摘要:
An apparatus for testing a semiconductor device includes a test socket, a test board, an ID reader, and an accumulator. The test socket comprises an ID information pattern and is configured to receive the semiconductor device. The test board is configured to detachably receive the test socket and electrically connect to the test socket. The ID reader is configured to read the ID information pattern and generate an ID signal corresponding to the test socket each time a semiconductor test is performed in the test socket. The accumulator is electrically connected to the ID reader and is configured to accumulate a plurality of ID signals, and store a test number equal to the number of times the test socket is used to perform the semiconductor test. The test number is based on the accumulated ID signals.
摘要:
A contact apparatus includes a pusher having first and second surfaces, the first surface being connected to a pressure unit, stoppers protruding from edges of the second surface of the pusher away from the pressure unit, a pusher block having first and second surfaces facing each other, the first surface facing the pusher, and the second surface being connected to a semiconductor device, coupling members connecting the pusher to the pusher block, and a connector disposed between the pusher and the pusher block, at least part of a surface of the connector being circular, and the circular surface making a point contact with the pusher or the pusher block.
摘要:
A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.