公开(公告)号：US5433574A

公开(公告)日：1995-07-18

申请号：US364003

申请日：1994-12-27

申请人： Hitoshi Kawano ,  Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Atsushi Okuno ,  Mitsuhiro Hayashi ,  Akio Nakamura

发明人： Hitoshi Kawano ,  Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Atsushi Okuno ,  Mitsuhiro Hayashi ,  Akio Nakamura

IPC分类号： F24F7/06 ,  B01L1/04 ,  B01L5/00 ,  B65G49/00 ,  H01L21/677 ,  B65B1/04

CPC分类号： B01L5/00 ,  B01L1/04 ,  Y10S414/14

摘要： A gas purge unit for a portable closed container is defined by a purge box including an opening, and a container stand around the opening on which a closed container is set; a gas supplying inlet coupled to a gas supplying source, and a gas discharging outlet; and a lifting mechanism for closing the opening from inside of the purge box and controlling the locking and unlocking operations of a locking mechanism provided in the lid of the container.

摘要翻译： 用于便携式密闭容器的气体净化单元由包括开口的清洗箱和围绕设置有密闭容器的开口的容器支架限定; 连接到气体供应源的气体供给入口和气体排出口; 以及用于从清洗箱内部关闭开口并控制设置在容器的盖中的锁定机构的锁定和解锁操作的提升机构。

公开(公告)号：US5363867A

公开(公告)日：1994-11-15

申请号：US6318

申请日：1993-01-21

申请人： Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi ,  Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Akio Nakamura

发明人： Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi ,  Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Akio Nakamura

IPC分类号： B08B9/093 ,  H01L21/677 ,  B08B3/00

CPC分类号： H01L21/67772 ,  B08B9/093 ,  H01L21/67769 ,  Y10S414/14

摘要： An article storage house in a clean room for airtightly accommodating a wafer cassette, etc. in which the wafer cassette carried in from the outside of an article carry-in/out portion is accommodated into a container by an automatic article delivery unit disposed in the article carry-in/out portion or it is carried in the article storage house while it is accommodated in the container and is stored in sections of the article storage house. An inert gas purge mechanism and an automatic container cleaning portion are disposed in the automatic article delivery unit or each section.

摘要翻译： 用于气密地容纳晶片盒等的洁净室中的物品存放室，其中从物品进/出部分的外部携带的晶片盒通过设置在所述物品输入/输出部分中的自动物品传送单元容纳在容器中 物品携带/退出部分，或者它在容纳在容器中并被存放在物品收纳室的部分中的情况下被携带在物品收纳室中。 惰性气体吹扫机构和自动容器清洁部分设置在自动物品输送单元或每个部分中。

公开(公告)号：US5621982A

公开(公告)日：1997-04-22

申请号：US329904

申请日：1994-10-27

申请人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Atsushi Okuno ,  Akio Nakamura

发明人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Atsushi Okuno ,  Akio Nakamura

IPC分类号： H01L21/68 ,  F26B21/14 ,  F26B25/00 ,  H01L21/00 ,  H01L21/677 ,  F26B19/00

CPC分类号： F26B21/14 ,  F26B25/001 ,  H01L21/67057 ,  H01L21/67769 ,  H01L21/67772

摘要： Disclosed is an electronic substrate processing system comprising a processing equipment for processing electronic substrates including semiconductor wafers and liquid crystal substrates; a cleaning equipment for cleaning said electronic substrate in a predetermined processing step; a portable closed container for accommodating a cassette containing said electronic substrate; a purging station for gas-purging said portable closed containers; and a storage member for storing said portable closed containers, wherein said cassette accommodates said electronic substrates which have been cleaned by said cleaning equipment being set in said portable closed container and purged with an inert gas in said purging station, and said portable closed container or containers is stored in said storing section when necessary.

摘要翻译： 公开了一种电子基板处理系统，包括用于处理包括半导体晶片和液晶基板的电子基板的处理设备; 用于在预定处理步骤中清洁所述电子基板的清洁设备; 用于容纳包含所述电子基板的盒的便携式密闭容器; 用于吹扫所述便携式密闭容器的清洗站; 以及用于存储所述便携式封闭容器的存储构件，其中所述盒容纳已经被所述清洁设备清洁的所述电子基板设置在所述便携式密闭容器中并在所述清洗站中用惰性气体吹扫，并且所述便携式密闭容器或 必要时将容器储存在所述储存部分中。

公开(公告)号：US5746008A

公开(公告)日：1998-05-05

申请号：US803818

申请日：1997-02-24

申请人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Atsushi Okuno ,  Akio Nakamura

发明人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Atsushi Okuno ,  Akio Nakamura

IPC分类号： H01L21/00 ,  H01L21/677 ,  G26B19/00

CPC分类号： H01L21/67757 ,  H01L21/67057 ,  H01L21/67769 ,  H01L21/67772

摘要： Disclosed is an electronic substrate processing system comprising a processing equipment for processing electronic substrates including semiconductor wafers and liquid crystal substrates; a cleaning equipment for cleaning said electronic substrate in a predetermined processing step; a portable closed container for accommodating a cassette containing said electronic substrate; a purging station for gas-purging said portable closed containers; and a storage member for storing said portable closed containers, wherein said cassette accommodates said electronic substrates which have been cleaned by said cleaning equipment being set in said portable closed container and purged with an inert gas in said purging station, and said portable closed container or containers is stored in said storing section when necessary.

摘要翻译： 公开了一种电子基板处理系统，包括用于处理包括半导体晶片和液晶基板的电子基板的处理设备; 用于在预定处理步骤中清洁所述电子基板的清洁设备; 用于容纳包含所述电子基板的盒的便携式密闭容器; 用于吹扫所述便携式密闭容器的清洗站; 以及用于存储所述便携式封闭容器的存储构件，其中所述盒容纳已经被所述清洁设备清洁的所述电子基板设置在所述便携式密闭容器中并在所述清洗站中用惰性气体吹扫，并且所述便携式密闭容器或 必要时将容器储存在所述储存部分中。

公开(公告)号：US08841572B2

公开(公告)日：2014-09-23

申请号：US13541889

申请日：2012-07-05

申请人： Daiei Iwamoto ,  Takashi Yuba ,  Koichi Kiryu ,  SeungSeok Beak ,  Akio Nakamura

发明人： Daiei Iwamoto ,  Takashi Yuba ,  Koichi Kiryu ,  SeungSeok Beak ,  Akio Nakamura

IPC分类号： H01H33/16 ,  H01H9/44 ,  H01H1/26 ,  H01H15/10 ,  H01H15/24 ,  H01H13/52

CPC分类号： H01H1/26 ,  H01H9/443 ,  H01H13/52 ,  H01H15/102 ,  H01H15/24

摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions configured to contact the first and second fixed contacting portions, respectively and provided to be adjacent from each other; and a magnet unit provided such that a first pole is positioned to face the first contacting portion and a second pole is positioned to face the second contacting portion to generate magnetic fields between the first fixed contacting portion and the first movable contacting portion and between the second fixed contacting portion and the second movable contacting portion, respectively.

摘要翻译： 开关装置包括第一和第二接触部分，第一和第二接触部分包括第一和第二固定接触部分，第一和第二可动接触部分分别被配置成接触第一和第二固定接触部分并被设置为彼此相邻; 以及设置成使得第一极定位成面对第一接触部分并且第二极被定位成面对第二接触部分以在第一固定接触部分和第一可动接触部分之间以及在第二接触部分之间产生磁场的磁体单元 固定接触部分和第二可动接触部分。

公开(公告)号：US20130037401A1

公开(公告)日：2013-02-14

申请号：US13541826

申请日：2012-07-05

申请人： Takashi Yuba ,  Daiei Iwamoto ,  SeungSeok Beak ,  Koichi Kiryu ,  Akio Nakamura

发明人： Takashi Yuba ,  Daiei Iwamoto ,  SeungSeok Beak ,  Koichi Kiryu ,  Akio Nakamura

IPC分类号： H01R13/70 ,  H01H33/20

CPC分类号： H01H13/52 ,  H01H1/24 ,  H01H9/44 ,  H01H9/46 ,  H01H15/102 ,  H01H15/24

摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions, respectively, the first fixed contacting portion and the second fixed contacting portion being configured to be electrically connected to one of a power source and an electronic device while the first movable contacting portion and the second movable contacting portion are configured to be electrically connected to the other of the power source and the electronic device; a first electric arc runner provided near at least one of the first fixed contacting portion and the first movable contacting portion; and a second electric arc runner provided near at least one of the second fixed contacting portion and the second movable contacting portion.

摘要翻译： 开关装置包括分别包括第一和第二固定接触部分以及第一和第二可动接触部分的第一和第二接触部分，第一固定接触部分和第二固定接触部分被构造成电连接到电源和 电子设备，同时第一可动接触部分和第二可动接触部分被配置为电连接到电源和电子设备中的另一个; 设置在第一固定接触部分和第一可动接触部分中的至少一个附近的第一电弧流道; 以及设置在第二固定接触部分和第二可动接触部分中的至少一个附近的第二电弧流道。

公开(公告)号：US07719516B2

公开(公告)日：2010-05-18

申请号：US10909329

申请日：2004-08-03

申请人： Noboru Fujii ,  Takashi Arita ,  Nobuyoshi Shimizu ,  Akio Nakamura ,  Shinichiro Akieda ,  Shigemi Kurashima

发明人： Noboru Fujii ,  Takashi Arita ,  Nobuyoshi Shimizu ,  Akio Nakamura ,  Shinichiro Akieda ,  Shigemi Kurashima

IPC分类号： G09G5/00

CPC分类号： H02K41/0354 ,  H02K2201/18

摘要： An actuator includes: a magnetic field generator that has different magnetic poles alternately arranged in a plane, with a predetermined position being the center of the magnetic poles; a coil holder that holds a plurality of coils that are radially arranged and face the magnetic field generator, relative motion being caused between the magnetic field generator and the coil holder; and an electromagnetic conversion unit that detects the relative motion and is mounted on either the magnetic field generator or the coil holder.

摘要翻译： 致动器包括：具有交替布置在平面中的不同磁极的磁场发生器，其中预定位置是磁极的中心; 保持径向布置并面对磁场发生器的多个线圈的线圈架，在磁场发生器和线圈架之间产生相对运动; 以及电磁转换单元，其检测相对运动并安装在磁场发生器或线圈架上。

公开(公告)号：US07663151B2

公开(公告)日：2010-02-16

申请号：US11587632

申请日：2005-04-13

申请人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

发明人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

IPC分类号： H01L33/00

CPC分类号： H01L33/22 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/30

摘要： A light emitting device chip is obtained by dicing a light emitting device wafer having a light emitting layer section 24 based on a double heterostructure in which a first-conductivity-type cladding layer 6, an active layer 5 and an second-conductivity-type cladding layer 4, each of which being composed of a compound semiconductor having a composition allowing lattice matching with GaAs, out of compound semiconductors expressed by formula (AlxGa1-x)yIn1-yP (where, 0≦x≦1, 0≦y≦1), are stacked in this order, and having the (100) surface appeared on the main surface thereof, and GaP transparent semiconductor layers 20, 90 stacked on the light emitting layer section 24 as being agreed with the crystal orientation thereof, so that the {100} surfaces appear on the side faces of the GaP transparent semiconductor layer. Accordingly, there can be provided a method of fabricating a light emitting device having the AlGaInP light emitting layer section and the GaP transparent semiconductor layers, less causative of failures such as edge chipping during the dicing.

摘要翻译： 通过基于双异质结构对具有发光层部分24的发光器件晶片进行切割来获得发光器件芯片，其中第一导电型包覆层6，有源层5和第二导电型包层 （Al x Ga 1-x）y In 1-y P表示的化合物半导体中的每一个由具有允许与GaAs晶格匹配的组成的化合物半导体构成，其中，0≤x≤1,0< y <= 1）按顺序堆叠，并且在其主表面上出现（100）表面，并且与发光层部分24堆叠在一起的GaP透明半导体层20,90与晶体取向一致 ，使得{100}表面出现在GaP透明半导体层的侧面上。 因此，可以提供一种制造具有AlGaInP发光层部分和GaP透明半导体层的发光器件的方法，其不利于在切割期间的边缘切屑等故障。

公开(公告)号：US07595557B2

公开(公告)日：2009-09-29

申请号：US11453827

申请日：2006-06-16

申请人： Kazumi Watase ,  Akio Nakamura ,  Katsumi Ootani

发明人： Kazumi Watase ,  Akio Nakamura ,  Katsumi Ootani

IPC分类号： H01L29/40

CPC分类号： H01L22/14 ,  G01R31/2853 ,  H01L23/3114 ,  H01L23/5228 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/00

摘要： A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal wire for inspection and the electrode for inspection electrically detect an open failure, a short-circuit failure and a leakage failure of the metal wire and a connection failure between an element electrode and the metal wire. A semiconductor wafer is subjected to an electrical test, so that it is possible to detect the aforementioned failures with good accuracy during a manufacturing process.

摘要翻译： 在不形成金属线和外部连接用电极的半导体基板的区域上形成检查用金属线和检查用电极。 用于检查的金属线和用于检查的电极电检测金属线的开路故障，短路故障和漏电故障以及元件电极和金属线之间的连接故障。 对半导体晶片进行电气测试，从而可以在制造过程中以高精度检测上述故障。

公开(公告)号：US07579205B2

公开(公告)日：2009-08-25

申请号：US11587635

申请日：2005-04-13

申请人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

发明人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L33/30 ,  H01L24/03 ,  H01L24/05 ,  H01L33/22 ,  H01L2224/48091 ,  Y10S438/964 ,  H01L2924/00014

摘要： A light emitting device wafer having a light emitting layer section 24 having an AlGaInP-base double heterostructure, and a GaP light extraction layer 20 disposed on the light emitting layer section so as to allow a first main surface thereof to compose a first main surface of the wafer is fabricated so that the first main surface of the GaP light extraction layer appears as the (100) surface. The first main surface of the GaP light extraction layer 20 composed of the (100) surface is etched using an etching solution for surface roughening to thereby form surface roughening projections 40f. Accordingly, there can be provided a method of fabricating a light emitting device having the GaP light extraction layer agreed with the (100) main surface, capable of readily subjecting the (100) main surface to surface roughening.

摘要翻译： 一种发光器件晶片，具有具有AlGaInP基双异质结构的发光层部分24和设置在发光层部分上的GaP光提取层20，以便允许其第一主表面组成第一主表面 制造晶片，使得GaP光提取层的第一主表面显示为（100）表面。 使用用于表面粗糙化的蚀刻溶液蚀刻由（100）表面构成的GaP光提取层20的第一主表面，从而形成表面粗糙化突起40f。 因此，可以提供一种制造具有与（100）主表面一致的GaP光提取层的发光器件的方法，能够容易地使（100）主表面粗糙化。