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公开(公告)号:US20110177632A1
公开(公告)日:2011-07-21
申请号:US12929795
申请日:2011-02-16
申请人: Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
发明人: Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
CPC分类号: H01L27/14618 , H01L31/0203 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a translucent adhesive (5), the semiconductor substrate (11) having a plurality of convex portions (31) formed so as to separate the light receiving part (12) and the electrodes (13) and have proper gaps (32) therebetween.
摘要翻译: 光学器件包括:半导体衬底(11),其上形成有光接收部分(12)(或发光部分)和电极(13);以及半透明板(2),其接合在光接收部分(12)上, 通过半透明粘合剂(5),半导体衬底(11)具有形成为分离光接收部分(12)和电极(13)的多个凸部(31),并且在它们之间具有适当的间隙(32)。
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公开(公告)号:US07977138B1
公开(公告)日:2011-07-12
申请号:US12929795
申请日:2011-02-16
申请人: Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
发明人: Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
IPC分类号: H01L21/00 , H01L21/50 , H01L21/48 , H01L31/0203
CPC分类号: H01L27/14618 , H01L31/0203 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a translucent adhesive (5), the semiconductor substrate (11) having a plurality of convex portions (31) formed so as to separate the light receiving part (12) and the electrodes (13) and have proper gaps (32) therebetween.
摘要翻译: 光学器件包括:半导体衬底(11),其上形成有光接收部分(12)(或发光部分)和电极(13);以及半透明板(2),其接合在光接收部分(12)上, 通过半透明粘合剂(5),半导体衬底(11)具有形成为分离光接收部分(12)和电极(13)的多个凸部(31),并且在它们之间具有适当的间隙(32)。
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公开(公告)号:US20090108426A1
公开(公告)日:2009-04-30
申请号:US12209233
申请日:2008-09-12
申请人: Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
发明人: Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
CPC分类号: H01L27/14618 , H01L31/0203 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a translucent adhesive (5), the semiconductor substrate (11) having a plurality of convex portions (31) formed so as to separate the light receiving part (12) and the electrodes (13) and have proper gaps (32) therebetween.
摘要翻译: 光学器件包括:半导体衬底(11),其上形成有光接收部分(12)(或发光部分)和电极(13);以及半透明板(2),其接合在光接收部分(12)上, 通过半透明粘合剂(5),半导体衬底(11)具有形成为分离光接收部分(12)和电极(13)的多个凸部(31),并且在它们之间具有适当的间隙(32)。
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公开(公告)号:US07911018B2
公开(公告)日:2011-03-22
申请号:US12209233
申请日:2008-09-12
申请人: Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
发明人: Hu Meng , Hiroto Osaki , Tetsushi Nishio , Kiyokazu Itoi
IPC分类号: H01L31/0203 , H01L23/02
CPC分类号: H01L27/14618 , H01L31/0203 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a translucent adhesive (5), the semiconductor substrate (11) having a plurality of convex portions (31) formed so as to separate the light receiving part (12) and the electrodes (13) and have proper gaps (32) therebetween.
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公开(公告)号:US20090230408A1
公开(公告)日:2009-09-17
申请号:US12396183
申请日:2009-03-02
申请人: Hu Meng , Hiroto Ohsaki
发明人: Hu Meng , Hiroto Ohsaki
CPC分类号: H01L33/20 , H01L27/14618 , H01L33/44 , H01L33/58 , H01L33/62 , H01L2224/48247 , H01L2224/73265 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要: An optical device includes a semiconductor substrate including a device region formed thereon, the device region including at least one of a light-receiving region and a light-emitting region; a light-transmissive flattening film covering the device region, and including a first concave portion located in a region on an outer side of the device region; a light-transmissive member formed on the light-transmissive flattening film; and a light-transmissive adhesive layer bonding together the light-transmissive flattening film and the light-transmissive member, and filling the first concave portion.
摘要翻译: 光学器件包括其上形成有器件区域的半导体衬底,器件区域包括光接收区域和发光区域中的至少一个; 覆盖所述器件区域的透光扁平膜,并且包括位于所述器件区域的外侧的区域中的第一凹部; 形成在透光性平坦化膜上的透光性部件; 以及将透光性扁平膜和透光性构件接合在一起的透光性粘合剂层,并且填充第一凹部。
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