公开(公告)号：US20240006330A1

公开(公告)日：2024-01-04

申请号：US18469355

申请日：2023-09-18

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Juergen HOEGERL ,  Ruoyang Du ,  Huibin Chen

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/5386 ,  H01L25/0655 ,  H01L23/49537 ,  H01L23/3107 ,  H01L24/40 ,  H01L2224/40225

Abstract: The present disclosure relates to a semiconductor arrangement, comprising: a substrate; a first group of semiconductor elements forming a first switch; a second group of semiconductor elements forming a second switch. The substrate comprises: a first electrically conductive area; a second electrically conductive area; a third electrically conductive area; a fourth electrically conductive area. The semiconductor arrangement further comprises: a first electrical connection line; a second electrical connection line; and a third electrical connection line. The first electrical connection line, the second electrical connection line, the third electrical connection line and the fourth area of the substrate are dimensioned according to a symmetry criterion to enable a simultaneous current flow through the load paths of the semiconductor elements of the first group as well as a simultaneous current flow through the load paths of the semiconductor elements of the second group.

公开(公告)号：US20230268251A1

公开(公告)日：2023-08-24

申请号：US17818518

申请日：2022-08-09

Applicant: Huawei Technologies Co.,Ltd.

Inventor： Huibin Chen ,  Haiyan Liu

IPC: H01L23/473 ,  H01L25/11 ,  H01L21/48 ,  H02M7/00 ,  B23K26/24

CPC classification number: H01L23/473 ,  H01L25/115 ,  H01L21/4882 ,  H02M7/003 ,  B23K26/24 ,  B23K2101/36

Abstract: An encapsulation structure of a power module is disclosed in this application, which includes a power module and a liquid cooler. The power module includes a power module body, a metal baseplate, and heat dissipation finned tubes. A front side of the metal baseplate is connected to the power module body, and a back side of the metal baseplate is connected to the heat dissipation finned tubes. The metal baseplate has a protrusion part protruding. There are a plurality of grooves on a fluid pipe of the liquid cooler, a cavity exists between two adjacent grooves of the plurality of grooves, and the cavity is configured to communicate the two adjacent grooves. The power module body is lapped on the groove, a back side of the protrusion part is in contact with an edge surface of the groove, and the heat dissipation finned tubes are placed in the groove.

公开(公告)号：US20240170439A1

公开(公告)日：2024-05-23

申请号：US18429432

申请日：2024-02-01

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Fengqun Lang ,  Yutao Wang ,  Huibin Chen

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/373

CPC classification number: H01L24/32 ,  H01L23/367 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29299 ,  H01L2224/32151 ,  H01L2224/8384 ,  H01L2924/13055 ,  H01L2924/35

Abstract: A power module includes a first metal layer-clad substrate and a second metal layer-clad substrate that are disposed opposite to each other, and a chip and an interconnection pillar that are located between the first metal layer-clad substrate and the second metal layer-clad substrate. The chip and the first metal layer-clad substrate are electrically connected through press sintering by using a sintering material to improve bonding reliability. The chip is electrically connected to the second metal layer-clad substrate by using the interconnection pillar.

公开(公告)号：US20230230928A1

公开(公告)日：2023-07-20

申请号：US18189622

申请日：2023-03-24

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huibin Chen ,  Yongzhao Lin ,  Zhen Lv

IPC: H01L23/538 ,  H01L23/00

CPC classification number: H01L23/5386 ,  H01L23/5383 ,  H01L24/48 ,  H01L2224/48157

Abstract: A substrate, a packaged structure, and an electronic device are provided. The substrate is configured to be electrically connected to a chip. The chip includes a power terminal and a signal terminal. The substrate includes a first substrate and a second substrate mounted on the first substrate. The first substrate includes a first layout, and the first layout is configured to be electrically connected to the power terminal. The second substrate includes a second layout, and the second layout is configured to be electrically connected to the signal terminal. A spacing between lines of the second layout is less than a spacing between lines of the first layout. The substrate provided in this application has a small size and high integration.