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12 条记录 (耗时 0.017 秒)

    Circuit for high frequency arc welding apparatus using a low frequency switch
    1.
    发明授权
    Circuit for high frequency arc welding apparatus using a low frequency switch 失效
    高频电弧焊机使用低频开关电路

    公开(公告)号：US4249063A

    公开(公告)日：1981-02-03

    申请号：US2002

    申请日：1979-01-09

    申请人： Hitoshi Kawano ,  Kiyoshi Ikemura ,  Mitsuhiro Hayashi

    发明人： Hitoshi Kawano ,  Kiyoshi Ikemura ,  Mitsuhiro Hayashi

    IPC分类号： B23K9/073 ,  B23K9/09

    CPC分类号： B23K9/092

    摘要： A circuit for a high frequency arc welding apparatus which can control the welding current by keeping the peak value, that is the amplitude of the pulse component, of the welding current waveform constant and improve operating efficiency and reliability. The circuit includes a D.C. electrical source for welding and a condenser for regenerating. The welding current is controlled by controlling the voltage of the condenser. A low frequency switch periodically discharges the condenser to limit the voltage of the condenser and to transfer the stored energy of the condenser to the electrical source.

    摘要翻译： 一种高频电弧焊接装置的电路，其可以通过保持焊接电流波形的峰值（即脉冲成分的振幅）恒定来提高操作效率和可靠性来控制焊接电流。 该电路包括用于焊接的直流电源和用于再生的冷凝器。 通过控制冷凝器的电压来控制焊接电流。 低频开关周期性地对冷凝器进行放电以限制冷凝器的电压并将冷凝器的储存能量传送到电源。

    Seam welding apparatus with edge detection
    2.
    发明授权
    Seam welding apparatus with edge detection 失效
    接缝焊接设备，边缘检测

    公开(公告)号：US4879445A

    公开(公告)日：1989-11-07

    申请号：US184551

    申请日：1988-04-14

    申请人： Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Yukio Yamamoto ,  Kunikatsu Ban

    发明人： Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Yukio Yamamoto ,  Kunikatsu Ban

    IPC分类号： B23K11/06 ,  B23K11/30

    CPC分类号： B23K11/309 ,  B23K11/063 ,  B23K2201/12

    摘要： An apparatus for seam welding is disclosed, in which a metal plate or a surface-clad metal plate in a cylindrical form with a strip-like overlap section S constituted by two overlapping edge portions is passed as process material 4 between pair roller electrodes 1 and 2 via upper and lower wire electrodes 3 for seam welding of the overlap section between the roller electrodes and also between the upper and lower wire electrodes 3 under pressure applied to the section, and also which is provided with a welding current source 8 for supplying a welding current between the roller electrodes 1 and 2. The apparatus comprises a detector disposed at a position 6a a line upstream of connecting the axes 1a and 1b of rotation of said roller electrodes for detecting at least the front end 4a said process material 4 and a control circuit 7 connected to the output side of the detector for counting the start and stop timings of supply of welding current to the roller electrodes 1 and 2 and instructing the start and stop of the welding current supply to the welding current source 8 according to the counted start and stop of the welding current supply to the welding current source 8 according to the counted start and stop timings.

    Wafer airtight keeping unit and keeping facility thereof
    5.
    发明授权
    Wafer airtight keeping unit and keeping facility thereof 失效
    晶圆密封单元及其保持设备

    公开(公告)号：US5303482A

    公开(公告)日：1994-04-19

    申请号：US826954

    申请日：1992-01-28

    申请人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi ,  Hiromi Morita

    发明人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi ,  Hiromi Morita

    IPC分类号： H01L21/677 ,  F26B21/06

    CPC分类号： H01L21/67769 ,  Y10S414/14

    摘要： A wafer keeping apparatus includes a closed wafer keeping space, and an arrangement for circulating an inert gas through a filter and then through the wafer keeping space. In one embodiment, several wafer keeping shelves are each provided within the space, and the inert gas is supplied through a respective filter to flow across each shelf. In another embodiment, a plurality of wafer keeping spaces are each accessible through a respective door which forms an airtight seal when it is closed, and respective filters are provided on opposite sides of the space, the inert gas being supplied to the space through one filter and exiting the space through the other filter. In a further embodiment, several of the wafer keeping spaces are provided at angularly and vertically spaced locations in a rotatable stocker body provided within a casing, and several vertically spaced doors are provided on the casing to provide access to respective wafer keeping spaces in the stocker body.

    摘要翻译： 晶片保存装置包括封闭的晶片保持空间，以及用于使惰性气体通过过滤器然后通过晶片保持空间循环的装置。 在一个实施例中，在该空间内分别提供几个晶片保持架，并且惰性气体通过相应的过滤器供应流过每个搁架。 在另一个实施例中，多个晶片保持空间各自可通过相应的门接近，门在关闭时形成气密密封，并且各个过滤器设置在空间的相对侧上，惰性气体通过一个过滤器 并通过另一个过滤器离开空间。 在另一个实施例中，几个晶片保持空间设置在设置在壳体内的可转动的储带架主体中的角度和垂直间隔的位置处，并且几个垂直间隔的门设置在壳体上以提供对存储器中的相应晶片保持空间的访问 身体。

    Electronic substrate processing system using portable closed containers
    6.
    发明授权
    Electronic substrate processing system using portable closed containers 失效
    电子基板处理系统采用便携式密闭容器

    公开(公告)号：US5746008A

    公开(公告)日：1998-05-05

    申请号：US803818

    申请日：1997-02-24

    申请人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Atsushi Okuno ,  Akio Nakamura

    发明人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Atsushi Okuno ,  Akio Nakamura

    IPC分类号： H01L21/00 ,  H01L21/677 ,  G26B19/00

    CPC分类号： H01L21/67757 ,  H01L21/67057 ,  H01L21/67769 ,  H01L21/67772

    摘要： Disclosed is an electronic substrate processing system comprising a processing equipment for processing electronic substrates including semiconductor wafers and liquid crystal substrates; a cleaning equipment for cleaning said electronic substrate in a predetermined processing step; a portable closed container for accommodating a cassette containing said electronic substrate; a purging station for gas-purging said portable closed containers; and a storage member for storing said portable closed containers, wherein said cassette accommodates said electronic substrates which have been cleaned by said cleaning equipment being set in said portable closed container and purged with an inert gas in said purging station, and said portable closed container or containers is stored in said storing section when necessary.

    摘要翻译： 公开了一种电子基板处理系统，包括用于处理包括半导体晶片和液晶基板的电子基板的处理设备; 用于在预定处理步骤中清洁所述电子基板的清洁设备; 用于容纳包含所述电子基板的盒的便携式密闭容器; 用于吹扫所述便携式密闭容器的清洗站; 以及用于存储所述便携式封闭容器的存储构件，其中所述盒容纳已经被所述清洁设备清洁的所述电子基板设置在所述便携式密闭容器中并在所述清洗站中用惰性气体吹扫，并且所述便携式密闭容器或 必要时将容器储存在所述储存部分中。

    ID recognizing system in semiconductor manufacturing system
    8.
    发明授权
    ID recognizing system in semiconductor manufacturing system 失效
    半导体制造系统中的识别识别系统

    公开(公告)号：US5389769A

    公开(公告)日：1995-02-14

    申请号：US037976

    申请日：1993-03-26

    申请人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi

    发明人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi

    IPC分类号： G06K17/00 ,  G06K19/10 ,  H01L21/02 ,  G06F15/46

    CPC分类号： G06K17/00 ,  G06K2017/0045 ,  G06K2017/0087

    摘要： An ID recognizing system for a semiconductor manufacturing system includes IC modules set in surfaces of containers which accommodate wafers and are conveyed from one device to another in the semiconductor manufacturing system. Each IC module is capable of transmitting and receiving signals from fixed stations and includes a reloadable memory. The semiconductor manufacturing system is made up of a number of devices for performing manufacturing operations on the wafers in the containers, and each of the devices include one of the fixed stations. The IC module is powered by the energy of radio waves received from the fixed station in the device in which said container has been placed for processing of the wafers therein. The radio communication is in the form of communication packets which include data on individual wafers in the cassettes so that the individual wafers can be processed separately. The position or off-set of the data within the packet indicates the position of the corresponding wafer within the container.

    摘要翻译： 用于半导体制造系统的ID识别系统包括设置在容纳晶片的容器的表面中的IC模块，并且在半导体制造系统中从一个装置传送到另一个装置。 每个IC模块能够从固定站发送和接收信号，并且包括可重新加载的存储器。 半导体制造系统由用于对容器中的晶片进行制造操作的多个装置组成，并且每个装置包括固定站之一。 IC模块由在其中已经放置所述容器用于处理其中的晶片的装置中的固定站接收的无线电波的能量供电。 无线电通信是通信分组的形式，其包括在盒中的单个晶片上的数据，使得可以单独处理各个晶片。 分组内的数据的位置或偏移指示了相应晶片在容器内的位置。