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公开(公告)号：US11339251B2
公开(公告)日：2022-05-24
申请号：US16314894
申请日：2017-07-04
发明人： Yuki Nagai , Tetsuroh Irino , Yuusuke Kondou , Tomio Fukuda , Etsuo Mizushima , Takao Tanigawa
IPC分类号： C08G73/10 , B32B15/08 , H05K1/03 , H05K3/46 , C08L35/00 , C08K5/3445 , C08K5/49 , B32B15/088 , C08K5/14 , C08K5/23 , C08L79/08
摘要： The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.
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公开(公告)号：US11286346B2
公开(公告)日：2022-03-29
申请号：US15543078
申请日：2016-01-13
发明人： Takao Tanigawa , Tetsuroh Irino , Yuusuke Kondou , Yuichi Shimayama , Etsuo Mizushima , Tomio Fukuda , Yuki Nagai , Hikari Murai
摘要： The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.
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公开(公告)号：US11359055B2
公开(公告)日：2022-06-14
申请号：US16676501
申请日：2019-11-07
发明人： Takao Tanigawa , Yasuyuki Mizuno , Tomio Fukuda , Yuki Nagai , Hikari Murai
IPC分类号： C08G73/10 , C08G65/333 , C08J5/24 , C08K5/51 , C08L63/00 , C08L71/12 , C08L79/04 , B32B27/00 , H05K1/03
摘要： Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
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公开(公告)号：US10907029B2
公开(公告)日：2021-02-02
申请号：US16318409
申请日：2017-07-19
发明人： Takao Tanigawa , Tetsuroh Irino , Minoru Kakitani , Kouji Morita
IPC分类号： B32B3/00 , C08K5/524 , C08K5/372 , B32B27/34 , H05K1/03 , B32B5/28 , C08L35/00 , B32B15/08 , C08K5/49 , C08K3/22 , C08J5/24 , C08K5/523 , C08K5/5313 , H05K1/02
摘要： The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free flame retardant.
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公开(公告)号：US11377546B2
公开(公告)日：2022-07-05
申请号：US16318726
申请日：2017-07-18
发明人： Takao Tanigawa , Tetsuroh Irino , Minoru Kakitani , Kouji Morita
IPC分类号： C08L39/04 , B32B15/08 , C08J5/18 , H05K1/03 , C08K5/3415 , C08L35/00 , B32B27/34 , C08L101/00
摘要： The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.
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公开(公告)号：US11041045B2
公开(公告)日：2021-06-22
申请号：US15570215
申请日：2016-04-28
发明人： Yuki Nagai , Yasuyuki Mizuno , Tomio Fukuda , Takao Tanigawa , Hikari Murai
IPC分类号： C08G65/333 , C08J5/24 , C08K5/3415 , C08L25/08 , C08L53/02 , C08L71/12 , B32B27/00 , C08K3/00 , C08L63/00 , C08G73/12 , C08L79/08 , C08L79/04 , C08K3/16 , C08L63/10
摘要： Provided are a resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a styrenic thermoplastic elastomer: wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
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公开(公告)号：US10957964B2
公开(公告)日：2021-03-23
申请号：US16069542
申请日：2016-07-20
发明人： Takao Tanigawa , Tetsurou Irino , Yuusuke Kondou , Etsuo Mizushima , Tomio Fukuda , Yuki Nagai
IPC分类号： H01P3/08 , H05K1/02 , H01B7/08 , H01L23/12 , H05K1/03 , H05K3/46 , H01B11/00 , C08G65/333 , C08G73/12 , C08J5/24 , C08L79/08 , H01P11/00
摘要： Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.
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公开(公告)号：US10519279B2
公开(公告)日：2019-12-31
申请号：US15570174
申请日：2016-04-28
发明人： Takao Tanigawa , Yasuyuki Mizuno , Tomio Fukuda , Yuki Nagai , Hikari Murai
IPC分类号： C08G73/10 , C08G65/333 , C08J5/24 , C08K5/51 , C08L63/00 , C08L71/12 , C08L79/04 , B32B27/00 , H05K1/03
摘要： Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
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公开(公告)号：US09828466B2
公开(公告)日：2017-11-28
申请号：US15301655
申请日：2015-04-06
发明人： Yasuyuki Mizuno , Tomio Fukuda , Takao Tanigawa , Yuki Nagai , Hikari Murai
IPC分类号： C08G65/48 , C08J5/24 , C08K3/00 , C08K5/3415 , C08L63/00 , C08L71/12 , H05K1/03 , C08L63/04 , C09D171/12 , C08G73/10
CPC分类号： C08G65/485 , C08G65/48 , C08G73/1071 , C08J5/24 , C08J2371/12 , C08J2400/24 , C08K3/00 , C08K5/3415 , C08L63/00 , C08L63/04 , C08L71/12 , C08L71/126 , C08L2201/02 , C08L2201/08 , C08L2203/20 , C09D171/12 , H05K1/0326 , H05K1/0373
摘要： A polyphenylene ether derivative having at least one N-substituted maleimide group represented by the following general formula (I) in a molecule, and a heat curable resin composition, a prepreg, a metal-clad laminate, and a multilayer printed wiring board, each of which uses the polyphenylene ether derivative: wherein R1 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, R2 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A1 represents a residual group represented by a specific general formula, m is an integer of 1 or more as the number of the structural unit, and x and y each is an integer of 1 to 4.
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