公开(公告)号：US20100093172A1

公开(公告)日：2010-04-15

申请号：US12432357

申请日：2009-04-29

申请人： Hyoung-hee KIM ,  Yool KANG ,  Seong-woon CHOI ,  Jin-young YOON

发明人： Hyoung-hee KIM ,  Yool KANG ,  Seong-woon CHOI ,  Jin-young YOON

IPC分类号： H01L21/308 ,  H01L21/312

CPC分类号： H01L21/0273 ,  Y10S430/106 ,  Y10S430/114

摘要： A method of forming fine patterns of a semiconductor device includes forming a plurality of first mask patterns on a substrate such that the plurality of first mask patterns are separated from one another by a space located therebetween, in a direction parallel to a main surface of the substrate, forming a plurality of capping films formed of a first material having a first solubility in a solvent on sidewalls and a top surface of the plurality of first mask patterns. The method further includes forming a second mask layer formed of a second material having a second solubility in the solvent, which is less than the first solubility, so as to fill the space located between the plurality of first mask patterns, and forming a plurality of second mask patterns corresponding to residual portions of the second mask layer which remain in the space located between the plurality of first mask patterns, after removing the plurality of capping films and a portion of the second mask layer using the solvent.

摘要翻译： 一种形成半导体器件的精细图案的方法包括在衬底上形成多个第一掩模图案，使得多个第一掩模图案在平行于所述第一掩模图案的主表面的方向上彼此分开位于其间的空间 形成多个由第一材料形成的封盖膜，该第一材料在溶剂中具有第一溶解性，并且在多个第一掩模图案的侧壁和顶表面上形成。 该方法还包括形成由溶剂中第二溶解度小于第一溶解度的第二材料形成的第二掩模层，以填充位于多个第一掩模图案之间的空间，并形成多个 第二掩模图案对应于残留在位于多个第一掩模图案之间的空间中的第二掩模层的残留部分，在使用溶剂除去多个封盖膜和第二掩模层的一部分之后。

公开(公告)号：US20110265048A1

公开(公告)日：2011-10-27

申请号：US13084143

申请日：2011-04-11

申请人： Sang-wook KIM ,  Chun-suk SUH ,  Seong-woon CHOI ,  Jung-hoon SER ,  Moon-gyu JEONG ,  Seong-bo SHIM

发明人： Sang-wook KIM ,  Chun-suk SUH ,  Seong-woon CHOI ,  Jung-hoon SER ,  Moon-gyu JEONG ,  Seong-bo SHIM

IPC分类号： G06F17/50

CPC分类号： G06F17/5081 ,  G06F2217/12 ,  Y02P90/265

摘要： A method of manufacturing a semiconductor device includes dividing a design pattern layout into a repetitive pattern part and a non-repetitive pattern part, obtaining an optical proximity correction (OPC) bias from an extracted portion, the extracted portion being a partial portion of the repetitive pattern part, applying the OPC bias obtained from the extracted portion equally to the extracted portion and other portions of the repetitive pattern part so as to form a first corrected layout in which corrected layouts of the other portions are the same as that of the extracted portion, and forming a photomask in all portions of the repetitive pattern part according to the first corrected layout.

摘要翻译： 一种制造半导体器件的方法包括将设计图案布局划分为重复图案部分和非重复图案部分，从提取部分获得光学邻近校正（OPC）偏压，提取部分是重复的部分部分 将从所提取的部分获得的OPC偏差平均地应用于提取部分和重复图案部分的其他部分，以便形成第一校正布局，其中其他部分的校正布局与提取部分的校正布局相同 并且根据第一校正布局在重复图案部分的所有部分中形成光掩模。