公开(公告)号：US20240331739A1

公开(公告)日：2024-10-03

申请号：US18741084

申请日：2024-06-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jincan Guo ,  Tianqiang Huang ,  Rongbin Liu ,  Jieqiang Chen ,  Yun Liu ,  Zhengbo Wang

IPC: G11C5/06 ,  G11C7/10

CPC classification number: G11C5/063 ,  G11C7/1048

Abstract: This disclosure discloses a memory, a memory use method, a memory manufacturing method, and an electronic device. The memory includes a control layer and at least one storage layer stacked on the control layer. The storage layer includes a plurality of storage channels, and each storage channel includes an independent data interface bus. The control layer includes a plurality of controllers and a plurality of user interfaces, the controller is configured to access data stored in a storage channel connected to the controller. The plurality of controllers are connected to the data interface buses of the plurality of storage channels in one-to-one correspondence. A quantity of user interfaces is the same as a quantity of user storage channels that can be invoked by a user. The quantity of user interfaces is less than a quantity of controllers.