公开(公告)号：US20220247895A1

公开(公告)日：2022-08-04

申请号：US17727231

申请日：2022-04-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xidong Yao ,  Yeren Wang ,  Bingbing Tong

IPC: H04N5/225 ,  H04N5/232

Abstract: This application provides a photographing device. The photographing device includes a housing, configured to carry an electronic component of the photographing device, such as a lens module and an expansion module. A lens cavity and an expansion cavity isolated from each other are disposed in the housing. The lens module is disposed in the lens cavity, a heat dissipation apparatus is disposed in the expansion cavity, and the expansion module is disposed on the heat dissipation apparatus and is thermally connected to the heat dissipation apparatus. In addition, the disposed heat dissipation apparatus is further thermally connected to the lens module. A heat dissipation channel isolated from the expansion cavity is disposed in the heat dissipation apparatus. Therefore, an effect of dissipating heat from the expansion module and the lens module may be improved through air flowing in the heat dissipation channel.

公开(公告)号：US12052483B2

公开(公告)日：2024-07-30

申请号：US17727231

申请日：2022-04-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xidong Yao ,  Yeren Wang ,  Bingbing Tong

IPC: H04N23/52 ,  H04N23/51 ,  H04N23/55 ,  H04N23/60

CPC classification number: H04N23/52 ,  H04N23/51 ,  H04N23/55 ,  H04N23/665

Abstract: A photographing device includes a housing configured to carry an electronic component of the photographing device, such as a lens system and an expansion system. A lens cavity and an expansion cavity isolated from each other are disposed in the housing. The lens system is disposed in the lens cavity, a heat dissipation apparatus is disposed in the expansion cavity, and the expansion system is disposed on the heat dissipation apparatus and is thermally coupled to the heat dissipation apparatus. In addition, the disposed heat dissipation apparatus is further thermally coupled to the lens system. A heat dissipation channel isolated from the expansion cavity is disposed in the heat dissipation apparatus.

公开(公告)号：US10122411B2

公开(公告)日：2018-11-06

申请号：US15643235

申请日：2017-07-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Changyi Liu ,  Xudong Fei ,  Xidong Yao

IPC: H04B3/54 ,  G06F1/18 ,  H04L12/40 ,  G06F1/20

Abstract: A communications device is disclosed, the device includes a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.

公开(公告)号：US20170310363A1

公开(公告)日：2017-10-26

申请号：US15643235

申请日：2017-07-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Changyi Liu ,  Xudong Fei ,  Xidong Yao

IPC: H04B3/54 ,  G06F1/20 ,  H04L12/40 ,  G06F1/18

CPC classification number: H04B3/54 ,  G06F1/18 ,  G06F1/203 ,  G06F1/206 ,  H04L12/40039 ,  H05K7/1492 ,  H05K7/20209

Abstract: A communications device is disclosed, the device includes a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.