Fabrication and bonding of copper sputter targets
    1.
    发明授权
    Fabrication and bonding of copper sputter targets 有权
    铜溅射靶的制造和接合

    公开(公告)号:US06478902B2

    公开(公告)日:2002-11-12

    申请号:US09730349

    申请日:2000-12-05

    IPC分类号: C22F108

    CPC分类号: C22F1/08 C23C14/3414

    摘要: The method is used to fabricate pure copper sputter targets. It includes first heating a copper billet to a temperature of at least 500° C. The copper billet has a purity of at least 99.99 percent. Then warm working the copper billet applies at least 40 percent strain. Cold rolling the warm worked copper billet then applies at least 40 percent strain and forms a copper plate. Finally, annealing the copper plate at a temperature above about 250° C. forms a target blank. The target blank has equiaxed grains having an average grain size of less than 40 &mgr;m. The grains of the target blank have (111), (200), (220) and (311) orientations with the amount of the grains having each of the orientations being less than 50 percent.

    摘要翻译: 该方法用于制造纯铜溅射靶。 它包括首先将铜坯加热到至少500℃的温度。铜坯的纯度至少为99.99%。 然后温暖的工作,铜坯应用至少40%的应变。 冷轧热加工铜坯,然后施加至少40%的应变并形成铜板。 最后,在高于约250℃的温度下对铜板进行退火,形成目标空白。 目标坯料具有平均粒度小于40μm的等轴晶粒。 目标坯料的晶粒具有(111),(200),(220)和(311)取向,其中每个取向的晶粒的量小于50%。

    Method of bonding a sputtering target to a backing plate
    2.
    发明授权
    Method of bonding a sputtering target to a backing plate 有权
    将溅射靶接合到背板的方法

    公开(公告)号:US6164519A

    公开(公告)日:2000-12-26

    申请号:US349285

    申请日:1999-07-08

    IPC分类号: C23C14/34 B23K20/08

    CPC分类号: C23C14/3407

    摘要: There is provided a method of forming a high strength atomic bond between a sputter target and backing plate such that the microstructural characteristics of the sputter target material obtained by prior processing is not altered by the bonding process. There is further provided a method for bonding the target to the backing plate and forming a bonded target/backing plate assembly having a greater target thickness for increased sputtering life, while maintaining the overall standard dimensions set by industry standards.

    摘要翻译: 提供了一种在溅射靶和背板之间形成高强度原子键的方法,使得通过先前处理获得的溅射靶材的微结构特性不会因接合过程而改变。 还提供了一种用于将靶材结合到背板并形成具有更大目标厚度的粘合靶/背板组件以提高溅射寿命的方法,同时保持由工业标准确定的总体标准尺寸。

    Porous beta-tricalcium phosphate granules for regeneration of bone tissue
    3.
    发明申请
    Porous beta-tricalcium phosphate granules for regeneration of bone tissue 有权
    用于骨组织再生的多孔β-tricalcium磷酸盐颗粒

    公开(公告)号:US20060292198A1

    公开(公告)日:2006-12-28

    申请号:US11093429

    申请日:2005-03-29

    IPC分类号: A61K33/42

    摘要: A porous β-tricalcium phosphate material for bone implantation is provided. The multiple pores in the porous TCP body are separate discrete voids and are not interconnected. The pore size diameter is in the range of 20-500 μm, preferably 50-125 μm. The porous β-TCP material provides a carrier matrix for bioactive agents and can form a moldable putty composition upon the addition of a binder. Preferably, the bioactive agent is encapsulated in a biodegradable agent. The invention provides a kit and an implant device comprising the porous β-TCP, and a bioactive agent and a binder. The invention also provides an implantable prosthetic device comprising a prosthetic implant having a surface region, a porous β-TCP material disposed on the surface region and optionally comprising at least a bioactive agent or a binder. Methods of producing the porous β-TCP material and inducing bone formation are also provided.

    摘要翻译: 提供了用于骨植入的多孔β-磷酸三钙材料。 多孔TCP体中的多个孔是分离的离散空隙并且不互连。 孔径直径在20-500μm的范围内,优选为50-125μm。 多孔β-TCP材料提供用于生物活性剂的载体基质,并且可以在添加粘合剂时形成可成型的油灰组合物。 优选地,将生物活性剂包封在生物降解剂中。 本发明提供了一种试剂盒和植入装置,其包含多孔β-TCP,以及生物活性剂和粘合剂。 本发明还提供了一种植入式假体装置,其包括具有表面区域的假体植入物,设置在所述表面区域上的多孔β-TCP材料,并且任选地至少包含生物活性剂或粘合剂。 还提供了生产多孔β-TCP材料并诱导骨形成的方法。

    Fabrication of clad hollow cathode magnetron sputter targets
    4.
    发明授权
    Fabrication of clad hollow cathode magnetron sputter targets 有权
    包覆空心阴极磁控溅射靶的制作

    公开(公告)号:US06283357B1

    公开(公告)日:2001-09-04

    申请号:US09368062

    申请日:1999-08-03

    IPC分类号: B21D3900

    摘要: A method is provided for forming clad hollow cathode magnetron sputter targets that are lighter in weight and/or less expensive than monolithic targets. A plate of sputter target material is bonded to a sheet of cladding material that is lighter in weight and/or less expensive than the sputter target material. This clad target assembly is then formed into a hollow cathode magnetron sputter target, such as by deep drawing. The clad hollow cathode magnetron further provides greater percent utilization of sputter target material than monolithic targets.

    摘要翻译: 提供了一种形成包覆中空阴极磁控溅射靶的方法,其重量轻且/或比单片靶材更便宜。 溅射靶材料的板被结合到比溅射靶材料重量更轻和/或更便宜的包覆材料片上。 然后将该包覆靶组件例如通过深冲制成中空阴极磁控溅射靶。 包层空心阴极磁控管进一步提供比单片靶更高的溅射靶材料利用率。