APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE AND METHOD OF TESTING A SEMICONDUCTOR DEVICE
    1.
    发明申请
    APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE AND METHOD OF TESTING A SEMICONDUCTOR DEVICE 有权
    用于测试半导体器件的装置和测试半导体器件的方法

    公开(公告)号:US20120229158A1

    公开(公告)日:2012-09-13

    申请号:US13404244

    申请日:2012-02-24

    申请人: Hun-Kyo SEO

    发明人: Hun-Kyo SEO

    IPC分类号: G01R31/26

    CPC分类号: G01R31/2894 G01R31/2893

    摘要: An apparatus for testing a semiconductor device includes a test socket, a test board, an ID reader, and an accumulator. The test socket comprises an ID information pattern and is configured to receive the semiconductor device. The test board is configured to detachably receive the test socket and electrically connect to the test socket. The ID reader is configured to read the ID information pattern and generate an ID signal corresponding to the test socket each time a semiconductor test is performed in the test socket. The accumulator is electrically connected to the ID reader and is configured to accumulate a plurality of ID signals, and store a test number equal to the number of times the test socket is used to perform the semiconductor test. The test number is based on the accumulated ID signals.

    摘要翻译: 一种用于测试半导体器件的装置包括测试插座,测试板,ID读取器和累加器。 测试插座包括ID信息模式并被配置为接收半导体器件。 测试板被配置为可拆卸地接收测试插座并电连接到测试插座。 ID读取器被配置为每次在测试插座中执行半导体测试时读取ID信息模式并生成与测试插座对应的ID信号。 蓄电池电连接到ID读取器,并且被配置为累积多个ID信号,并且存储等于测试插座用于执行半导体测试的次数的测试号。 测试号码是基于积累的ID信号。

    CONTACT APPARATUS AND SEMICONDUCTOR TEST EQUIPMENT USING THE SAME
    2.
    发明申请
    CONTACT APPARATUS AND SEMICONDUCTOR TEST EQUIPMENT USING THE SAME 有权
    联系设备和半导体测试设备使用它

    公开(公告)号:US20130088250A1

    公开(公告)日:2013-04-11

    申请号:US13530273

    申请日:2012-06-22

    IPC分类号: G01R31/26 G01R1/067

    CPC分类号: G01R1/0466 G01R31/2889

    摘要: A contact apparatus includes a pusher having first and second surfaces, the first surface being connected to a pressure unit, stoppers protruding from edges of the second surface of the pusher away from the pressure unit, a pusher block having first and second surfaces facing each other, the first surface facing the pusher, and the second surface being connected to a semiconductor device, coupling members connecting the pusher to the pusher block, and a connector disposed between the pusher and the pusher block, at least part of a surface of the connector being circular, and the circular surface making a point contact with the pusher or the pusher block.

    摘要翻译: 接触装置包括具有第一表面和第二表面的推动器,第一表面连接到压力单元,从推动器的第二表面的边缘突出的止动件远离压力单元;推动器块,其具有彼此面对的第一和第二表面 ,所述第一表面面向所述推动器,并且所述第二表面连接到半导体器件,将推动器连接到推动器块的联接构件以及设置在推动器和推动器块之间的连接器,连接器的至少一部分表面 圆形表面与推动器或推动块形成点接触。

    CONNECTING UNIT TO TEST SEMICONDUCTOR CHIPS AND APPARATUS TO TEST SEMICONDUCTOR CHIPS HAVING THE SAME
    3.
    发明申请
    CONNECTING UNIT TO TEST SEMICONDUCTOR CHIPS AND APPARATUS TO TEST SEMICONDUCTOR CHIPS HAVING THE SAME 有权
    连接单元到测试半导体芯片和测试具有相同测试半导体芯片的设备

    公开(公告)号:US20100117670A1

    公开(公告)日:2010-05-13

    申请号:US12614504

    申请日:2009-11-09

    IPC分类号: G01R31/02 G01R31/26 G01R1/06

    CPC分类号: G01R31/2886 G01R1/0408

    摘要: A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.

    摘要翻译: 用于测试半导体芯片的连接单元和用于测试具有该连接器的半导体芯片的装置包括多个连接器,其上具有一定形式的电连接端子的半导体芯片具有多个孔,电缆被配置为电连接 电连接端子到外部,以及耦合单元,其被配置成选择性地将电缆电连接到电连接端子上。 因此,可以对具有各种电连接端子的图案的半导体芯片进行电气测试,并且一次接收托盘中的半导体芯片。