公开(公告)号：US5569545A

公开(公告)日：1996-10-29

申请号：US365081

申请日：1994-12-28

申请人： Hitoshi Yokono ,  Haruki Yokono ,  Masahiro Mikamo ,  Ryouichi Narushima ,  Takuya Iida ,  Yasuhiro Endo

发明人： Hitoshi Yokono ,  Haruki Yokono ,  Masahiro Mikamo ,  Ryouichi Narushima ,  Takuya Iida ,  Yasuhiro Endo

IPC分类号： H05K1/09 ,  B32B15/08 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/384 ,  B32B15/08 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/2063 ,  H05K2203/0723 ,  Y10T428/12569 ,  Y10T428/31696

摘要： A copper clad laminate having a bonded side ensuring powerful adhesion between the copper foil and insulating layer, without providing protrusions on the copper foil or making roughing treatment or black treatment, by designing such a configuration that the copper foil has a metal layer on the side to be bonded with the insulating layer and the metal layer and insulating layer are cross-linked with each other by chemical bonds through sulfur atoms. Further, there is provided a multilayer printed circuit board which has a bonded side ensuring a powerful adhesion of the circuit copper foil and insulating layer, by designing such a configuration that the alternating metal layers and insulating layers are cross-linked with each other by chemical bonds through sulfur atoms.

摘要翻译： 具有接合面的覆铜层压板通过设计铜箔在侧面具有金属层的结构，确保铜箔和绝缘层之间的强力粘附，而不在铜箔上提供突起或进行粗加工处理或黑色处理 与绝缘层接合，金属层和绝缘层通过硫原子的化学键彼此交联。 此外，提供了一种多层印刷电路板，其具有通过设计使得交替金属层和绝缘层通过化学物质彼此交联的结构，从而确保电路铜箔和绝缘层的强力粘合的接合侧 通过硫原子键合。

公开(公告)号：US5061550A

公开(公告)日：1991-10-29

申请号：US466983

申请日：1990-01-18

申请人： Kazunao Shimizu ,  Masahiro Mikamo ,  Takeshi Yamagishi

发明人： Kazunao Shimizu ,  Masahiro Mikamo ,  Takeshi Yamagishi

IPC分类号： H01C7/00 ,  C23C22/24 ,  H05K1/09 ,  H05K1/16 ,  H05K3/38

CPC分类号： H05K1/167 ,  C23C22/24 ,  H05K3/389 ,  C23C2222/20 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K3/382 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31 ,  Y10T428/31678

摘要： An article of manufacture in form of a multilayer material includes(a) a conductive layer made of an electrically highly conductive material,(b) a resistance layer formed on the conductive layer, the resistance layer being made of an electrical resistance material,(c) a chromate treatment layer formed on the resistance layer, the chromate treatment layer being formed on the resistance layer by subjecting the surface of the resistance layer to a chromate treatment and containing chromium in an amount of 5 to 120 .mu.g per 1 dm.sup.2 of the chromate treatment layer and,(d) a silane coupling agent layer formed on the chromate treatment layer, the silane coupling agent layer being formed by applying a solution of a silane coupling agent to the surface of the chromate layer followed by drying. The concentration of the silane coupling agent in the solution is 0.001 to 5% by weight.A multilayer board having a resistance layer for the manufacture of printed circuit boards is produced by laminating the multilayer material and an insulating support.

摘要翻译： 形成多层材料的制品包括（a）由导电性高的材料制成的导电层，（b）形成在导电层上的电阻层，电阻层由电阻材料制成，（c ）形成在所述电阻层上的铬酸盐处理层，所述铬酸盐处理层通过对所述电阻层的表面进行铬酸盐处理而形成在所述电阻层上，所述铬酸盐处理层的含量为每1 dm2的5〜120μg 铬酸盐处理层和（d）在铬酸盐处理层上形成的硅烷偶联剂层，通过将硅烷偶联剂溶液施加到铬酸盐层的表面，随后干燥而形成硅烷偶联剂层。 溶液中硅烷偶联剂的浓度为0.001〜5重量％。 通过层叠多层材料和绝缘支架，制造具有用于制造印刷电路板的电阻层的多层板。