公开(公告)号：US20090230408A1

公开(公告)日：2009-09-17

申请号：US12396183

申请日：2009-03-02

申请人： Hu Meng ,  Hiroto Ohsaki

发明人： Hu Meng ,  Hiroto Ohsaki

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/20 ,  H01L27/14618 ,  H01L33/44 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device includes a semiconductor substrate including a device region formed thereon, the device region including at least one of a light-receiving region and a light-emitting region; a light-transmissive flattening film covering the device region, and including a first concave portion located in a region on an outer side of the device region; a light-transmissive member formed on the light-transmissive flattening film; and a light-transmissive adhesive layer bonding together the light-transmissive flattening film and the light-transmissive member, and filling the first concave portion.

摘要翻译： 光学器件包括其上形成有器件区域的半导体衬底，器件区域包括光接收区域和发光区域中的至少一个; 覆盖所述器件区域的透光扁平膜，并且包括位于所述器件区域的外侧的区域中的第一凹部; 形成在透光性平坦化膜上的透光性部件; 以及将透光性扁平膜和透光性构件接合在一起的透光性粘合剂层，并且填充第一凹部。

公开(公告)号：US07973323B2

公开(公告)日：2011-07-05

申请号：US12240313

申请日：2008-09-29

申请人： Shoichi Tanaka ,  Hiroto Ohsaki

发明人： Shoichi Tanaka ,  Hiroto Ohsaki

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12

CPC分类号： H01L23/24 ,  H01L31/0203 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.

摘要翻译： 半导体器件包括：绝缘基底; 设置在所述绝缘基底上的半导体元件; 设置在半导体元件上的保护器; 以及设置在所述绝缘基底的周围并围绕所述半导体元件的框架。 框架内的区域填充有密封树脂，并且在框架的半导体元件侧的框架的上角部设置至少一个凹槽。

公开(公告)号：US08227814B2

公开(公告)日：2012-07-24

申请号：US13117803

申请日：2011-05-27

申请人： Shoichi Tanaka ,  Hiroto Ohsaki

发明人： Shoichi Tanaka ,  Hiroto Ohsaki

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12

CPC分类号： H01L23/24 ,  H01L31/0203 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.

摘要翻译： 半导体器件包括：绝缘基底; 设置在所述绝缘基底上的半导体元件; 设置在半导体元件上的保护器; 以及设置在所述绝缘基底的周围并围绕所述半导体元件的框架。 框架内的区域填充有密封树脂，并且在框架的半导体元件侧的框架的上角部设置至少一个凹槽。

公开(公告)号：US20090146174A1

公开(公告)日：2009-06-11

申请号：US12240313

申请日：2008-09-29

申请人： Shoichi TANAKA ,  Hiroto Ohsaki

发明人： Shoichi TANAKA ,  Hiroto Ohsaki

IPC分类号： H01L33/00 ,  H01L31/0203 ,  H01L21/50

CPC分类号： H01L23/24 ,  H01L31/0203 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.

摘要翻译： 半导体器件包括：绝缘基底; 设置在所述绝缘基底上的半导体元件; 设置在半导体元件上的保护器; 以及设置在所述绝缘基底的周围并围绕所述半导体元件的框架。 框架内的区域填充有密封树脂，并且在框架的半导体元件侧的框架的上角部设置至少一个凹槽。