中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

17 records (took 0.017 seconds)

    Electronic device photographing method, and apparatus
    1.
    发明授权
    Electronic device photographing method, and apparatus 有权

    公开(公告)号：US10825421B2

    公开(公告)日：2020-11-03

    申请号：US16464407

    申请日：2016-11-29

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Honglei Luo ,  Feng Gao ,  Dede Jiang ,  Jianjun Xu

    IPC: G09G5/10 ,  G09G3/22

    Abstract: An electronic device photographing method includes, after the electronic device enters a photographing screen, determining a folding angle of the flexible display screen based on a pixel coordinate parameter of a photographed object on the photographing screen; and/or determining target luminance of a display screen; and when detecting that a photographing button is pressed, adjusting luminance of the display screen to the determined target luminance. In this way, when the electronic device is used to take an image, fill-in light can be implemented for the photographed photo by improving target luminance of the display screen based on the pixel coordinate parameter of the photographed object on the photographing screen.

    Electronic Device Photographing Method, and Apparatus
    3.
    发明申请
    Electronic Device Photographing Method, and Apparatus 审中-公开

    公开(公告)号：US20190371270A1

    公开(公告)日：2019-12-05

    申请号：US16464407

    申请日：2016-11-29

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Honglei Luo ,  Feng Gao ,  Dede Jiang ,  Jianjun Xu

    IPC: G09G5/10 ,  G09G3/22

    Abstract: An electronic device photographing method includes, after the electronic device enters a photographing screen, determining a folding angle of the flexible display screen based on a pixel coordinate parameter of a photographed object on the photographing screen; and/or determining target luminance of a display screen; and when detecting that a photographing button is pressed, adjusting luminance of the display screen to the determined target luminance. In this way, when the electronic device is used to take an image, fill-in light can be implemented for the photographed photo by improving target luminance of the display screen based on the pixel coordinate parameter of the photographed object on the photographing screen.

    Key-value storage method, apparatus, and system
    7.
    发明授权
    Key-value storage method, apparatus, and system 有权

    公开(公告)号：US11048642B2

    公开(公告)日：2021-06-29

    申请号：US16287826

    申请日：2019-02-27

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Feng Gao ,  Huiqin Yuan

    IPC: G06F12/10 ,  G06F3/06 ,  G06F16/22

    Abstract: Embodiments of this application provide a key-value storage method, apparatus, and system, to resolve at least a problem that currently no related solution can combine key-value storage with such efficient storage protocol as an NVMe protocol. The method includes: writing, by a host after detecting a key-value storage request, a first instruction code and address information that are carried in the key-value storage request to a field defined in a protocol, to constitute a first storage request instruction sequence, where the first instruction code is an instruction code defined based on a reserved extension field in the protocol; and interacting, by the host, with the storage controller, so that the storage controller obtains the first storage request instruction sequence. This application is applicable to the field of storage technologies.

    Printed circuit board and communications device
    8.
    发明授权
    Printed circuit board and communications device 有权

    公开(公告)号：US11019724B2

    公开(公告)日：2021-05-25

    申请号：US16727402

    申请日：2019-12-26

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Feng Gao ,  Ertang Xie ,  Wei Jing

    IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

    Abstract: This application provides a multilayer printed circuit board (PCB). There is a pad array on a surface of the multilayer PCB. The pad array includes at least one padding unit, and each padding unit includes a first pad and a second pad that are adjacent. Both the first pad and the second pad are connected to a first Z-directed transmission line located in a Z-directed groove. In this way, to wire a signal wire on a signal layer of the multilayer PCB, a quantity of Z-directed grooves that need to be bypassed is less than a quantity of vias that need to be bypassed in the prior art. In other words, wiring of the signal wire is easier to some extent. In addition, this application further provides a corresponding communications device.

    Printed circuit board method
    9.
    发明授权
    Printed circuit board method 有权
    印刷电路板方法

    公开(公告)号：US09526178B2

    公开(公告)日：2016-12-20

    申请号：US14519677

    申请日：2014-10-21

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Yongxing Yang ,  Feng Gao ,  Mingli Huang

    IPC: H05K3/42 ,  H05K3/00

    CPC classification number: H05K3/0047 ,  H05K3/429 ,  H05K2201/09545 ,  H05K2203/0207 ,  Y10T29/49156

    Abstract: A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.

    Abstract translation: 公开了一种印刷电路板（PCB）回钻方法，其中将导电层设置在电镀通孔（PTH）的预期的后向钻孔侧的PCB的表面与PCB的目标信号层之间，以及 该方法包括：以从PCB的表面开始的第一预设深度在PTH上执行第一次回钻; 控制回钻头沿着形成在第一反向钻削中的钻孔朝向目标信号层移动; 并且当所述反钻头与所述导电层接触时，从所述导电层开始以第二预设深度完成第二次回钻。

    PCB BACKDRILLING METHOD AND SYSTEM
    10.
    发明申请
    PCB BACKDRILLING METHOD AND SYSTEM 有权
    PCB背投方法和系统

    公开(公告)号：US20150047892A1

    公开(公告)日：2015-02-19

    申请号：US14519677

    申请日：2014-10-21

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Yongxing Yang ,  Feng Gao ,  Mingli Huang

    IPC: H05K3/00 ,  H05K3/42 ,  H05K1/11

    CPC classification number: H05K3/0047 ,  H05K3/429 ,  H05K2201/09545 ,  H05K2203/0207 ,  Y10T29/49156

    Abstract: A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.

    Abstract translation: 公开了一种印刷电路板（PCB）回钻方法，其中将导电层设置在电镀通孔（PTH）的预期的后向钻孔侧的PCB的表面与PCB的目标信号层之间，以及 该方法包括：以从PCB的表面开始的第一预设深度在PTH上执行第一次回钻; 控制回钻头沿着形成在第一反向钻削中的钻孔朝向目标信号层移动; 并且当所述反钻头与所述导电层接触时，从所述导电层开始以第二预设深度完成第二次回钻。

Patent Agency Ranking