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1.发明授权公开(公告)号：US09514887B2
公开(公告)日：2016-12-06
申请号：US13508397
申请日：2010-11-11
申请人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
发明人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
IPC分类号： H01G9/008 , C25D1/04 , C25D3/44 , C25D7/06 , H01G9/04 , H01G11/68 , H01M4/13 , H01M4/66 , C25D15/00 , H01M10/0525
CPC分类号： H01G9/016 , C25D1/04 , C25D3/44 , C25D7/0614 , C25D15/00 , H01G9/04 , H01G11/68 , H01M4/13 , H01M4/661 , H01M4/663 , H01M4/665 , H01M4/666 , H01M10/0525 , Y02E60/122 , Y02E60/13 , Y02P70/54 , Y02T10/7011 , Y02T10/7022 , Y10T428/12431
摘要： An object of the present invention is to provide an aluminum foil that can make a positive electrode current collector thinner for size reduction and higher energy density of electrical storage devices, be produced easily and has a low surface resistance. An aluminum foil of the present invention as a means for achieving the object is characterized in that carbonaceous particles are dispersed and supported therein. The aluminum foil with carbonaceous particles dispersed and supported therein of the present invention can be produced by electrolysis.
摘要翻译： 本发明的目的在于提供一种铝箔，能够容易地制造容量减小的电极集电体较薄且能量密度较高的铝箔，并且具有低的表面电阻。 本发明的铝箔作为实现该目的的手段的特征在于碳质颗粒被分散和支撑在其中。 本发明的分散并负载有碳质粒子的铝箔可以通过电解制造。
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公开(公告)号：US09219279B2
公开(公告)日：2015-12-22
申请号：US13378174
申请日：2010-06-28
申请人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
发明人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
IPC分类号： H01M4/66 , C22C21/00 , C25D1/04 , H01G9/008 , H01G11/28 , H01G11/68 , H01G11/84 , C25D3/66 , C25D3/44 , C22B21/00 , H01G11/02 , H01G11/04
CPC分类号： H01M4/661 , C22B21/0038 , C22C21/00 , C25D1/04 , C25D3/44 , C25D3/665 , H01G9/016 , H01G11/02 , H01G11/04 , H01G11/28 , H01G11/68 , H01G11/84 , Y02E60/13 , Y10T428/266
摘要： An object of the present invention is to provide a method for producing a high-ductility, high-purity aluminum foil at a high film formation rate by electrolysis using a plating solution having a low chlorine concentration. A method for producing an aluminum foil of the present invention as a means for achieving the object is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution at least containing (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by a general formula: R1R2R3R4N.X (wherein R1 to R4 independently represent an alkyl group and X represents a counteranion for the quaternary ammonium cation), and then the film is removed from the substrate.
摘要翻译： 本发明的目的是提供一种通过使用具有低氯浓度的电镀液进行电解而以高成膜速度生产高延展性高纯度铝箔的方法。 本发明的铝箔的制造方法作为实现目的的方法，其特征在于，通过使用至少含有（1）二烷基砜的电镀液进行电解而在基板的表面上形成铝膜， 2）卤化铝，和（3）至少一种选自卤化铵，伯胺的卤化氢盐，仲胺的卤化氢盐，卤化氢盐， 叔胺和由下列通式表示的季铵盐：R1R2R3R4N.X（其中R1至R4独立地表示烷基，X表示季铵阳离子的抗衡阴离子），然后将膜从基材上除去。
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公开(公告)号：US08262893B2
公开(公告)日：2012-09-11
申请号：US12308684
申请日：2007-06-25
申请人： Hiroyuki Hoshi , Atsushi Okamoto , Setsuo Andou
发明人： Hiroyuki Hoshi , Atsushi Okamoto , Setsuo Andou
IPC分类号： C25D3/00
CPC分类号： C25D11/16 , C25D3/44 , C25D3/66 , C25D3/665 , Y10T428/1259 , Y10T428/12736 , Y10T428/12993
摘要： A plating film is provided with enough hardness before anodic oxidation, which is hard to be damaged during handling, and also the production method of the plating film. This problem can be solved by an aluminum plating film with aluminum concentration of 98 wt. % or lower, and with a Vickers hardness of 250 or higher. The hardness is increased by containing oxygen, carbon, sulfur, and a halogen element as impurities. The impurity concentration is controlled by adjusting the current density, the plating temperature, or the plating bath composition.
摘要翻译： 电镀膜在阳极氧化之前具有足够的硬度，在处理过程中难以损坏，以及镀膜的制造方法。 该问题可以通过铝浓度为98重量％的铝电镀膜来解决。 ％以下，维氏硬度为250以上。 通过含有氧，碳，硫和作为杂质的卤素元素来增加硬度。 通过调整电流密度，电镀温度或镀液组成来控制杂质浓度。
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公开(公告)号：US09267216B2
公开(公告)日：2016-02-23
申请号：US13883643
申请日：2011-11-10
申请人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
发明人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
IPC分类号： C25D3/44 , H01G11/30 , H01M4/66 , C25D1/04 , C25D5/50 , C25D7/06 , H01G9/00 , H01G11/22 , H01G11/84 , H01M10/052
CPC分类号： C25D3/44 , C25D1/04 , C25D5/50 , C25D7/0614 , H01G9/0032 , H01G11/22 , H01G11/30 , H01G11/84 , H01M4/661 , H01M10/052 , Y02E60/13 , Y10T428/12431
摘要： A method for producing an aluminum foil of the present invention is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation), then the film is separated from the substrate to obtain an aluminum foil, and the obtained aluminum foil is subjected to a heat treatment.
摘要翻译： 本发明的铝箔的制造方法的特征在于，使用含有至少（1）二烷基砜的电镀液，（2）卤化铝和 （3）至少一种选自卤化铵，伯胺的卤化氢盐，仲胺的卤化氢盐，叔胺的卤化氢盐和季铵盐的含氮化合物， 由以下通式表示的铵盐：R1R2R3R4N.X（R1至R4独立地表示烷基并且彼此相同或不同，X表示季铵阳离子的抗衡阴离子），然后将膜从 基板以获得铝箔，并将所获得的铝箔进行热处理。
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公开(公告)号：US09068270B2
公开(公告)日：2015-06-30
申请号：US13123760
申请日：2009-07-31
申请人： Hiroyuki Hoshi , Atsushi Okamoto
发明人： Hiroyuki Hoshi , Atsushi Okamoto
摘要： An object of the present invention is to provide an extended-life plating solution that allows an aluminum electroplating process to be performed stably for a long period of time, and also a method for forming an aluminum plating film using the same. An aluminum electroplating solution according to the present invention is characterized by comprising 1.5 to 4.0 mol of an aluminum halide per 10.0 mol of dimethyl sulfone and, relative to the aluminum halide, ammonium chloride in a molar ratio of 1/15 to 1/4 or a tetraalkylammonium chloride in a molar ratio of 1/15 to 1/2. The plating solution has improved electrical conductivity and thus has a further advantage in that it allows the formation of a uniform aluminum plating film on a substrate to be plated even when the plating process is performed by a barrel method.
摘要翻译： 本发明的目的在于提供一种使铝电镀工艺长时间稳定地实施的延长寿命的电镀液，以及使用其的形成铝电镀膜的方法。 根据本发明的铝电镀溶液的特征在于，相对于铝卤化物，摩尔比为1/15至1/4的氯化铵为1.5至4.0摩尔的铝卤化物，相对于10.0摩尔二甲基砜， 摩尔比为1/15至1/2的四烷基氯化铵。 电镀液具有提高的导电性，因此具有的另外的优点在于，即使通过桶法进行电镀处理，也能够在待镀的基板上形成均匀的铝电镀膜。
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公开(公告)号：US08586196B2
公开(公告)日：2013-11-19
申请号：US13567402
申请日：2012-08-06
申请人： Hiroyuki Hoshi , Atsushi Okamoto , Setsuo Andou
发明人： Hiroyuki Hoshi , Atsushi Okamoto , Setsuo Andou
CPC分类号： C25D11/16 , C25D3/44 , C25D3/66 , C25D3/665 , Y10T428/1259 , Y10T428/12736 , Y10T428/12993
摘要： A plating film is provided with enough hardness before anodic oxidation, which is hard to be damaged during handling, and also the production method of the plating film. This problem can be solved by an aluminum plating film with aluminum concentration of 98 wt. % or lower, and with a Vickers hardness of 250 or higher. The hardness is increased by containing oxygen, carbon, sulfur, and a halogen element as impurities. The impurity concentration is controlled by adjusting the current density, the plating temperature, or the plating bath composition.
摘要翻译： 电镀膜在阳极氧化之前具有足够的硬度，在处理过程中难以损坏，以及镀膜的制造方法。 该问题可以通过铝浓度为98重量％的铝电镀膜来解决。 ％以下，维氏硬度为250以上。 通过含有氧，碳，硫和作为杂质的卤素元素来增加硬度。 通过调整电流密度，电镀温度或镀液组成来控制杂质浓度。
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公开(公告)号：US20130224589A1
公开(公告)日：2013-08-29
申请号：US13883643
申请日：2011-11-10
申请人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
发明人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
CPC分类号： C25D3/44 , C25D1/04 , C25D5/50 , C25D7/0614 , H01G9/0032 , H01G11/22 , H01G11/30 , H01G11/84 , H01M4/661 , H01M10/052 , Y02E60/13 , Y10T428/12431
摘要： A method for producing an aluminum foil of the present invention is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation), then the film is separated from the substrate to obtain an aluminum foil, and the obtained aluminum foil is subjected to a heat treatment.
摘要翻译： 本发明的铝箔的制造方法的特征在于，使用含有至少（1）二烷基砜的电镀液，（2）卤化铝和 （3）至少一种选自卤化铵，伯胺的卤化氢盐，仲胺的卤化氢盐，叔胺的卤化氢盐和季铵盐的含氮化合物， 由以下通式表示的铵盐：R1R2R3R4N.X（R1至R4独立地表示烷基并且彼此相同或不同，X表示季铵阳离子的抗衡阴离子），然后将膜从 基板以获得铝箔，并将所获得的铝箔进行热处理。
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公开(公告)号：US20120251879A1
公开(公告)日：2012-10-04
申请号：US13508397
申请日：2010-11-11
申请人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
发明人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
CPC分类号： H01G9/016 , C25D1/04 , C25D3/44 , C25D7/0614 , C25D15/00 , H01G9/04 , H01G11/68 , H01M4/13 , H01M4/661 , H01M4/663 , H01M4/665 , H01M4/666 , H01M10/0525 , Y02E60/122 , Y02E60/13 , Y02P70/54 , Y02T10/7011 , Y02T10/7022 , Y10T428/12431
摘要： An object of the present invention is to provide an aluminum foil that can make a positive electrode current collector thinner for size reduction and higher energy density of electrical storage devices, be produced easily and has a low surface resistance. An aluminum foil of the present invention as a means for achieving the object is characterized in that carbonaceous particles are dispersed and supported therein. The aluminum foil with carbonaceous particles dispersed and supported therein of the present invention can be produced by electrolysis.
摘要翻译： 本发明的目的在于提供一种铝箔，能够容易地制造容量减小的电极集电体较薄且能量密度较高的铝箔，并且具有低的表面电阻。 本发明的铝箔作为实现该目的的手段的特征在于碳质颗粒被分散和支撑在其中。 本发明的分散并负载有碳质粒子的铝箔可以通过电解制造。
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公开(公告)号：US20120088153A1
公开(公告)日：2012-04-12
申请号：US13378174
申请日：2010-06-28
申请人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
发明人： Atsushi Okamoto , Hiroyuki Hoshi , Setsuo Andou
CPC分类号： H01M4/661 , C22B21/0038 , C22C21/00 , C25D1/04 , C25D3/44 , C25D3/665 , H01G9/016 , H01G11/02 , H01G11/04 , H01G11/28 , H01G11/68 , H01G11/84 , Y02E60/13 , Y10T428/266
摘要： An object of the present invention is to provide a method for producing a high-ductility, high-purity aluminum foil at a high film formation rate by electrolysis using a plating solution having a low chlorine concentration. A method for producing an aluminum foil of the present invention as a means for achieving the object is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution at least containing (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by a general formula: R1R2R3R4N.X (wherein R1 to R4 independently represent an alkyl group and X represents a counteranion for the quaternary ammonium cation), and then the film is removed from the substrate.
摘要翻译： 本发明的目的是提供一种通过使用具有低氯浓度的电镀液进行电解而以高成膜速度生产高延展性高纯度铝箔的方法。 本发明的铝箔的制造方法作为实现目的的方法，其特征在于，通过使用至少含有（1）二烷基砜的电镀液进行电解而在基板的表面上形成铝膜， 2）卤化铝，和（3）至少一种选自卤化铵，伯胺的卤化氢盐，仲胺的卤化氢盐，卤化氢盐， 叔胺和由下列通式表示的季铵盐：R1R2R3R4N.X（其中R1至R4独立地表示烷基，X表示季铵阳离子的抗衡阴离子），然后将膜从基材上除去。
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公开(公告)号：US20090301886A1
公开(公告)日：2009-12-10
申请号：US12308684
申请日：2007-06-25
申请人： Hiroyuki Hoshi , Atsushi Okamoto , Setsuo Andou
发明人： Hiroyuki Hoshi , Atsushi Okamoto , Setsuo Andou
CPC分类号： C25D11/16 , C25D3/44 , C25D3/66 , C25D3/665 , Y10T428/1259 , Y10T428/12736 , Y10T428/12993
摘要： A plating film is provided with enough hardness before anodic oxidation, which is hard to be damaged during handling, and also the production method of the plating film. This problem can be solved by an aluminum plating film with aluminum concentration of 98 wt. % or lower, and with a Vickers hardness of 250 or higher. Here, by containing oxygen, carbon, sulfur, and a halogen element as impurities, the hardness becomes higher. The impurity concentration is controlled by adjusting the current density, the plating temperature, or the plating bath composition.
摘要翻译： 电镀膜在阳极氧化之前具有足够的硬度，在处理过程中难以损坏，以及镀膜的制造方法。 该问题可以通过铝浓度为98重量％的铝电镀膜来解决。 ％以下，维氏硬度为250以上。 这里，通过含有氧，碳，硫和卤元素作为杂质，硬度变高。 通过调整电流密度，电镀温度或镀液组成来控制杂质浓度。
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