公开(公告)号：US10122411B2

公开(公告)日：2018-11-06

申请号：US15643235

申请日：2017-07-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Changyi Liu ,  Xudong Fei ,  Xidong Yao

IPC: H04B3/54 ,  G06F1/18 ,  H04L12/40 ,  G06F1/20

Abstract: A communications device is disclosed, the device includes a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.

公开(公告)号：US20170310363A1

公开(公告)日：2017-10-26

申请号：US15643235

申请日：2017-07-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Changyi Liu ,  Xudong Fei ,  Xidong Yao

IPC: H04B3/54 ,  G06F1/20 ,  H04L12/40 ,  G06F1/18

CPC classification number: H04B3/54 ,  G06F1/18 ,  G06F1/203 ,  G06F1/206 ,  H04L12/40039 ,  H05K7/1492 ,  H05K7/20209

Abstract: A communications device is disclosed, the device includes a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.