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1.发明授权公开(公告)号：US08173048B2
公开(公告)日：2012-05-08
申请号：US12654122
申请日：2009-12-10
申请人： Hyun Hee Namkung , Kyoung Soo Park , Bong Yong Kim , Kang Bae Yoon , Sang Sik Bae , Hyun Joo Seo
发明人： Hyun Hee Namkung , Kyoung Soo Park , Bong Yong Kim , Kang Bae Yoon , Sang Sik Bae , Hyun Joo Seo
CPC分类号： C09D4/06 , C08F283/008 , C08G18/672 , C09D175/16 , C08G18/40 , C08L2666/08
摘要： A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.
摘要翻译： 用于电路连接膜的组合物和使用该组合物的电路连接膜，所述组合物包括具有丙烯酸酯改性聚氨酯树脂，羧基改性丙烯腈丁二烯橡胶和丙烯酸共聚物的粘合剂树脂，所述丙烯酸共聚物的酸值为约 1〜约100mg KOH / g，包含异氰脲酸酯丙烯酸酯化合物和具有（甲基）丙烯酸酯基的化合物中的至少一种的自由基聚合性化合物和有机过氧化物。
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2.发明申请公开(公告)号：US20100148130A1
公开(公告)日：2010-06-17
申请号：US12654122
申请日：2009-12-10
申请人： Hyun Hee Namkung , Kyoung Soo Park , Bong Yong Kim , Kang Bae Yoon , Sang Sik Bae , Hyun Joo Seo
发明人： Hyun Hee Namkung , Kyoung Soo Park , Bong Yong Kim , Kang Bae Yoon , Sang Sik Bae , Hyun Joo Seo
CPC分类号： C09D4/06 , C08F283/008 , C08G18/672 , C09D175/16 , C08G18/40 , C08L2666/08
摘要： A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.
摘要翻译： 用于电路连接膜的组合物和使用该组合物的电路连接膜，所述组合物包括具有丙烯酸酯改性聚氨酯树脂，羧基改性丙烯腈丁二烯橡胶和丙烯酸共聚物的粘合剂树脂，所述丙烯酸共聚物的酸值为约 1〜约100mg KOH / g，包含异氰脲酸酯丙烯酸酯化合物和具有（甲基）丙烯酸酯基的化合物中的至少一种的自由基聚合性化合物和有机过氧化物。
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公开(公告)号：US08003017B2
公开(公告)日：2011-08-23
申请号：US12314882
申请日：2008-12-18
申请人： Byeong Hwan Jeon , Kyoung Soo Park , Bong Yong Kim , Young Jin Kwon , Kang Bae Yoon , Kyong Hun Shin , Hyun Hee Namkung , Hyun Joo Seo , Cheon Seok Lee
发明人： Byeong Hwan Jeon , Kyoung Soo Park , Bong Yong Kim , Young Jin Kwon , Kang Bae Yoon , Kyong Hun Shin , Hyun Hee Namkung , Hyun Joo Seo , Cheon Seok Lee
CPC分类号： C09J4/06 , C08L2666/02 , C09J123/0853 , H05K3/323
摘要： An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.
摘要翻译： 粘合剂组合物包括乙烯 - 乙酸乙烯酯共聚物，脂族杂环化合物与具有芳环的单体的共聚物，粘合剂树脂，可自由基聚合的材料和自由基引发剂。
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公开(公告)号：US20090152505A1
公开(公告)日：2009-06-18
申请号：US12314882
申请日：2008-12-18
申请人： Byeong Hwan Jeon , Kyoung Soo Park , Bong Yong Kim , Young Jin Kwon , Kang Bae Yoon , Kyong Hun Shin , Hyun Hee Namkung , Hyun Joo Seo , Cheon Seok Lee
发明人： Byeong Hwan Jeon , Kyoung Soo Park , Bong Yong Kim , Young Jin Kwon , Kang Bae Yoon , Kyong Hun Shin , Hyun Hee Namkung , Hyun Joo Seo , Cheon Seok Lee
CPC分类号： C09J4/06 , C08L2666/02 , C09J123/0853 , H05K3/323
摘要： An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.
摘要翻译： 粘合剂组合物包括乙烯 - 乙酸乙烯酯共聚物，脂族杂环化合物与具有芳环的单体的共聚物，粘合剂树脂，可自由基聚合的材料和自由基引发剂。
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公开(公告)号：US10141084B2
公开(公告)日：2018-11-27
申请号：US13834349
申请日：2013-03-15
申请人： Kyoung Soo Park , Woo Suk Lee , Woo Jun Lim , Kyung Jin Lee , Bong Yong Kim , Jin Seong Park , Dong Seon Uh , Youn Jo Ko , Jang Hyun Cho , Sang Sik Bae , Jin Kyu Kim
发明人： Kyoung Soo Park , Woo Suk Lee , Woo Jun Lim , Kyung Jin Lee , Bong Yong Kim , Jin Seong Park , Dong Seon Uh , Youn Jo Ko , Jang Hyun Cho , Sang Sik Bae , Jin Kyu Kim
摘要： An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160° C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1.
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