摘要:
A backlight unit suitable for realizing a high-quality image. The backlight unit according to the present invention is a direct type, which is disposed under a liquid crystal panel to irradiate light to a back surface of the liquid crystal panel. The backlight unit includes a light source unit having a plurality of light source regions formed on a substrate, each of the light source regions driven separately and having at least one light emitting diode. The backlight unit also includes partitions provided on the substrate and disposed between the light source regions of the light source unit, and a circuit for controlling and driving the light source unit.
摘要:
Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
摘要:
Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
摘要:
Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
摘要:
Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
摘要:
A backlight unit for a liquid crystal display is provided. The backlight unit includes a surface light source, a diffuser sheet uniformly diffusing incident light from the surface light source, and a light collection sheet collecting light diffused by the diffuser sheet. The surface light source includes a first LED arrangement in which two green LEDs, a red Led, and a blue LED are arranged in this order and a second LED arrangement in which two green LEDs, a blue LED, and a red LED are arranged in this order. The first and second LED arrangements are done along rows or columns, and, in a combination of the first and second LED arrangement, the two green LEDs are surrounded by the red and/or blue LEDs.
摘要:
A backlight unit for a liquid crystal display is provided. The backlight unit includes a surface light source, a diffuser sheet uniformly diffusing incident light from the surface light source, and a light collection sheet collecting light diffused by the diffuser sheet. The surface light source includes a first LED arrangement in which two green LEDs, a red Led, and a blue LED are arranged in this order and a second LED arrangement in which two green LEDs, a blue LED, and a red LED are arranged in this order. The first and second LED arrangements are done along rows or columns, and, in a combination of the first and second LED arrangement, the two green LEDs are surrounded by the red and/or blue LEDs.
摘要:
A surface light source using LEDs is provided. The surface light source includes a substrate having a plurality of divided regions, a plurality of red, green and blue LEDs arranged on each divided region in a predetermined arrangement structure, and a plurality of LED driving units each having red, green and blue LED driving circuits for respectively driving the red, green and blue LEDs. Identical color LEDs in each divided region are interconnected in series. The series connections of the red, green and blue LEDs in one divided region are respectively connected to the series connections of the red, green and blue LEDs in one or more other divided regions in parallel. The parallel connections of the series connections are connected to corresponding color LED driving circuits.
摘要:
A surface light source using LEDs is provided. The surface light source includes a substrate having a plurality of divided regions, a plurality of red, green and blue LEDs arranged on each divided region in a predetermined arrangement structure, and a plurality of LED driving units each having red, green and blue LED driving circuits for respectively driving the red, green and blue LEDs. Identical color LEDs in each divided region are interconnected in series. The series connections of the red, green and blue LEDs in one divided region are respectively connected to the series connections of the red, green and blue LEDs in one or more other divided regions in parallel. The parallel connections of the series connections are connected to corresponding color LED driving circuits.
摘要:
An integrated circuit is provided. The integrated circuit includes a plurality of output pads, a plurality of test pads, and a plurality of channel shift switches respectively connected between the plurality of output pads and the plurality of test pads and operated by a plurality of channel shift switch enable signals. A short path between the plurality of output pads may be detected when each of the plurality of channel shift switch enable signals are simultaneously at a high level.