公开(公告)号：US20180174770A1

公开(公告)日：2018-06-21

申请号：US15782636

申请日：2017-10-12

Applicant: Hyundai Motor Company ,  Kia Motors Corporation

Inventor： Min Gun JEONG ,  Jeejung KIM

IPC: H01H1/023 ,  C22C5/06 ,  H01H11/04 ,  H01R13/03

CPC classification number: H01H1/023 ,  C22C5/06 ,  H01H11/04 ,  H01H15/18 ,  H01H2011/046 ,  H01R13/03

Abstract: An electrical contact material may include a first contact that contacts a negative electrode; a third contact that contacts a positive electrode; and a second contact that is provided between the first contact and the third contact, wherein different plating materials are respectively attached to the first contact, the second contact, and the third contact.

公开(公告)号：US20180056422A1

公开(公告)日：2018-03-01

申请号：US15348787

申请日：2016-11-10

Applicant: Hyundai Motor Company

Inventor： Jeejung KIM ,  Min Gun Jeong

IPC: B23K1/00 ,  B23K1/20 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  H05K3/34 ,  H05K3/26

CPC classification number: B23K1/0016 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42 ,  H05K3/26 ,  H05K3/3484 ,  H05K3/3489

Abstract: A soldering flux composition containing a resin, a solvent, and carbon particles is provided herein.

公开(公告)号：US20190054575A1

公开(公告)日：2019-02-21

申请号：US15792359

申请日：2017-10-24

Applicant: HYUNDAI MOTOR COMPANY ,  KIA MOTORS CORPORATION ,  HEESUNG MATERIAL LTD.

Inventor： Jeejung KIM ,  Hyun Chae JUNG ,  Taekhee PARK ,  Joo Dong LEE

IPC: B23K35/26 ,  C22C13/02

Abstract: A lead-free solder composition includes, with respect to 100 wt % of a total weight of the lead-free solder composition, silver (Ag) at 0.3 to 3.0 wt %, antimony (Sb) at 0.5 to 3.0 wt %, indium (In) at 0.3 to 3.0 wt %, and tin (Sn) as the remaining portion.