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公开(公告)号：US09326420B2
公开(公告)日：2016-04-26
申请号：US14101967
申请日：2013-12-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zilin Zhang , Ruifeng Shui , Bailin Long , Yangfan Zhong
CPC classification number: H05K7/20145 , G06F1/183 , G06F1/20 , G06F1/206 , H05K7/20 , H05K7/2039 , H05K7/20536 , H05K7/20554 , H05K7/20709
Abstract: Embodiments of the present invention disclose a server, and relate to the field of computer communications, so that maintainability of a server is improved, a heat dissipation function of the server is ensured, and heat dissipation reliability of the server is improved through online replacement of a heat dissipation fan and a server mainboard. A server includes: a chassis, a backplane with a ventilation opening, a rear board, a first air ducting apparatus, and at least one fan module, where the backplane is located in the middle of the chassis, and the rear board is connected to a rear side of the backplane in a pluggable manner; the fan module is disposed side by side with the rear board along a horizontal direction, and is connected to the rear side of the backplane in a pluggable manner.
Abstract translation: 本发明的实施例公开了一种服务器，涉及计算机通信领域，从而提高了服务器的可维护性，确保了服务器的散热功能，并且通过在线更换服务器来提高服务器的散热可靠性 散热风扇和服务器主板。 服务器包括：底盘，具有通风口的背板，后板，第一空气管道装置和至少一个风扇模块，其中背板位于底盘的中间，并且后板连接到 背板的后侧是可插拔的; 风扇模块与后板沿水平方向并排配置，并且以可插拔的方式连接到背板的后侧。
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公开(公告)号：US20140071618A1
公开(公告)日：2014-03-13
申请号：US14077455
申请日：2013-11-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Weiqiang Tian , Jianxing Liao , Ruifeng Shui , Mingliang Hao
IPC: H05K7/20
CPC classification number: H05K7/20754 , G06F1/20 , H05K7/20727
Abstract: Embodiments of the present invention relate to a heat dissipating device including a chassis, a backplane, at least one rear board, and at least one fan, where the chassis includes horizontal wall panels, vertical wall panels, and a rear wall panel; the chassis includes one or more partition plates; the rear board includes one or more second hole areas; and the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the rear board form a cooling air duct that does not pass a front board, so that under an effect of the fan, a cooling air flow is discharged out of the chassis after passing the rear board, the second hole area, and the fan, so as to implement heat dissipation for a functional module on the rear board.
Abstract translation: 本发明的实施例涉及一种散热装置，其包括底盘，背板，至少一个后板和至少一个风扇，其中所述底盘包括水平壁板，垂直壁板和后壁板; 底盘包括一个或多个隔板; 后板包括一个或多个第二孔区域; 并且一个或多个分隔板，水平壁板，垂直壁板，后壁板，背板和后板形成不通过前板的冷却风道，从而在 风扇，通过后板，第二孔区域和风扇之后，冷却空气流从底盘排出，以便对后板上的功能模块进行散热。
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公开(公告)号：US20140092541A1
公开(公告)日：2014-04-03
申请号：US14101967
申请日：2013-12-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zilin Zhang , Ruifeng Shui , Bailin Long , Yangfan Zhong
IPC: H05K7/20
CPC classification number: H05K7/20145 , G06F1/183 , G06F1/20 , G06F1/206 , H05K7/20 , H05K7/2039 , H05K7/20536 , H05K7/20554 , H05K7/20709
Abstract: Embodiments of the present invention disclose a server, and relate to the field of computer communications, so that maintainability of a server is improved, a heat dissipation function of the server is ensured, and heat dissipation reliability of the server is improved through online replacement of a heat dissipation fan and a server mainboard. A server includes: a chassis, a backplane with a ventilation opening, a rear board, a first air ducting apparatus, and at least one fan module, where the backplane is located in the middle of the chassis, and the rear board is connected to a rear side of the backplane in a pluggable manner; the fan module is disposed side by side with the rear board along a horizontal direction, and is connected to the rear side of the backplane in a pluggable manner.
Abstract translation: 本发明的实施例公开了一种服务器，涉及计算机通信领域，从而提高了服务器的可维护性，确保了服务器的散热功能，并且通过在线更换服务器来提高服务器的散热可靠性 散热风扇和服务器主板。 服务器包括：底盘，具有通风口的背板，后板，第一空气管道装置和至少一个风扇模块，其中背板位于底盘的中间，并且后板连接到 背板的后侧是可插拔的; 风扇模块与后板沿水平方向并排配置，并且以可插拔的方式连接到背板的后侧。
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公开(公告)号：US09351426B2
公开(公告)日：2016-05-24
申请号：US14077455
申请日：2013-11-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Weiqiang Tian , Jianxing Liao , Ruifeng Shui , Mingliang Hao
CPC classification number: H05K7/20754 , G06F1/20 , H05K7/20727
Abstract: Embodiments of the present invention relate to a heat dissipating device including a chassis, a backplane, at least one rear board, and at least one fan, where the chassis includes horizontal wall panels, vertical wall panels, and a rear wall panel; the chassis includes one or more partition plates; the rear board includes one or more second hole areas; and the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the rear board form a cooling air duct that does not pass a front board, so that under an effect of the fan, a cooling air flow is discharged out of the chassis after passing the rear board, the second hole area, and the fan, so as to implement heat dissipation for a functional module on the rear board.
Abstract translation: 本发明的实施例涉及一种散热装置，其包括底盘，背板，至少一个后板和至少一个风扇，其中所述底盘包括水平壁板，垂直壁板和后壁板; 底盘包括一个或多个隔板; 后板包括一个或多个第二孔区域; 并且一个或多个分隔板，水平壁板，垂直壁板，后壁板，背板和后板形成不通过前板的冷却风道，从而在 风扇，通过后板，第二孔区域和风扇之后，冷却空气流从底盘排出，以便对后板上的功能模块进行散热。
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