Thin film transistor array panel and fabrication
    3.
    发明授权
    Thin film transistor array panel and fabrication 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US07888675B2

    公开(公告)日:2011-02-15

    申请号:US12099718

    申请日:2008-04-08

    IPC分类号: H01L21/00

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    Thin film transistor array panel and fabrication
    4.
    发明授权
    Thin film transistor array panel and fabrication 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US07371621B2

    公开(公告)日:2008-05-13

    申请号:US11486330

    申请日:2006-07-12

    IPC分类号: H01L21/00

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    Thin film transistor array panel and fabrication
    5.
    发明申请
    Thin film transistor array panel and fabrication 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US20070012967A1

    公开(公告)日:2007-01-18

    申请号:US11486330

    申请日:2006-07-12

    IPC分类号: H01L31/113

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    Thin film transistor array panel and fabrication
    6.
    发明授权
    Thin film transistor array panel and fabrication 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US08173493B2

    公开(公告)日:2012-05-08

    申请号:US12765698

    申请日:2010-04-22

    IPC分类号: H01L21/00 H01L21/84

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    THIN FILM TRANSISTOR ARRAY PANEL AND FABRICATION
    7.
    发明申请
    THIN FILM TRANSISTOR ARRAY PANEL AND FABRICATION 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US20100203715A1

    公开(公告)日:2010-08-12

    申请号:US12765698

    申请日:2010-04-22

    IPC分类号: H01L21/28

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    THIN FILM TRANSISTOR ARRAY PANEL AND FABRICATION
    8.
    发明申请
    THIN FILM TRANSISTOR ARRAY PANEL AND FABRICATION 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US20080203393A1

    公开(公告)日:2008-08-28

    申请号:US12099718

    申请日:2008-04-08

    IPC分类号: H01L27/088

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    Thin film transistor array panel and method for manufacturing the same
    9.
    发明申请
    Thin film transistor array panel and method for manufacturing the same 有权
    薄膜晶体管阵列面板及其制造方法

    公开(公告)号:US20060131581A1

    公开(公告)日:2006-06-22

    申请号:US11255801

    申请日:2005-10-21

    IPC分类号: H01L29/04

    摘要: A method for manufacturing a TFT array panel including forming a gate line having a gate electrode on a insulating layer, a gate insulating layer on the gate line, a semiconductor on the gate insulating layer, an ohmic contact on the semiconductor, a data line having a source electrode and a drain electrode apart form the source electrode on the ohmic contact, a passivation layer having a contact hole to expose the drain electrode, and a pixel electrode connected to the drain electrode through the contact hole. The drain electrode and the source electrode are formed by a photolithography using a negative photoresist pattern. The negative photoresist pattern includes a first portion having a first thickness corresponding to a channel area, a second portion having a second thickness corresponding to a data line area, and a third portion having a third thickness corresponding to another area.

    摘要翻译: 一种TFT阵列板的制造方法,包括在绝缘层上形成具有栅电极的栅极线,栅极线上的栅极绝缘层,栅极绝缘层上的半导体,半导体上的欧姆接触,数据线, 源电极和漏电极分开形成欧姆接触上的源电极,具有露出漏电极的接触孔的钝化层和通过接触孔连接到漏电极的像素电极。 漏电极和源电极通过使用负光致抗蚀剂图案的光刻形成。 负型光致抗蚀剂图案包括具有对应于沟道区域的第一厚度的第一部分,具有对应于数据线区域的第二厚度的第二部分和具有对应于另一区域的第三厚度的第三部分。

    Thin film transistor array panel and method for manufacturing the same
    10.
    发明授权
    Thin film transistor array panel and method for manufacturing the same 有权
    薄膜晶体管阵列面板及其制造方法

    公开(公告)号:US07688417B2

    公开(公告)日:2010-03-30

    申请号:US11255801

    申请日:2005-10-21

    IPC分类号: G02F1/1333 G02F1/133 G02F1/13

    摘要: A method for manufacturing a TFT array panel including forming a gate line having a gate electrode on a insulating layer, a gate insulating layer on the gate line, a semiconductor on the gate insulating layer, an ohmic contact on the semiconductor, a data line having a source electrode and a drain electrode apart form the source electrode on the ohmic contact, a passivation layer having a contact hole to expose the drain electrode, and a pixel electrode connected to the drain electrode through the contact hole. The drain electrode and the source electrode are formed by a photolithography using a negative photoresist pattern. The negative photoresist pattern includes a first portion having a first thickness corresponding to a channel area, a second portion having a second thickness corresponding to a data line area, and a third portion having a third thickness corresponding to another area.

    摘要翻译: 一种TFT阵列板的制造方法,包括在绝缘层上形成具有栅电极的栅极线,栅极线上的栅极绝缘层,栅极绝缘层上的半导体,半导体上的欧姆接触,数据线, 源电极和漏电极分开形成欧姆接触上的源电极,具有露出漏电极的接触孔的钝化层和通过接触孔连接到漏电极的像素电极。 漏电极和源电极通过使用负光致抗蚀剂图案的光刻形成。 负型光致抗蚀剂图案包括具有对应于沟道区域的第一厚度的第一部分,具有对应于数据线区域的第二厚度的第二部分和具有对应于另一区域的第三厚度的第三部分。