-
公开(公告)号:US20130260137A1
公开(公告)日:2013-10-03
申请号:US13581750
申请日:2011-03-04
IPC分类号: B32B5/16
CPC分类号: B32B5/16 , C09J133/02 , C09J133/06 , C09J133/066 , Y10T428/254 , Y10T428/2982
摘要: An adhesive composition is disclosed that comprises acrylic adhesive particles having an average diameter of 10 to 100 micrometers obtained by suspension polymerization of an acrylic monomer mixture which comprises a branched C 14-22 alkyl group containing (meth)acrylate and a polar monomer. The adhesive composition may be applied to an adhesive dressing or patch. The adhesive has excellent water vapor permeability, excellent adhesion to skin with low skin irritation when applied, less adhesive residue after peeling, and less keratin damage. The adhesive does not cause wetness or peeling from sweat while being worn.
摘要翻译: 公开了一种粘合剂组合物,其包含通过包含含(甲基)丙烯酸酯的支链C 14-22烷基和极性单体的丙烯酸单体混合物的悬浮聚合获得的平均直径为10至100微米的丙烯酸粘合剂颗粒。 粘合剂组合物可以施加到粘合剂敷料或贴剂上。 粘合剂具有优异的水蒸气渗透性,对皮肤的优异粘附性,施用时皮肤刺激性低,剥离后残留粘合剂少,角蛋白损伤少。 粘合剂在穿着时不会引起湿气或脱汗。
-
公开(公告)号:US09333723B2
公开(公告)日:2016-05-10
申请号:US13581750
申请日:2011-03-04
IPC分类号: B32B5/16 , C09J133/06 , C09J133/02
CPC分类号: B32B5/16 , C09J133/02 , C09J133/06 , C09J133/066 , Y10T428/254 , Y10T428/2982
摘要: An adhesive composition is disclosed that comprises acrylic adhesive particles having an average diameter of 10 to 100 micrometers obtained by suspension polymerization of an acrylic monomer mixture which comprises a branched C 14-22 alkyl group containing (meth)acrylate and a polar monomer. The adhesive composition may be applied to an adhesive dressing or patch. The adhesive has excellent water vapor permeability, excellent adhesion to skin with low skin irritation when applied, less adhesive residue after peeling, and less keratin damage. The adhesive does not cause wetness or peeling from sweat while being worn.
摘要翻译: 公开了一种粘合剂组合物,其包含通过包含含(甲基)丙烯酸酯的支链C 14-22烷基和极性单体的丙烯酸单体混合物的悬浮聚合获得的平均直径为10至100微米的丙烯酸粘合剂颗粒。 粘合剂组合物可以施加到粘合剂敷料或贴剂上。 粘合剂具有优异的水蒸气渗透性,对皮肤的优异粘附性,施用时皮肤刺激性低,剥离后残留粘合剂少,角蛋白损伤少。 粘合剂在穿着时不会引起湿气或脱汗。
-
公开(公告)号:US09230873B2
公开(公告)日:2016-01-05
申请号:US14131827
申请日:2012-07-09
CPC分类号: H01L23/296 , C08K3/36 , C08K9/06 , C08L63/00 , H01L21/563 , H01L23/10 , H01L23/293 , H01L23/295 , H01L33/56 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92125 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
摘要翻译: 本发明的半导体封装树脂组合物包括环氧树脂,固化剂,无机颗粒,用含有光聚合官能团的硅烷表面处理的纳米颗粒和光聚合引发剂。
-
-