公开(公告)号：US09465383B2

公开(公告)日：2016-10-11

申请号：US14311856

申请日：2014-06-23

申请人： Hing Suen Siu ,  Yu Sze Cheung ,  Chi Wah Cheng ,  Chung Yan Lau

发明人： Hing Suen Siu ,  Yu Sze Cheung ,  Chi Wah Cheng ,  Chung Yan Lau

IPC分类号： G06F7/00 ,  G05B19/418

CPC分类号： G05B19/4182 ,  G05B2219/39106 ,  G05B2219/40554 ,  G05B2219/45031 ,  G05B2219/45054 ,  Y02P90/083

摘要： Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.

摘要翻译： 公开了一种处理电子部件的装置。 该装置包括：i）旋转装置和围绕旋转装置周向布置的多个拾取头，每个拾取头可操作以保持电子部件; ii）位置确定装置，用于确定由各个拾取头保持的电子部件的布置; iii）布置在由位置确定装置确定的指示电子部件的布置的位置的基准标记; iv）相对于基准标记布置的第一成像装置; 以及v）用于处理电子部件的至少一个处理装置。 具体地，第一成像装置可操作以捕获包括基准标记和至少一个处理装置的至少一个图像，使得至少一个处理装置的位置是可调节的，以使至少一个处理装置相对于 基于从由第一成像装置拍摄的至少一个图像得出的基准标记和至少一个处理装置之间的偏移，电子部件的布置。 还公开了一种调节用于处理电子部件的装置的至少一个处理装置的位置的方法。

公开(公告)号：US09261536B2

公开(公告)日：2016-02-16

申请号：US13584971

申请日：2012-08-14

申请人： Hing Suen Siu ,  Yu Sze Cheung ,  Chi Wah Cheng ,  Kai Fung Lau

发明人： Hing Suen Siu ,  Yu Sze Cheung ,  Chi Wah Cheng ,  Kai Fung Lau

IPC分类号： G01R31/20 ,  G01R31/02 ,  G01R31/26 ,  G01R31/302 ,  H01R11/18 ,  H01R13/00 ,  H05K1/00 ,  G01R1/067 ,  G01R1/04 ,  G01R1/073

CPC分类号： G01R1/06772 ,  G01R1/0416 ,  G01R1/07342

摘要： A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.

摘要翻译： 一种用于电子部件的测试装置包括安装块和布置在安装块上的多个接触条。 接触条被配置成使得电子部件的电引线可操作以在偏置方向上按压和弯曲接触片，以确保电子部件测试期间电引线和接触片之间的良好接触。 此外，位于安装块上的预加载块可操作以在电引线和接触片之间接触之前在偏压方向上接触并施加预接触力。

公开(公告)号：US09510460B2

公开(公告)日：2016-11-29

申请号：US14488691

申请日：2014-09-17

申请人： Yu Sze Cheung ,  Yan Yiu Lam

发明人： Yu Sze Cheung ,  Yan Yiu Lam

IPC分类号： B23P19/00 ,  H05K3/32

CPC分类号： H05K3/32 ,  H05K13/0413 ,  H05K13/0813 ,  Y10T29/53091 ,  Y10T29/53261

摘要： For aligning an electronic component to a required orientation, the electronic component is picked up and it is inspected while it is being held to determine its initial orientation. A précising mechanism is then rotated to correspond to the initial orientation of the electronic component. After the electronic component is secured on the précising mechanism in the initial orientation, the précising mechanism is rotated to align the electronic component to the required orientation. Thereafter, the electronic component that has been aligned to the required orientation may be picked up for further testing and/or processing.

摘要翻译： 为了将电子部件对准所需的方向，拾取电子部件，并且在保持电子部件以确定其初始取向时被检查。 然后将预制机构旋转以对应于电子部件的初始取向。 在初始方向将电子部件固定在加工机构上之后，旋转机构使电子部件对准所需的方位。 此后，可以拾取已经对准所需取向的电子部件进行进一步的测试和/或处理。

公开(公告)号：US06655045B2

公开(公告)日：2003-12-02

申请号：US09920016

申请日：2001-08-02

申请人： Yiu Ming Cheung ,  Pei Wei Tsai ,  Yu Sze Cheung

发明人： Yiu Ming Cheung ,  Pei Wei Tsai ,  Yu Sze Cheung

IPC分类号： F26B504

CPC分类号： H01L21/67034 ,  H01L21/68707 ,  Y10T83/2187

摘要： This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.