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公开(公告)号:US20240172944A1
公开(公告)日:2024-05-30
申请号:US18025168
申请日:2022-09-02
Applicant: HONOR DEVICE CO., LTD.
Inventor: Chao YAO , Chenlong LI , Ning ZHANG
CPC classification number: A61B5/01 , A61B5/6817 , A61B5/6843 , A61B5/7285 , A61B5/746
Abstract: This application relates to the field of temperature measurement technologies, and provides a wearable device and a temperature measurement method. The wearable device includes a first sensing member, a second sensing member, and a processor. When the wearable device is close to a biological body, the first sensing member forms equivalent capacitance with the biological body, and the first sensing member receives heat of the biological body. The second sensing member is configured to measure temperature of the first sensing member as an initial temperature. The processor is configured to read a capacitance value of the equivalent capacitance and determine a contact state between the first sensing member and the biological body according to the capacitance value. The processor is configured to determine whether to match a corresponding temperature compensation value to the initial temperature according to the contact state.
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公开(公告)号:US20240219261A1
公开(公告)日:2024-07-04
申请号:US17915914
申请日:2022-04-29
Applicant: HONOR DEVICE CO., LTD.
Inventor: Chao YAO , Chenlong LI , Qianying SHI
CPC classification number: G01M11/30 , G01J1/4204 , G08B5/36
Abstract: An apparatus and a method for detecting a mounting state of a light pipe in a terminal are disclosed. The detection apparatus includes a fixture, a detection light source, and a light detection module. A light inlet path is formed inside the fixture, an opening that is of the light inlet path and that is exposed to the fixture is opposite to a mounting position of the light pipe, and the detection light source is disposed above the fixture. The light detection module is configured to determine the mounting state of the light pipe based on a luminous flux value of detection light. In cases in which the light pipe is properly mounted, the mounting position is deviated, the light pipe is not mounted, or the like, the luminous flux value of the detection light that is transmitted to the light detection module through the light inlet path varies accordingly.
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公开(公告)号:US20240179865A1
公开(公告)日:2024-05-30
申请号:US17911345
申请日:2022-04-27
Applicant: HONOR DEVICE CO., LTD.
Inventor: Yinjiong TAN , Liang BAI , Chao YAO , Ruiying SHANG
IPC: H05K7/14 , A61B5/00 , A61B5/0205 , A61B5/024 , A61B5/256 , A61B5/28 , A61B5/332 , G01K13/20 , G04G21/02 , H05K1/18
CPC classification number: H05K7/1427 , A61B5/02055 , A61B5/256 , A61B5/28 , A61B5/681 , G01K13/20 , H05K1/181 , A61B5/02416 , A61B5/02438 , A61B5/332 , A61B2562/166 , G04G21/025 , H05K2201/10151
Abstract: An electronic device includes a shell, a contact member, a temperature sensor, and a circuit board. The shell has an accommodating space. The contact member is arranged on the shell, and at least part of a surface of the contact member forms an outer surface of the electronic device. The temperature sensor is arranged in the accommodating space and has a positive electrode and a negative electrode. The circuit board is arranged in the accommodating space and provided with a positive wire and a negative wire. The positive wire is connected to the positive electrode of the temperature sensor. The negative wire is connected to the negative electrode of the temperature sensor. At least one of the positive wire and the negative wire is thermally conductively connected to the contact member.
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公开(公告)号:US20230370761A1
公开(公告)日:2023-11-16
申请号:US18029801
申请日:2022-04-07
Applicant: Honor Device Co., Ltd.
Inventor: Chenlong LI , Chao YAO
IPC: H04R1/10
CPC classification number: H04R1/1041 , H04R1/1016 , H04R2430/01 , G01L1/14
Abstract: This application provides an earphone, which can resolve a problem that a strain sensing module in the earphone and for implementing function keys occupies a large space area, thereby implementing the function keys of the earphone through pressing in multiple directions and reducing an overall size of the earphone. The earphone includes a housing and a pressure-strain structure arranged in a cavity formed by the housing. Two end portions of the pressure-strain structure are both in stable contact with an inner wall of the housing. A strain sensor is arranged on the pressure-strain structure. In a case that the housing is squeezed, the pressure-strain structure generates strain, and the strain sensor is configured to sense the strain generated by the pressure-strain structure.
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