公开(公告)号：US20120043127A1

公开(公告)日：2012-02-23

申请号：US12956724

申请日：2010-11-30

申请人： Hsien-Chieh LIN ,  Tung-Yu Chang

发明人： Hsien-Chieh LIN ,  Tung-Yu Chang

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K1/0203 ,  H01L23/473 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/1469 ,  Y10T29/49155 ,  Y10T29/49156

摘要： The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A first through hole and a second through hole are formed through a portion of the core substrate, respectively from the first surface and second surfaces, wherein the first and second through holes are laminated vertically and connect to each other. A first guide rail and a second guide rail are, respectively, formed through a portion of the core substrate and connected to the second through hole, so that a fluid flows sequentially from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board.

摘要翻译： 本发明提供一种印刷电路板及其制造方法。 印刷电路板包括具有第一表面和相对的第二表面的芯基板。 分别从第一表面和第二表面穿过芯基板的一部分形成第一通孔和第二通孔，其中第一和第二通孔垂直地层叠并且彼此连接。 第一导轨和第二导轨分别通过芯基板的一部分形成并连接到第二通孔，使得流体从印刷电路板的外部依次流过第一导轨， 第二通孔和第二导轨，连接到印刷电路板的外部。