公开(公告)号：US12238853B2

公开(公告)日：2025-02-25

申请号：US18191946

申请日：2023-03-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui Jia ,  Xinhu Gong ,  Dingfang Li

IPC: H05K1/02

Abstract: A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.

公开(公告)号：US11647608B2

公开(公告)日：2023-05-09

申请号：US17486593

申请日：2021-09-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yiying Jian ,  Dingfang Li ,  Xinhu Gong ,  Gaoliang Xia

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20

CPC classification number: H05K7/20418 ,  H05K7/20718

Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.

公开(公告)号：US20250164053A1

公开(公告)日：2025-05-22

申请号：US19027498

申请日：2025-01-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Dingfang Li

IPC: F16L37/56 ,  H05K7/20

Abstract: This application provides a blind-mate connector and a liquid cooling apparatus. The blind-mate connector includes a floating support, a connector, and a floating component. The connector includes a plug-in end, and the plug-in end is configured to be inserted into the to-be-cooled device. The connector is slidably assembled on the floating support, and a sliding direction of the connector is consistent with an insertion direction of the connector. The blind-mate connector is floatable in the insertion direction. The floating support is mounted on a fixing plate by using the floating component. The floating component includes a protrusion and a floating hole. A diameter of the floating hole is larger than that of the protrusion. The protrusion is assembled in the floating hole, and the protrusion is circumferentially movable in the floating hole. The blind-mate connector in this solution is floatable in various directions and has a simple structure.

公开(公告)号：US20240324146A1

公开(公告)日：2024-09-26

申请号：US18735565

申请日：2024-06-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Jia ,  Gaoliang Xia ,  Dingfang Li

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20254 ,  H05K7/20272

Abstract: A device node is provided. The device node includes a circuit board, a heat dissipation component and a housing having a cold liquid inlet and a liquid return outlet. The circuit board and the heat dissipation component are disposed in the housing, and at least one main chip is disposed on the circuit board. The heat dissipation component includes a spray plate and at least one liquid cold plate. Each liquid cold plate is configured to form a liquid cooling channel. Liquid cooling channels of all liquid cold plates are communicated to form a liquid cooling network. An inlet of the liquid cooling network is communicated with the cold liquid inlet. The spray plate has a spray channel communicated with an outlet of the liquid cooling network and liquid spray holes communicated with the spray channel, and a liquid outlet end of the liquid spray hole faces the circuit board.

公开(公告)号：US11133239B2

公开(公告)日：2021-09-28

申请号：US16719030

申请日：2019-12-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yonghai Mao ,  Yong Yao ,  Guangyu Fang ,  Dingfang Li ,  Shan Lin

IPC: H01L23/40 ,  G06F1/18 ,  G06F1/20

Abstract: In a processor fastening structure, when a compression spring (23) is compressed by shortening a distance between the other end of a screw (24) and a heat sink base (22), the compression spring (23) provides elastic force for both the screw (24) and the heat sink base (22). In addition, because the screw (24) passes through the compression spring (23) to connect to a fastening assembly (21), the elastic force of the compression spring (23) is converted into pressure from the heat sink base (22) to a CPU.