公开(公告)号：US11339251B2

公开(公告)日：2022-05-24

申请号：US16314894

申请日：2017-07-04

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Yuki Nagai ,  Tetsuroh Irino ,  Yuusuke Kondou ,  Tomio Fukuda ,  Etsuo Mizushima ,  Takao Tanigawa

IPC: C08G73/10 ,  B32B15/08 ,  H05K1/03 ,  H05K3/46 ,  C08L35/00 ,  C08K5/3445 ,  C08K5/49 ,  B32B15/088 ,  C08K5/14 ,  C08K5/23 ,  C08L79/08

Abstract: The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

公开(公告)号：US11286346B2

公开(公告)日：2022-03-29

申请号：US15543078

申请日：2016-01-13

Applicant: Hitachi Chemical Company, LTD.

Inventor： Takao Tanigawa ,  Tetsuroh Irino ,  Yuusuke Kondou ,  Yuichi Shimayama ,  Etsuo Mizushima ,  Tomio Fukuda ,  Yuki Nagai ,  Hikari Murai

IPC: C08G73/10 ,  C08J5/24 ,  B32B27/34 ,  H05K3/46 ,  H05K1/03 ,  C08G73/12 ,  C08L79/08 ,  B32B27/28

Abstract: The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

公开(公告)号：US10957964B2

公开(公告)日：2021-03-23

申请号：US16069542

申请日：2016-07-20

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takao Tanigawa ,  Tetsurou Irino ,  Yuusuke Kondou ,  Etsuo Mizushima ,  Tomio Fukuda ,  Yuki Nagai

IPC: H01P3/08 ,  H05K1/02 ,  H01B7/08 ,  H01L23/12 ,  H05K1/03 ,  H05K3/46 ,  H01B11/00 ,  C08G65/333 ,  C08G73/12 ,  C08J5/24 ,  C08L79/08 ,  H01P11/00

Abstract: Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.