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公开(公告)号：US5931001A
公开(公告)日：1999-08-03
申请号：US872193
申请日：1997-06-10
申请人： Hideo Watanabe , Motohiro Sakai , Fumikazu Kiya
发明人： Hideo Watanabe , Motohiro Sakai , Fumikazu Kiya
CPC分类号： F24F5/0042 , F24F2007/004
摘要： An air-conditioning ventilator is provided with an air inlet passage and an air outlet passage for ventilation and also with a heat exchanger making use of a thermoelectric module for effecting an exchange of heat with air flowing through one of the passages. At least one of a heat-absorbing system and a heat-dissipating system of the heat exchanger is provided with a heat-transfer-medium-circulating system so that a heat transfer medium is forced to circulate in a liquid form for performing the exchange of heat.
摘要翻译： 空气调节通风机设置有用于通风的进气通道和空气出口通道，并且还具有利用热电模块的热交换器，用于与流经其中一个通道的空气进行热交换。 热交换器的吸热系统和散热系统中的至少一个设置有传热介质循环系统，使得传热介质被迫以液体形式循环以进行交换 热。
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公开(公告)号：US5715684A
公开(公告)日：1998-02-10
申请号：US610347
申请日：1996-03-04
申请人： Hideo Watanabe , Yoshihiko Ogawa , Motohiro Sakai , Fumio Hisano , Hirohusa Tezuka , Fumikazu Kiya
发明人： Hideo Watanabe , Yoshihiko Ogawa , Motohiro Sakai , Fumio Hisano , Hirohusa Tezuka , Fumikazu Kiya
CPC分类号： F25B21/02 , H01L35/30 , F25B2321/023 , F25B2321/025
摘要： A thermoelectric converter is composed of a number of p-type semiconductor chips and n-type semiconductor chips arranged side by side and electrically connected in series, a heat-absorbing-side heat conductor arranged on a heat-absorbing side of the p-type and n-type semiconductor chips, a heat-dissipating-side heat conductor arranged on a heat-dissipating side of the p-type and n-type semiconductor chips, and a device for feeding a current to the p-type and n-type semiconductor chips. The current feeding device feeds a current of a density in a current density range selected depending on a thickness of said p-type and n-type semiconductor chips.
摘要翻译： 热电转换器由并排布置并串联电连接的多个p型半导体芯片和n型半导体芯片组成，布置在p型的吸热侧的吸热侧导热体 和n型半导体芯片，设置在p型和n型半导体芯片的散热侧的散热侧导热体，以及将电流馈送到p型和n型半导体芯片的装置 半导体芯片。 电流馈送装置馈送在根据所述p型和n型半导体芯片的厚度选择的电流密度范围内的密度电流。
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公开(公告)号：US06185941B1
公开(公告)日：2001-02-13
申请号：US09380060
申请日：2000-02-08
申请人： Hideo Watanabe , Fumikazu Kiya
发明人： Hideo Watanabe , Fumikazu Kiya
IPC分类号： F25B2102
CPC分类号： H01L35/30 , F25B2321/023 , H01L35/32
摘要： With an object to provide a thermoelectric converter excellent in performance, this invention provides a thermoelectric converter provided with a first thermal converter 1, a blocked second thermal conductor 2 connected to a predetermined position of the first conductor 1, a frame 6 made of a synthetic resin and surrounding the second conductor 2, a thermally-conductive substrate 5 with the frame 6 fixed at a basal end portion 8 thereof on the substrate and also with a group of thermoelectric elements 4 supported inside the substrate, and a heat-insulating layer 31 interposed between the first thermal conductor 1 and the thermally-conductive substrate 5 such that the frame 6 is surrounded at an outer periphery thereof by the heat-insulating layer. The second thermal conductor 2 and the thermally-conductive substrate 5 are opposing each other and are maintained in close contact with each other via the group of thermoelectric elements 4. The second thermal conductor 2 and the frame 6 are provided with an engaging flange 12, which prevents the second thermal conductor 2 from undergoing a displacement toward the first thermal conductor 1, and an engaged portion 9 which is in engagement with the engaging flange.
摘要翻译： 目的在于提供一种性能优异的热电转换器，本发明提供了一种热电转换器，其具有第一热转换器1，连接到第一导体1的预定位置的阻塞第二热导体2，由合成 树脂，并且围绕第二导体2，导热基板5，其框架6固定在基板的基端部8上，并且还具有支撑在基板内的一组热电元件4，以及绝热层31 插入在第一导热体1和导热基板5之间，使得框架6在其外周被绝热层包围。 第二热导体2和导热基板5彼此相对并且经由一组热电元件4彼此保持紧密接触。第二热导体2和框架6设置有接合凸缘12， 这防止第二导热体2朝向第一导热体1发生位移，以及与接合凸缘接合的被接合部分9。
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公开(公告)号：US5987892A
公开(公告)日：1999-11-23
申请号：US997819
申请日：1997-12-24
申请人： Hideo Watanabe , Fumikazu Kiya
发明人： Hideo Watanabe , Fumikazu Kiya
CPC分类号： A47G29/141 , F25B21/04 , A47G2029/147 , F25B2321/023 , F25D11/00
摘要： A storage box apparatus makes use of thermoelectric modules as devices for cooling or heating storage units, respectively. Each thermoelectric module is provided with a heat-dissipating-side base and a heat-absorbing-side base. A liquid heat transfer medium is spouted against a surface of the heat-dissipating-side base substantially at a right angle.
摘要翻译： 存储盒装置分别使用热电模块作为用于冷却或加热存储单元的装置。 每个热电模块设置有散热侧基座和吸热侧基座。 液体传热介质基本上以直角喷射到散热侧基座的表面上。
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5.发明授权
公开(公告)号：US5845497A
公开(公告)日：1998-12-08
申请号：US997817
申请日：1997-12-24
申请人： Hideo Watanabe , Fumikazu Kiya , Katsuhiro Tsuno
发明人： Hideo Watanabe , Fumikazu Kiya , Katsuhiro Tsuno
CPC分类号： H01L35/325 , F25B21/02 , H01L35/00 , F25B2321/023 , F25D11/00
摘要： An electric refrigerator is provided with a casing formed of a heat-insulating layer and defining an opening; a heat-insulating door for openably closing the opening of the casing; a thermal conductor arranged in the casing and provided with a heat-conducting surface located opposite an interior space in the casing; a Peltier device thermally connected with the thermal conductor; and a device power supply for feeding electric power to the Peltier device. The electric refrigerator is also provided with a control unit for controlling the device power supply so that, after the heat-insulating door is closed subsequent to opening thereof, the device power supply supplies the Peltier device with electric power controlled in a range of from 1.3 to 2 times as much rated electric power required to maintain a preset interior temperature of the casing.
摘要翻译： 电冰箱设置有由绝热层形成并限定开口的壳体; 绝热门，用于可开闭地封闭壳体的开口; 布置在所述壳体中并且设置有与所述壳体中的内部空间相对的导热表面的导热体; 与热导体热连接的珀耳帖装置; 以及用于向珀耳帖装置馈送电力的装置电源。 电冰箱还设置有用于控制设备电源的控制单元，使得在隔热门在其打开之后被关闭之后，设备电源向珀尔帖设备供电，其功率控制在1.3 是保持壳体的预设内部温度所需的额定功率的2倍。
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公开(公告)号：US6034317A
公开(公告)日：2000-03-07
申请号：US954894
申请日：1997-10-21
摘要： One of a heat-absorbing-side thermal conductor and a heat-dissipating-side thermal conductor is substantially in a form of a single piece. Plural groups of thermoelectric elements are arranged relative to the single-piece thermal conductor. Corresponding to the plural groups of thermoelectric elements, the other one of the heat-absorbing-side thermal conductor and the heat-dissipating-side thermal conductor is arranged in a form divided into a like number of pieces.
摘要翻译： 吸热侧热导体和散热侧热导体之一基本上为单件形式。 多组热电元件相对于单片导热体布置。 对应于多组热电元件，吸热侧热导体和散热侧热导体中的另一个以分割成相同数量的片的形式配置。
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公开(公告)号：US5927078A
公开(公告)日：1999-07-27
申请号：US969444
申请日：1997-11-13
申请人： Hideo Watanabe , Fumikazu Kiya
发明人： Hideo Watanabe , Fumikazu Kiya
CPC分类号： F25B21/02 , F25B2321/023 , F25D11/00 , F25D2400/30
摘要： A thermoelectric refrigerator is provided with a casing formed of a heat-insulating layer, thermal conductors arranged in the casing and having a heat transfer surface located facing a storage space in the casing, a Peltier device thermally connected with the thermal conductors, a device power supply for supplying electric power to the Peltier device, an interior fan for causing interior air to flow in the storage space, a fan power supply for supplying electric power to the interior fan, and a control unit for controlling a quantity of electric power to be supplied to the interior fan in accordance with a quantity of electric power to be supplied to the Peltier device.
摘要翻译： 热电冰箱设置有由隔热层形成的壳体，布置在壳体中的热导体，具有面向壳体中的存储空间的传热面，与热导体热连接的珀耳帖装置，装置功率 用于向珀耳帖装置供电的内部风扇，用于使内部空气流入存储空间的内部风扇，用于向内部风扇供电的风扇电源，以及用于控制电力量的控制单元 根据要提供给珀尔帖装置的电力量向内部风扇提供。
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公开(公告)号：US06038865A
公开(公告)日：2000-03-21
申请号：US895548
申请日：1997-07-16
申请人： Hideo Watanabe , Motohiro Sakai , Hirofusa Tezuka
发明人： Hideo Watanabe , Motohiro Sakai , Hirofusa Tezuka
CPC分类号： F25B21/02 , A23L3/36 , A23L3/365 , F25D11/00 , F25D2400/36 , F25D2700/16
摘要： A temperature-controlled appliance is provided with mutually-independent temperature-controlled compartments arranged close to each other. Each of the compartments comprises a casing formed of a heat-insulating layer, a thermal conductor arranged in the casing and provided with a heat-conducting surface located opposite a storage space in the casing, a Peltier device thermally connected with the thermal conductor, a power supply for feeding electric power to the Peltier device, and a controller for controlling electric power to be fed to the Peltier device so that a temperature in the casing is controlled.
摘要翻译： 温度控制器具具有相互独立的温度控制的隔间，彼此靠近设置。 每个隔室包括由绝热层形成的壳体，布置在壳体中的热导体，并且设置有与壳体中的存储空间相对的导热表面，与热导体热连接的珀耳帖装置， 用于向珀耳帖装置供电的电源，以及用于控制供给到珀耳帖装置的电力的控制器，从而控制壳体内的温度。
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公开(公告)号：US5956965A
公开(公告)日：1999-09-28
申请号：US951111
申请日：1997-10-15
申请人： Hideo Watanabe , Motohiro Sakai
发明人： Hideo Watanabe , Motohiro Sakai
CPC分类号： C02F1/04 , B01D5/0042 , F25B21/02 , F25D2331/806 , F25D31/002
摘要： A watercooler is provided with a vessel for storing water therein; a heater for boiling the water in the vessel; a pump for lifting the boiled water; a primary cooling unit (e.g., air-cooled heat exchanger tube and a fan) for subjecting to primary cooling the boiled water lifted by the pump; a secondary cooling unit (e.g., the fan, a heat-dissipating-side thermal conductor, a thermoelectric module, a heat-absorbing-side thermal conductor, and a cold water pipe) for subjecting the water, which has been subjected to the primary cooling, to secondary cooling by using the thermoelectric module; and a service unit for dispensing the cold water subsequent to the secondary cooling.
摘要翻译： 冷却器设有用于在其中储存水的容器; 用于煮沸容器中的水的加热器; 用于提起开水的泵; 用于对通过泵提升的开水进行一次冷却的主冷却单元（例如，风冷式热交换器管和风扇） 二次冷却单元（例如，风扇，散热侧热导体，热电模块，吸热侧导热体和冷水管），其经受了初级 冷却，通过使用热电模块进行二次冷却; 以及用于在二次冷却之后分配冷水的服务单元。
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10.发明授权
公开(公告)号：US5409547A
公开(公告)日：1995-04-25
申请号：US128697
申请日：1993-09-30
申请人： Hideo Watanabe , Motohiro Sakai , Fumio Hisano , Atsushi Osawa , Hirofusa Tezuka
发明人： Hideo Watanabe , Motohiro Sakai , Fumio Hisano , Atsushi Osawa , Hirofusa Tezuka
CPC分类号： H01L35/32 , H01L35/22 , H01L35/30 , F25B21/02 , F25B2321/023 , F25B2321/025 , F25B2321/0251 , F25D19/006
摘要： A thermoelectric cooling device for a thermoelectric refrigerator is described. The device is composed of p-type and n-type semiconductor layers, a first inner heat conductor, a first outer heat conductor, a second inner heat conductor, and a second outer heat conductor. The p-type and n-type semiconductor layers are electrically connected in series via the electrodes. The p-type and n-type semiconductor layers have a specific average thickness. The average figures of merit of the p-type and n-type semiconductor layers are controlled to a particular value. The thermal conductances of the first and second, inner and outer heat conductors fall within specific ranges, respectively. The coefficient of performance defined in terms of the ratio of the quantity of absorbed heat to inputted power is at least 0.6. Also described are a process for the fabrication of a semiconductor suitable for use in the thermoelectric cooling device and also a thermoelectric refrigerator using the thermoelectric cooling device.
摘要翻译： 描述了一种用于热电冰箱的热电冷却装置。 该器件由p型和n型半导体层，第一内部热导体，第一外部热导体，第二内部热导体和第二外部热导体构成。 p型和n型半导体层通过电极串联电连接。 p型和n型半导体层具有特定的平均厚度。 将p型和n型半导体层的平均品质因数控制在特定值。 第一和第二，内部和外部热导体的热导率分别落在特定范围内。 以吸热量与输入功率的比率定义的性能系数至少为0.6。 还描述了适用于热电冷却装置的半导体的制造方法以及使用该热电冷却装置的热电致冷器。
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