公开(公告)号：US20240400789A1

公开(公告)日：2024-12-05

申请号：US18698314

申请日：2022-09-22

Applicant: Hitachi Astemo, Ltd.

Inventor： Yasuhiro TSUYUKI ,  Akihiro NAMBA ,  Yoshio KAWAI

IPC: C08K3/28 ,  C08K7/18 ,  H05K7/20

Abstract: A heat dissipation material that has insulating properties and uses spherical fillers includes at least one of a filler having a particle size of 200 μm or more and 1000 μm or less and having a ratio of 20% or more and a filler having a particle size of 1 nm or more and 10 μm or less and having a ratio of 20% or more, with respect to the total amount of the fillers.

公开(公告)号：US20220361314A1

公开(公告)日：2022-11-10

申请号：US17619186

申请日：2020-06-12

Applicant: Hitachi Astemo, Ltd.

Inventor： Yasuhiro TSUYUKI ,  Toshiaki ISHII ,  Yoshio KAWAI

IPC: H05K1/02

Abstract: A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).

公开(公告)号：US20220394881A1

公开(公告)日：2022-12-08

申请号：US17776857

申请日：2020-11-20

Applicant: Hitachi Astemo, Ltd.

Inventor： Yasuhiro TSUYUKI ,  Yoshio KAWAI ,  Toshiaki ISHII ,  Eiichi IDE

IPC: H05K7/20 ,  H05K5/00

Abstract: The present invention provides an in-vehicle electronic control device which further improves heat dissipation by forming a protrusion extending toward an electronic component on an inner surface of a cover portion formed of a highly thermally conductive resin in consideration of orientation of a filling material contained in the highly thermally conductive resin. An in-vehicle electronic control device of the present invention includes: a circuit board on which an electronic component is mounted; a base portion in which the circuit board is installed; and a cover portion with which the circuit board is covered together with the base portion, which is formed of a resin containing a filling material, and which has a protrusion protruding toward the electronic component, in which the protrusion is formed of a resin containing a filling material and a width of the protrusion is smaller than a width of the electronic component.

公开(公告)号：US20240047231A1

公开(公告)日：2024-02-08

申请号：US18266405

申请日：2021-09-29

Applicant: HITACHI ASTEMO, LTD.

Inventor： Yasuhiro TSUYUKI ,  Nobutake TSUYUNO ,  Eiichi IDE ,  Yujiro KANEKO

IPC: H01L21/56 ,  H01L23/473 ,  H01L25/11 ,  H01L25/18 ,  H01L23/31

CPC classification number: H01L21/566 ,  H01L23/473 ,  H01L25/115 ,  H01L25/18 ,  H01L23/3121 ,  H01L24/32

Abstract: An electric circuit body including a power semiconductor element joined to one surface of a conductor plate; a sheet member including an insulating layer joined to the other surface of the conductor plate; a sealing member that integrally seals the sheet member, the conductor plate, and the power semiconductor element in a state where a surface of the sheet member opposite to a surface joined to the conductor plate is exposed; a cooling member that cools heat of the power semiconductor element; and a heat conduction member provided between the opposite surface of the sheet member and the cooling member, where the heat conduction member is provided over a first projection region facing the conductor plate and a second projection region facing the sealing member, and a thickness of the heat conduction member is thicker in the second projection region than in the first projection region.