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    Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication
    1.
    发明申请
    Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication 审中-公开
    固态成像器件，半导体晶片，光学器件模块，固态成像器件制造方法和光学器件模块制造方法

    公开(公告)号：US20080277752A1

    公开(公告)日：2008-11-13

    申请号：US12218137

    申请日：2008-07-11

    申请人： Kazuya Fujita ,  Hiroaki Tsukamoto ,  Takashi Yasudome

    发明人： Kazuya Fujita ,  Hiroaki Tsukamoto ,  Takashi Yasudome

    IPC分类号： H01L31/0203

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： With the reduced size of a solid state imaging device, the invention provides: a solid state imaging device of a chip size and having good environmental durability; a semiconductor wafer used for fabricating a solid state imaging device; an optical device module incorporating a solid state imaging device; a method of solid state imaging device fabrication; and a method of optical device module fabrication. The solid state imaging device comprises: a solid state image pickup device formed on a semiconductor substrate; a light-transparent cover arranged opposite to an effective pixel region, so as to protect (the surface of) the effective pixel region formed in one surface of the solid state image pickup device against external environment; and an adhering section formed outside the effective pixel region in the one surface of the solid state image pickup device, so as to adhere the light-transparent cover and the solid state image pickup device.

    摘要翻译： 随着固态成像装置的尺寸减小，本发明提供了一种芯片尺寸并具有良好的环境耐久性的固态成像装置; 用于制造固态成像装置的半导体晶片; 包括固态成像装置的光学装置模块; 一种固态成像器件制造方法; 以及光学器件模块制造的方法。 固态成像装置包括：形成在半导体衬底上的固态图像拾取器件; 与有效像素区域相对布置的光透明盖，以防止形成在固态图像拾取装置的一个表面中的有效像素区域（表面）抵抗外部环境; 以及形成在固态图像拾取装置的一个表面中的有效像素区域外侧的粘附部分，以便粘附透光盖和固态图像拾取装置。

    Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication
    2.
    发明申请
    Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication 审中-公开
    固态成像器件，半导体晶片，光学器件模块，固态成像器件制造方法和光学器件模块制造方法

    公开(公告)号：US20070267712A1

    公开(公告)日：2007-11-22

    申请号：US11799258

    申请日：2007-04-30

    申请人： Kazuya Fujita ,  Hiroaki Tsukamoto ,  Takashi Yasudome

    发明人： Kazuya Fujita ,  Hiroaki Tsukamoto ,  Takashi Yasudome

    IPC分类号： H01L31/09

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： With the reduced size of a solid state imaging device, the invention provides: a solid state imaging device of a chip size and having good environmental durability; a semiconductor wafer used for fabricating a solid state imaging device; an optical device module incorporating a solid state imaging device; a method of solid state imaging device fabrication; and a method of optical device module fabrication. The solid state imaging device comprises: a solid state image pickup device formed on a semiconductor substrate; a light-transparent cover arranged opposite to an effective pixel region, so as to protect (the surface of) the effective pixel region formed in one surface of the solid state image pickup device against external environment; and an adhering section formed outside the effective pixel region in the one surface of the solid state image pickup device, so as to adhere the light-transparent cover and the solid state image pickup device.

    摘要翻译： 随着固态成像装置的尺寸减小，本发明提供了一种芯片尺寸并具有良好的环境耐久性的固态成像装置; 用于制造固态成像装置的半导体晶片; 包括固态成像装置的光学装置模块; 一种固态成像器件制造方法; 以及光学器件模块制造的方法。 固态成像装置包括：形成在半导体衬底上的固态图像拾取器件; 与有效像素区域相对布置的光透明盖，以防止形成在固态图像拾取装置的一个表面中的有效像素区域（表面）抵抗外部环境; 以及形成在固态图像拾取装置的一个表面中的有效像素区域外侧的粘附部分，以便粘附透光盖和固态图像拾取装置。

    Module for optical device, and manufacturing method therefor
    3.
    发明授权
    Module for optical device, and manufacturing method therefor 有权
    光学元件模块及其制造方法

    公开(公告)号：US07112864B2

    公开(公告)日：2006-09-26

    申请号：US10804666

    申请日：2004-03-18

    申请人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

    发明人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

    IPC分类号： H01L31/0203 ,  H01L31/062

    CPC分类号： G02B7/02 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/3025 ,  H04N5/2253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A module for an optical device being provided with a wiring substrate having a conductive wiring patterned thereon, a solid-state image sensor, a DSP for controlling the operation of the solid-state image sensor and processing a signal outputted from the same, and a lens holder being placed opposite to the solid-state image sensor and having a function of an optical path demarcating unit for demarcating the optical path to the solid-state image sensor, wherein a transparent cover bonded to the surface of the solid-state image sensor is joined to the lens holder at a joint portion. It is unnecessary to provide a focus adjuster for matching the optical distance between the lens and the solid-state image sensor with the focal length of the lens.

    摘要翻译： 一种用于光学装置的模块，其具有布置有图案化的导电布线的布线基板，固态图像传感器，用于控制固态图像传感器的操作的DSP以及处理从其输出的信号的DSP 透镜架放置在与固态图像传感器相对的位置，并且具有用于将光路划定到固态图像传感器的光路划分单元的功能，其中粘合到固态图像传感器的表面的透明盖 在接合部分处连接到透镜保持器。 不需要提供用于将透镜和固态图像传感器之间的光学距离与透镜的焦距进行匹配的焦点调节器。

    Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
    4.
    发明申请
    Semiconductor device, semiconductor module, and manufacturing method of semiconductor device 审中-公开
    半导体器件，半导体模块和半导体器件的制造方法

    公开(公告)号：US20060043544A1

    公开(公告)日：2006-03-02

    申请号：US11217582

    申请日：2005-08-31

    申请人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

    发明人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

    IPC分类号： H01L23/495

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： An imaging device as a semiconductor device includes a semiconductor substrate on which an imaging element is mounted, a light-transmitting lid section (covering section) arranged to face a light receiving section provided on one surface of the imaging element, and an adhesive layer arranged in an area excluding the light receiving section on the one surface of the imaging element for bonding between the semiconductor substrate and the lid section. The adhesive layer ranges from 10 g/(m2·24 h) to 200 g/(m2·24 h) in the water vapor permeability.

    摘要翻译： 作为半导体器件的成像器件包括其上安装有成像元件的半导体衬底，布置成面对设置在成像元件的一个表面上的光接收部分的透光盖部分（覆盖部分）和布置成 在除了用于在半导体衬底和盖部之间接合的成像元件的一个表面上的光接收部分的区域中。 粘合剂层的水蒸汽渗透性为10g /（m 2·2H 2·24h）至200g /（m 2·2H 2·24h）。

    Semiconductor device, manufacturing method of semiconductor device and module for optical device
    5.
    发明授权
    Semiconductor device, manufacturing method of semiconductor device and module for optical device 有权
    半导体器件，半导体器件的制造方法和光学器件的模块

    公开(公告)号：US07456483B2

    公开(公告)日：2008-11-25

    申请号：US11125661

    申请日：2005-05-09

    申请人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

    发明人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

    IPC分类号： H01L29/72

    CPC分类号： H01L27/14618 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A bond portion for bonding the principal plane of a solid-state imaging element with a transparent covering portion and configuring a hollow portion therebetween is provided with: a first opening end portion on the hollow portion side; a second opening end portion on the outer side; and a trap portion. The first opening end portion, the trap portion and the second opening end portion constitute a vent path. The vent path is shaped not to connect the first opening end portion with the second opening end portion linearly but to connect the opening end portions in the bond portion via the trap portion larger than the opening end portions.

    摘要翻译： 用于将固态成像元件的主平面与透明覆盖部分接合并构成中间部分的接合部分设置有：中空部分侧的第一开口端部; 外侧的第二开口端部; 和陷阱部分。 第一开口端部，捕获部和第二开口端部构成通气路径。 排气路径的形状不是使第一开口端部与第二开口端部直线连接，而是通过比开口端部大的收纳部连接接合部的开口端部。

    Solid-state imaging device
    8.
    发明申请
    Solid-state imaging device 审中-公开
    固态成像装置

    公开(公告)号：US20060197864A1

    公开(公告)日：2006-09-07

    申请号：US11359848

    申请日：2006-02-21

    申请人： Hiroaki Tsukamoto ,  Nobuhito Hirosumi ,  Takashi Yasudome ,  Kazuo Kinoshita

    发明人： Hiroaki Tsukamoto ,  Nobuhito Hirosumi ,  Takashi Yasudome ,  Kazuo Kinoshita

    IPC分类号： H04N5/225

    CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

    摘要： A solid-state imaging device which has a wiring substrate, a solid-state image sensor having a face opposite to a pixel area fixed to the wiring substrate, and a transparent cover fixed to the solid-state image sensor through an adhesive layer so as to oppose the pixel area of the solid-state image sensor. The wiring substrate has, on a side opposing the transparent cover, a cavity being provided with plural connecting terminals. The solid-state image sensor is fixed to a bottom face of the cavity in a state where the solid-state image sensor falls into the cavity. The connecting terminals of the cavity are connected with a connecting terminals of the solid-state image sensor, respectively through a wiring which falls into the cavity.

    摘要翻译： 一种固态成像装置，其具有布线基板，具有与固定到布线基板的像素区域相对的面的固态图像传感器，以及通过粘合层固定到固态图像传感器的透明盖， 以抵抗固态图像传感器的像素区域。 布线基板在与透明盖相对的一侧具有设置有多个连接端子的空腔。 在固态图像传感器落入空腔的状态下，固态图像传感器固定到空腔的底面。 空腔的连接端子分别通过落入空腔的布线与固态图像传感器的连接端子连接。

    Optical device module, and method of fabricating the optical device module
    9.
    发明申请
    Optical device module, and method of fabricating the optical device module 有权
    光器件模块及其制造方法

    公开(公告)号：US20060219884A1

    公开(公告)日：2006-10-05

    申请号：US11388531

    申请日：2006-03-23

    申请人： Hiroaki Tsukamoto ,  Nobuhito Hirosumi ,  Takashi Yasudome ,  Kazuo Kinoshita

    发明人： Hiroaki Tsukamoto ,  Nobuhito Hirosumi ,  Takashi Yasudome ,  Kazuo Kinoshita

    IPC分类号： H01J40/14 ,  H01J5/02

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.

    摘要翻译： 具有透镜的光路限定器被设置为与粘合到固态图像传感器的表面的透明盖接触，并且固定而不粘合。 此外，固定透明盖的固态图像传感器设置为与未透明盖接触的光路限定器，用作信号处理器的DSP，电路部分和布线板， 通过密封在合成树脂中固定。 即使当由于设置固态图像传感器的板上的翘曲，挠曲等而发生变形时，透镜相对于固态图像传感器的对准的精度也不会降低。 此外，固态图像传感器或信号处理器不会因外部冲击而损坏。

    Image sensor module with optical path delimiter and accurate alignment
    10.
    发明授权
    Image sensor module with optical path delimiter and accurate alignment 有权
    图像传感器模块，具有光路分隔符和精确对准

    公开(公告)号：US07397023B2

    公开(公告)日：2008-07-08

    申请号：US11388531

    申请日：2006-03-23

    申请人： Hiroaki Tsukamoto ,  Nobuhito Hirosumi ,  Takashi Yasudome ,  Kazuo Kinoshita

    发明人： Hiroaki Tsukamoto ,  Nobuhito Hirosumi ,  Takashi Yasudome ,  Kazuo Kinoshita

    IPC分类号： H01L27/00 ,  H01L27/14 ,  H01L23/12

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.

    摘要翻译： 具有透镜的光路限定器被设置为与粘合到固态图像传感器的表面的透明盖接触，并且固定而不粘合。 此外，固定透明盖的固态图像传感器设置为与未透明盖接触的光路限定器，用作信号处理器的DSP，电路部分和布线板， 通过密封在合成树脂中固定。 即使当由于设置固态图像传感器的板上的翘曲，挠曲等而发生变形时，透镜相对于固态图像传感器的对准的精度也不会降低。 此外，固态图像传感器或信号处理器不会因外部冲击而损坏。