公开(公告)号：US11412981B2

公开(公告)日：2022-08-16

申请号：US16334510

申请日：2016-09-20

Applicant: Honor Device Co., Ltd.

Inventor： Hong Zhang

IPC: G16H40/67 ,  A61B5/00 ,  A61B5/0205 ,  A61B5/024 ,  G06F1/3231 ,  G06F1/32 ,  G06F1/3206 ,  G06F1/16 ,  G08B21/04

Abstract: An intelligent device and wearing method. The method includes, for an intelligent device having a first sensor and a second sensor, obtaining a measurement value of the first sensor, when the measurement value of the first sensor is greater than a first threshold, determining that the intelligent device is in a worn state, when the measurement value of the first sensor is less than a second threshold, determining that the intelligent device is in a not-worn state, where the first threshold is greater than the second threshold, when the measurement value of the first sensor is between the first threshold and second threshold, turning on the second sensor, turning on the second sensor, obtaining a measurement value of the second sensor, and determining, according to the measurement value of the second sensor, that the intelligent device is in the worn state or in the not-worn state.

公开(公告)号：US20240284636A1

公开(公告)日：2024-08-22

申请号：US18043840

申请日：2022-08-19

Applicant: Honor Device Co., Ltd.

Inventor： Hong Zhang ,  Shaohong Dong ,  Yandang Qiao ,  Fenying Li

IPC: H05K7/20 ,  G06F1/20 ,  H05K9/00

CPC classification number: H05K7/20336 ,  G06F1/203 ,  G06F1/206 ,  H05K9/0024 ,  H05K9/0026

Abstract: An embodiment of this application provides an electronic device. The electronic device includes at least a mainboard, electronic components, and a shielding assembly. The shielding assembly includes a shielding case, a capillary structure, and a thermally conductive plate. The electronic components are located in the shielding case and connected to the shielding case. The thermally conductive plate is located on a side of the shielding case that faces away from the electronic components. The thermally conductive plate is connected to the shielding case to form a sealing cavity. The capillary structure is disposed in the sealing cavity. The sealing cavity is filled with a working substance. The sealing cavity includes a vaporization zone and a condensation zone. The vaporization zone is located above the electronic components. The capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone.