公开(公告)号：US20160072434A1

公开(公告)日：2016-03-10

申请号：US14846601

申请日：2015-09-04

Applicant: HITACHI, LTD.

Inventor： Yusuke WACHI ,  Ichiro SOMADA ,  Takao OKAZAKI

IPC: H03B5/12

CPC classification number: H03B5/24

Abstract: Provided is an amplifier with a test oscillator for a high frequency characteristic monitor, which has small power loss in a normal operation state and secures good noise performance while it is possible to equip both a transmitter IC and a receiver IC with the amplifier. In a high frequency IC including an amplifier including an inductive load and a test oscillator arranged in a same chip, the test oscillator commonly uses the inductive load of the amplifier, the amplifier has a bias voltage terminal to switch an operation state into an active state/inactive state, and the oscillator has a bias voltage terminal to switch an operation state into an active state/inactive state. In a test operation mode, the amplifier is inactivated and the test oscillator is activated and in a normal operation mode, the amplifier is activated and the test oscillator is inactivated.

Abstract translation: 提供了一种具有用于高频特性监测器的测试振荡器的放大器，其在正常操作状态下具有小的功率损耗并且确保良好的噪声性能，同时可以将发射器IC和接收器IC与放大器配合。 在包括具有感应负载的放大器和布置在同一芯片中的测试振荡器的高频IC中，测试振荡器通常使用放大器的感性负载，放大器具有偏置电压端子，以将操作状态切换到活动状态 /非活动状态，并且振荡器具有偏置电压端子，以将操作状态切换到活动状态/非活动状态。 在测试操作模式下，放大器失效，测试振荡器被激活，在正常工作模式下，放大器被激活，测试振荡器失效。

公开(公告)号：US20230394348A1

公开(公告)日：2023-12-07

申请号：US18115091

申请日：2023-02-28

Applicant: Hitachi, Ltd.

Inventor： Satoru AKIYAMA ,  Takeru UTSUGI ,  Yusuke WACHI ,  Satoshi MURAOKA

IPC: G06N10/40 ,  H05K7/20 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06N10/40 ,  H05K1/111 ,  H05K1/181 ,  H05K7/20272

Abstract: The invention addresses providing a technology that enables it to restrain a temperature rise because of current consumed by a quantum semiconductor and wiring conductors for control. A quantum calculator disclosed herein comprises a first refrigeration tube to cool a metal body; a refrigerator framing which encloses inside the metallic body and the first refrigeration tube; a quantum bit array chip having a plurality of silicon-spin quantum bits; and multiple control wiring conductors to drive the quantum bit array chip. The quantum bit array chip is placed on the metal body and made up of multiple regions and sub-regions, each of the regions performing a quantum operation independently. The multiple control wiring conductors are connected to the multiple regions and sub-regions respectively as multiple groups of control wiring conductors. The multiple control wring conductors are disposed across the first refrigeration tube.