公开(公告)号：US20130014386A1

公开(公告)日：2013-01-17

申请号：US13543795

申请日：2012-07-07

申请人： Hiroshi Baba ,  Kenichi Oowada

发明人： Hiroshi Baba ,  Kenichi Oowada

IPC分类号： H05K3/30 ,  B05C11/00 ,  B05D5/12 ,  H05K13/04

CPC分类号： H05K3/3436 ,  H05K3/3484 ,  H05K3/3489 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/53183

摘要： A mounting apparatus including: a holding portion capable of holding and releasing an electronic component including a plurality of electrodes; a movement mechanism configured to move the holding portion; a coating portion in which a coating object to be applied onto the plurality of electrodes is set; and a controller configured to control the holding portion to hold the electronic component, control the movement mechanism to move the holding portion to a position above the coating portion, control the holding portion to release the electronic component above the coating portion so that the coating object is applied onto the electrodes, control the holding portion to hold the released electronic component again, control the movement mechanism to move the holding portion to a position above one of a substrate and another electronic component, and control the electronic component to be mounted on one of the substrate and the another electronic component.

摘要翻译： 一种安装设备，包括：保持部，其能够保持和释放包括多个电极的电子部件; 移动机构，其构造成移动所述保持部; 其中设置要施加到多个电极上的涂覆对象的涂覆部分; 以及控制器，其被配置为控制所述保持部分保持所述电子部件，控制所述移动机构将所述保持部移动到所述涂覆部分上方的位置，控制所述保持部分以将所述电子部件释放到所述涂覆部分上方， 控制保持部分再次保持释放的电子部件，控制移动机构将保持部分移动到基板和另一个电子部件之上的位置，并将要安装的电子部件控制在一个 的基板和另一个电子部件。