极布线元件3a,3b,第二栅极布线元件3c,3d,第一连接器5a,5b和第二栅极布线元件 连接器5c,5d。 每个存储单元10具有第一和第二组,其具有驱动晶体管11,负载晶体管12和存取晶体管13.字线沿着第一方向彼此平行布置。 位线沿垂直于第一方向的第二方向彼此平行布置。 第一栅极布线元件包括第一驱动晶体管的栅电极和第一负载晶体管,并且具有在相对侧具有直线的矩形形状。 第二栅极布线元件包括存取晶体管的栅电极,并且具有在相对侧具有直线的矩形形状。

    Semiconductor storage device and method of fabricating the same
    7.
    发明申请
    Semiconductor storage device and method of fabricating the same 审中-公开
    半导体存储装置及其制造方法

    公开(公告)号:US20070177416A1

    公开(公告)日:2007-08-02

    申请号:US11727040

    申请日:2007-03-23

    IPC分类号: G11C17/00

    摘要: A semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, a first gate wiring element 3a, 3b, a second gate wiring element 3c, 3d, a first connector 5a, 5b, and a second connector 5c, 5d. Each memory cell 10 has first and second sets having a driver transistor 11, a load transistor 12, and an access transistor 13. The word lines are arranged in parallel to each other along a first direction. The bit lines are arranged in parallel to each other along a second direction perpendicular to the first direction. The first gate wiring element comprises a gate electrode of the first driver transistor and the first load transistor, and has a rectangular shape having straight line on opposite sides. The second gate wiring element comprises a gate electrode of the access transistor and has a rectangular shape having straight line on opposite sides.

    摘要翻译: 半导体存储装置包括存储单元阵列,多个字线,多个位线,第一栅极布线元件3a,3b,第二栅极布线元件3c,3d,第一连接器5a, 5b和第二连接器5c,5d。 每个存储单元10具有第一和第二组,其具有驱动晶体管11,负载晶体管12和存取晶体管13.字线沿着第一方向彼此平行布置。 位线沿垂直于第一方向的第二方向彼此平行布置。 第一栅极布线元件包括第一驱动晶体管的栅电极和第一负载晶体管,并且具有在相对侧具有直线的矩形形状。 第二栅极布线元件包括存取晶体管的栅电极,并且具有在相对侧具有直线的矩形形状。

    Semiconductor storage device and method of fabricating the same
    8.
    发明授权
    Semiconductor storage device and method of fabricating the same 有权
    半导体存储装置及其制造方法

    公开(公告)号:US06812574B2

    公开(公告)日:2004-11-02

    申请号:US10190715

    申请日:2002-07-09

    IPC分类号: H01L2348

    摘要: A semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, a first gate wiring element 3a, 3b, a second gate wiring element 3c, 3d, a first connector 5a, 5b, and a second connector 5c, 5d. Each memory cell 10 has first and second sets having a driver transistor 11, a load transistor 12, and an access transistor 13. The word lines are arranged in parallel to each other along a first direction. The bit lines are arranged in parallel to each other along a second direction perpendicular to the first direction. The first gate wiring element comprises a gate electrode of the first driver transistor and the first load transistor, and has a rectangular shape having straight line on opposite sides. The second gate wiring element comprises a gate electrode of the access transistor and has a rectangular shape having straight line on opposite sides.

    摘要翻译: 半导体存储装置包括存储单元阵列,多个字线,多个位线,第一栅极布线元件3a,3b,第二栅极布线元件3c,3d,第一连接器5a,5b和第二栅极布线元件 连接器5c,5d。 每个存储单元10具有第一和第二组,其具有驱动晶体管11,负载晶体管12和存取晶体管13.字线沿着第一方向彼此平行布置。 位线沿垂直于第一方向的第二方向彼此平行布置。 第一栅极布线元件包括第一驱动晶体管的栅电极和第一负载晶体管,并且具有在相对侧具有直线的矩形形状。 第二栅极布线元件包括存取晶体管的栅电极,并且具有在相对侧具有直线的矩形形状。

    Semiconductor memory device having a capacitive plate to reduce soft errors
    9.
    发明授权
    Semiconductor memory device having a capacitive plate to reduce soft errors 有权
    具有用于减少软错误的电容板的半导体存储器件

    公开(公告)号:US06891743B2

    公开(公告)日:2005-05-10

    申请号:US10195381

    申请日:2002-07-16

    摘要: A CMOS-SRAM has a plurality of full CMOS type memory cells (1) and a capacity plate (2). The memory cells (1) are two-dimensionally arranged in the row direction and in the column direction. The capacity plate 2 adds an additional capacity to nodes ND1 and ND2 for storing data in order to reduce soft errors. The capacity plate (2) is common with the plurality of memory cells (1). The capacity plates (2) are separated by every column, that is in the row direction. The capacity plate (2) is connected to a power voltage line VDD so as to simplify the voltage supplying system. When a stand-by failure occurs in the memory cell (1) of a certain column, the memory cell (1) is replaced with a redundant memory cell.

    摘要翻译: CMOS-SRAM具有多个全CMOS型存储单元(1)和容量板(2)。 存储单元(1)在行方向和列方向上二维排列。 容量板2为节点ND 1和ND 2添加额外的容量以存储数据,以便减少软错误。 容量板(2)与多个存储单元(1)相同。 容量板(2)由行列方向分隔。 容量板(2)连接到电源电压线VDD,以简化供电系统。 当在某列的存储单元(1)中发生备用故障时,存储器单元(1)被替换为冗余存储单元。

    Semiconductor memory
    10.
    发明授权
    Semiconductor memory 失效
    半导体存储器

    公开(公告)号:US06781869B2

    公开(公告)日:2004-08-24

    申请号:US10327890

    申请日:2002-12-26

    IPC分类号: G11C1100

    摘要: A semiconductor memory having: a full CMOS-type of memory cell (10) including an n-type bulk access transistor (7, 8), an n-type bulk driver transistor (5, 6) and a p-type bulk load transistor (3, 4) by twos, and a charge capacitance adding charge capacitor element (9) connected to cell nodes (N1, N2) in order to secure a soft error resistance. In the semiconductor memory, an insulating film (14) and a conductive film (15) are directly formed on each upper side of first and second cell nodes (N1, N2) for constituting a charge capacitor element (9) for adding a charge capacitance. The insulating film (14) is held between the cell node (N1, N2) and the conductive film (15), covering both first and second cell nodes (N1, N2) in common.

    摘要翻译: 一种半导体存储器,其具有:包括n型体存取晶体管(7,8)的全CMOS型存储单元(10),n型体驱动晶体管(5,6)和p型体负载晶体管 (3,4),以及连接到单元节点(N1,N2)的充电电容添加电荷电容器元件(9),以确保软错误电阻。 在半导体存储器中,在构成充电电容元件(9)的第一和第二单元节点(N1,N2)的每个上侧直接形成绝缘膜(14)和导电膜(15),用于增加电荷电容 。 绝缘膜(14)保持在电池节点(N1,N2)和导电膜(15)之间,共同地覆盖第一和第二电池节点(N1,N2)。