Semiconductor light emitting device and method of manufacturing the same
    2.
    发明申请
    Semiconductor light emitting device and method of manufacturing the same 失效
    半导体发光器件及其制造方法

    公开(公告)号:US20090001398A1

    公开(公告)日:2009-01-01

    申请号:US12155877

    申请日:2008-06-11

    IPC分类号: H01L33/00

    CPC分类号: H01L33/12 H01L33/16 H01L33/22

    摘要: There are provided a semiconductor light emitting device that can be manufactured by a simple process and has excellent light extraction efficiency and a method of manufacturing a semiconductor light emitting device that has high reproducibility and high throughput. A semiconductor light emitting device having a substrate and a lamination in which a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer are sequentially laminated onto the substrate according to an aspect of the invention includes a silica particle layer; and an uneven part formed at a lower part of the silica particle layer.

    摘要翻译: 提供了可以通过简单的工艺制造并且具有优异的光提取效率的半导体发光器件和制造具有高再现性和高生产量的半导体发光器件的方法。 根据本发明的一个方面,具有基板和叠层体的半导体发光器件依次层叠在基板上,其中第一导电型半导体层,有源层和第二导电类型半导体层包括二氧化硅颗粒层; 以及形成在二氧化硅粒子层的下部的不平坦部。