Embossed carrier tape
    1.
    发明授权
    Embossed carrier tape 失效
    压花载带

    公开(公告)号:US06176373B1

    公开(公告)日:2001-01-23

    申请号:US09024594

    申请日:1998-02-17

    IPC分类号: B65D8590

    CPC分类号: B65D73/02 H05K13/0084

    摘要: An embossed carrier tape capable of accurately accomplishing an automatic inspection of leads or the like of an electronic component by means of a camera. The carrier tape is formed with a plurality of receiving recesses in which electronic components are to be received, respectively. The receiving recesses are each formed at a lower portion of each of side surfaces thereof opposite to leads of the electronic component with an inclined surface. Such construction results in the leads being abutted against the inclined surface, to thereby be subjected to positional regulation if the electronic component is undesirably moved during inspection thereof. This permits a reflected image of the leads from the side surface of the receiving recess to be substantially separated from a directly-viewed image thereof during an inspection of the electronic component by image processing using a camera, to thereby ensure accurate judgment of any defect of the electronic component, such as bending of the leads or the like.

    摘要翻译: 能够通过照相机精确地实现电子部件的引线等的自动检查的压花载带。 载带形成有分别接收电子部件的多个容纳凹部。 接收凹部各自形成在与倾斜表面的电子部件的引线相对的每个侧表面的下部。 这种结构导致引线抵靠倾斜表面,从而如果电子部件在检查期间不期望地移动,则进行位置调节。 这允许通过使用照相机的图像处理在电子部件的检查期间从接收凹部的侧表面引出的引线的反射图像与其直接观看的图像基本上分离,从而确保准确地判断任何缺陷 电子部件,例如引线的弯曲等。

    Carrier tape and die apparatus for forming same
    2.
    发明授权
    Carrier tape and die apparatus for forming same 失效
    用于形成它的载带和模具装置

    公开(公告)号:US06179127B2

    公开(公告)日:2001-01-30

    申请号:US08950060

    申请日:1997-10-14

    IPC分类号: B65D8586

    CPC分类号: B65D73/02 H05K13/0084

    摘要: A carrier tape capable of being formed by means of a die apparatus readily manufactured and exhibiting increased durability. The carrier tape is formed thereon with a plurality of receiving recesses for respectively receiving semiconductor packages therein in a manner to be spaced from each other at predetermined intervals in a longitudinal direction thereof. The receiving recesses are each provided at four corners thereof with shelf sections in a manner to be expanded outwardly from an opening of the receiving recess in a plane direction, so that the shelf sections may have an increased area. The shelf sections act to support a periphery of a bottom surface of the semiconductor package thereon. The receiving recess is also provided with positioning sections for positioning the semiconductor package in the plane direction while keeping sides of the semiconductor package in contact therewith. The positioning sections are respectively arranged between an adjacent two of the shelf sections.

    摘要翻译: 能够通过容易制造并显示出增加的耐久性的模具装置形成的载带。 载体带上形成有多个容纳凹槽,用于分别以其沿其纵向方向以预定间隔彼此间隔开的方式分别容纳半导体封装。 接收凹部各自在其四个角处设置有搁板部分,从而在平面方向上从容纳凹部的开口向外扩展,使得搁板部分可以具有增加的面积。 搁板部分用于支撑半导体封装的底表面的周边。 接收凹部还设置有用于将半导体封装定位在平面方向上的定位部分,同时保持半导体封装的侧面与其接触。 定位部分分别设置在相邻的两个搁板部分之间。

    Photosensitive resin composition and cured film
    3.
    发明授权
    Photosensitive resin composition and cured film 有权
    感光树脂组合物和固化膜

    公开(公告)号:US09181381B2

    公开(公告)日:2015-11-10

    申请号:US13257989

    申请日:2010-03-24

    申请人: Yasuyuki Takao

    发明人: Yasuyuki Takao

    摘要: Disclosed is a photosensitive resin composition capable of displaying satisfactory patterning performance against an alkaline developer and yielding a cured film of a sufficiently low coefficient of linear thermal expansion. The photosensitive resin composition contains a photopolymerization initiator and a polyimide precursor obtained by the reaction of an ester-containing diamine such as 4-aminophenyl 4′-aminobenzoate, a biphenyl-based diamine such as 4,4′-diamino-2,2′-dimethylbiphenyl, and an unsaturated group-containing diamine such as 4,4′-diamino-2,2′-divinylbiphenyl with an acid anhydride such as pyromellitic dianhydride. The content of the structural unit derived from the unsaturated group-containing diamine in the polyimide precursor is 5-60 mol %.

    摘要翻译: 公开了能够对碱性显影剂显示令人满意的图案化性能并产生足够低的线性热膨胀系数的固化膜的感光性树脂组合物。 感光性树脂组合物含有光聚合引发剂和通过含酯二胺如4'-氨基苯甲酸4-氨基苯酯,联苯基二胺如4,4'-二氨基-2,2' 二甲基联苯和含不饱和基团的二胺如4,4'-二氨基-2,2'-二乙烯基联苯与酸酐如1,2,4,5-苯四酸二酐。 来自聚酰亚胺前体中的不饱和基团的二胺的结构单元的含量为5-60摩尔%。

    PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM
    4.
    发明申请
    PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM 有权
    感光树脂组合物和固化膜

    公开(公告)号:US20120015298A1

    公开(公告)日:2012-01-19

    申请号:US13257989

    申请日:2010-03-24

    申请人: Yasuyuki Takao

    发明人: Yasuyuki Takao

    IPC分类号: G03F7/038 C08G73/12

    摘要: Disclosed is a photosensitive resin composition capable of displaying satisfactory patterning performance against an alkaline developer and yielding a cured film of a sufficiently low coefficient of linear thermal expansion. The photosensitive resin composition contains a photopolymerization initiator and a polyimide precursor obtained by the reaction of an ester-containing diamine such as 4-aminophenyl 4′-aminobenzoate, a biphenyl-based diamine such as 4,4′-diamino-2,2′-dimethylbiphenyl, and an unsaturated group-containing diamine such as 4,4′-diamino-2,2′-divinylbiphenyl with an acid anhydride such as pyromellitic dianhydride. The content of the structural unit derived from the unsaturated group-containing diamine in the polyimide precursor is 5-60 mol %.

    摘要翻译: 公开了能够对碱性显影剂显示令人满意的图案化性能并产生足够低的线性热膨胀系数的固化膜的感光性树脂组合物。 感光性树脂组合物含有光聚合引发剂和通过含酯二胺如4'-氨基苯甲酸4-氨基苯酯,联苯基二胺如4,4'-二氨基-2,2' 二甲基联苯和含不饱和基团的二胺如4,4'-二氨基-2,2'-二乙烯基联苯与酸酐如1,2,4,5-苯四酸二酐。 来自聚酰亚胺前体中的不饱和基团的二胺的结构单元的含量为5-60摩尔%。