QUANTUM COMPUTER AND CONTROL METHOD THEREFOR

    公开(公告)号:US20230409949A1

    公开(公告)日:2023-12-21

    申请号:US18115388

    申请日:2023-02-28

    Applicant: Hitachi, Ltd.

    CPC classification number: G06N10/40

    Abstract: One preferred aspect of the invention is a quantum computer of a semiconductor, including: a semiconductor crystalline substrate; a gate electrode array structure formed on a surface of the semiconductor crystalline substrate; and a reservoir unit that is a carrier supply unit, in which a classic potential barrier is formed in the semiconductor crystalline substrate by controlling an applied voltage to the gate electrode array structure, and a charge supplied from the reservoir unit is transported into the classic potential barrier.

    QUANTUM CALCULATOR
    2.
    发明公开
    QUANTUM CALCULATOR 审中-公开

    公开(公告)号:US20230394348A1

    公开(公告)日:2023-12-07

    申请号:US18115091

    申请日:2023-02-28

    Applicant: Hitachi, Ltd.

    CPC classification number: G06N10/40 H05K1/111 H05K1/181 H05K7/20272

    Abstract: The invention addresses providing a technology that enables it to restrain a temperature rise because of current consumed by a quantum semiconductor and wiring conductors for control. A quantum calculator disclosed herein comprises a first refrigeration tube to cool a metal body; a refrigerator framing which encloses inside the metallic body and the first refrigeration tube; a quantum bit array chip having a plurality of silicon-spin quantum bits; and multiple control wiring conductors to drive the quantum bit array chip. The quantum bit array chip is placed on the metal body and made up of multiple regions and sub-regions, each of the regions performing a quantum operation independently. The multiple control wiring conductors are connected to the multiple regions and sub-regions respectively as multiple groups of control wiring conductors. The multiple control wring conductors are disposed across the first refrigeration tube.

    IMAGING DEVICE
    3.
    发明申请
    IMAGING DEVICE 审中-公开

    公开(公告)号:US20190278006A1

    公开(公告)日:2019-09-12

    申请号:US16335290

    申请日:2017-05-17

    Applicant: Hitachi, Ltd.

    Abstract: This imaging device comprises: an image sensor which converts an optical image, captured by pixels arranged in an array on an imaging surface, into an image signal and outputs the image signal; a modulation unit which is provided to a light-receiving surface of the image sensor and modulates the intensity of light; and an image processing unit which carries out image processing on an output image output by the image sensor. The modulation unit has a grating substrate and a first grating pattern formed on a first surface of the grating substrate facing a surface of the image sensor near the light-receiving surface. The grating pattern is configured from a plurality of concentric circles having pitches which are inversely proportional to the distance from the origin point of at least one reference coordinate, the concentric circles do not overlap with each other within the grating pattern.

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