Extraneous substance inspection apparatus for patterned wafer
    3.
    发明授权
    Extraneous substance inspection apparatus for patterned wafer 失效
    用于图案化晶片的外来物质检查装置

    公开(公告)号:US5818576A

    公开(公告)日:1998-10-06

    申请号:US744454

    申请日:1996-11-07

    IPC分类号: G01N21/956 G01N21/89

    CPC分类号: G01N21/95607

    摘要: An extraneous substance inspection apparatus for a patterned wafer, according to the present invention, comprises an optical sensor having a plurality of detecting portions arranged to receive the scattering light corresponding to pixels and produce the detection signal corresponding to the respective pixels, a delay circuit responsive to the detection signal from the optical sensor for delaying the detection signal by a predetermined time and a judging circuit for judging an absence or presence of contaminant by comparing an output of the delay circuit with the detection signal from said optical sensor, wherein the wafer is inclined by a predetermined angle with respect to a direction parallel to the arranging direction of the detecting portions of the optical sensor and the predetermined time corresponds to a difference in scan time between a position of one pixel and substantially the same position as that of the one pixel in one chip of another pixel in another chip adjacent to that chip, the another pixel being determined corresponding to the predetermined angle in the X-Y scanning.

    摘要翻译: 根据本发明的用于图案化晶片的外来物质检查装置包括具有多个检测部分的光学传感器,所述检测部分布置成接收与像素相对应的散射光,并产生对应于各个像素的检测信号,响应于延迟电路 涉及来自光学传感器的检测信号,用于将检测信号延迟预定时间;以及判断电路,用于通过将延迟电路的输出与来自所述光学传感器的检测信号进行比较来判断是否存在污染物,其中晶片为 相对于与光学传感器的检测部分的排列方向平行的方向倾斜预定的角度,并且预定时间对应于在一个像素的位置和与一个像素的位置基本相同的位置之间的扫描时间差 像素在与另一个芯片相邻的另一个芯片中的另一个像素的一个芯片中 在X-Y扫描中,对应于预定角度确定另一个像素。

    Surface inspection method and apparatus
    4.
    发明授权
    Surface inspection method and apparatus 失效
    表面检查方法和装置

    公开(公告)号:US5694214A

    公开(公告)日:1997-12-02

    申请号:US768553

    申请日:1996-12-18

    IPC分类号: G01N21/88 G01N21/00

    CPC分类号: G01N21/8851

    摘要: A surface inspection apparatus of the present invention comprises an optical sensor having a plurality of detecting portions arranged in a sub-scan direction, the detecting portions being responsive to the scattering light for producing the detection signals correspondingly to respective pixels, a detection optical system including an objective lens and disposed between the optical sensor and the thing to be inspected, a projection optical system for irradiating the thing to be inspected with the laser beam having a cross sectional area large enough to cover the scattering light to be received by the plurality of the detecting portions through the detection optical system and an inspection device responsive to the detection signals for inspecting the surface of the thing to be inspected, wherein one of the detection optical system lens and the optical sensor is mounted such that a setting axis thereof is aligned in a plane perpendicular to an optical axis of the detection optical system lens with a light receiving direction which makes an angle with respect to the sub scan direction and in which shading is minimum.

    摘要翻译: 本发明的表面检查装置包括具有沿副扫描方向排列的多个检测部分的光学传感器,所述检测部分响应散射光,以对应于各个像素产生检测信号;检测光学系统,包括 物镜,设置在光学传感器和待检查物体之间;投影光学系统,用于用具有足够大的横截面积的激光束照射待检查的物体,以覆盖由多个 所述检测部分通过所述检测光学系统和检测装置,所述检查装置响应于用于检查被检查物体的表面的检测信号,其中所述检测光学系统透镜和所述光学传感器中的一个安装成使得其设定轴对准 在与检测光学系统的光轴垂直的平面中 具有相对于副扫描方向成角度并且其中阴影最小的光接收方向的m个透镜。

    Surface defect inspection device and shading correction method therefor
    8.
    发明授权
    Surface defect inspection device and shading correction method therefor 失效
    表面缺陷检查装置及其阴影校正方法

    公开(公告)号:US5880828A

    公开(公告)日:1999-03-09

    申请号:US898598

    申请日:1997-07-22

    IPC分类号: G01N21/94 G01N21/00

    CPC分类号: G01N21/94

    摘要: A surface defect inspection device according to the present invention is provided with an average value calculating means in which an article corresponding to an object to be inspected having a multiplicity of substantially uniformly distributed standard particles deposited thereon is scanned in a main scanning direction as a defect inspection object, detection values of the standard particles at every detecting pixel are obtained based on detection signals obtained from an optical sensor at respective scanning positions while assuming the standard particles as being defects and average values of every detecting pixel with regard to the detection values obtained at the respective scanning positions are calculated, and a shading correction means in which detection values of every detecting pixel obtained when the object to be inspected is inspected are subjected to shading correction for every detecting pixel based on the calculated average values of every detecting pixel.

    摘要翻译: 根据本发明的表面缺陷检查装置设置有平均值计算装置,其中与主要扫描方向上扫描具有沉积在其上的多个大致均匀分布的标准颗粒的待检查对象的物品作为缺陷 检测对象中,基于从各个扫描位置处的光学传感器获得的检测信号,将标准粒子作为缺陷而得到的各检测像素的标准粒子的检测值,以及所获取的检测值的每个检测像素的平均值 计算各扫描位置,并且根据所计算出的每个检测像素的平均值,对检测对象物检测出的每个检测像素的检测值进行阴影校正,对每个检测像素进行阴影校正。

    Extraneous substance inspection apparatus for patterned wafer
    9.
    发明授权
    Extraneous substance inspection apparatus for patterned wafer 失效
    用于图案化晶片的外来物质检查装置

    公开(公告)号:US5724132A

    公开(公告)日:1998-03-03

    申请号:US736582

    申请日:1996-10-24

    CPC分类号: G01R31/311 H01L22/12

    摘要: An extraneous substance inspection apparatus includes a level conversion circuit for converting a level of an extraneous substance detection signal obtained from a position in a first chip into one of multi-valued levels. A judging circuit determines the existence or absence of an extraneous substance by comparing a signal indicative of one of the multi-valued levels with another signal indicative of a converted level obtained by converting a detection signal detected at a similar position in another chip adjacent to the first chip.

    摘要翻译: 一种外来物质检查装置包括:电平转换电路,用于将从第一芯片中的位置获得的外来物质检测信号的电平转换为多值电平。 判断电路通过将指示多值电平之一的信号与表示通过转换在与其相邻的另一芯片中的相似位置处检测到的检测信号而获得的转换电平的另一信号进行比较来确定外来物质的存在或不存在 第一芯片