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公开(公告)号：US20230059359A1
公开(公告)日：2023-02-23
申请号：US17840781
申请日：2022-06-15
发明人： Eun Sik KIM , Hyeon Uk KIM , Ji Soo KIM , Jong Hwan HAN
摘要： An organ-type electronic pedal device includes a high-load spring module and a hysteresis lever. If necessary, the organ-type pedal device enables different pedal efforts, strokes, and hysteresis operating forces to be tuned as required for individual vehicle models by changing the parts of the hysteresis lever.
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公开(公告)号：US20230173916A1
公开(公告)日：2023-06-08
申请号：US17840784
申请日：2022-06-15
发明人： Eun Sik KIM , Hyeon Uk KIM , Ji Soo KIM , Jong Hwan HAN
CPC分类号： B60K26/021 , B60T7/042 , B60T2220/04
摘要： The present disclosure relates to an organ-type electronic pedal apparatus including a high-load spring module 500 and a hysteresis lever 400 and capable of tuning a pedal effort, a stroke, and a hysteretic force, which are required to vary depending on the types of vehicles, by changing components of the hysteresis lever 400, as necessary.
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公开(公告)号：US20230055436A1
公开(公告)日：2023-02-23
申请号：US17840782
申请日：2022-06-15
发明人： Eun Sik KIM , Hyeon Uk KIM , Ji Soo KIM , Jong Hwan HAN
摘要： A foldable electronic pedal apparatus is proposed. The foldable electronic pedal apparatus has both a foldable function that can pop up and hide the pedal and an electronic pedal function, and can tune necessary pedal effort, stroke, and hysteresis that are different for every kind of vehicle by having a high-load spring module and a hysteresis lever.
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公开(公告)号：US20240181873A1
公开(公告)日：2024-06-06
申请号：US18134691
申请日：2023-04-14
发明人： Eun Sik KIM , Kyung Nam KIM , Dae Yeon KIM , Hyeon Uk KIM
CPC分类号： B60K26/02 , B60N3/06 , B60T7/06 , B60K2026/026 , B60W60/005
摘要： A pedal apparatus for a vehicle, may include a brake pedal assembly, an accelerator pedal assembly, and a footrest panel are assembled to one another to form a single module component, and the completely assembled module component is supplied to an assembling line for a vehicle and assembled to a dash panel which is a vehicle body.
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公开(公告)号：US20220147093A1
公开(公告)日：2022-05-12
申请号：US17324032
申请日：2021-05-18
发明人： Eun Sik KIM , Ji Soo KIM , Hyeon Uk KIM
摘要： A foldable pedal apparatus of a vehicle with a hysteresis module, may include a pedal pad is in a popped-up state of protruding from a pedal housing to be exposed toward a driver, in a manual driving mode in which the driver directly drives the vehicle; the pedal pad is in a hidden state of being inserted into the pedal housing and blocked from being exposed to the driver, in the autonomous driving mode in which the driver does not directly drive the vehicle; and hysteresis may be implemented by a hysteresis module when the pedal pad is operated.
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公开(公告)号：US20230195156A1
公开(公告)日：2023-06-22
申请号：US17842703
申请日：2022-06-16
发明人： Eun Sik KIM , Hyeon Uk KIM , Ji Soo KIM , Jong Hwan HAN
摘要： An organ-type electronic pedal apparatus includes a high-load spring module and a hysteresis lever and configured for tuning a pedal effort, a stroke, and a hysteretic force, which are required to vary depending on the types of vehicles, by changing components of the hysteresis lever, as necessary.
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公开(公告)号：US20220144223A1
公开(公告)日：2022-05-12
申请号：US17325837
申请日：2021-05-20
发明人： Eun Sik KIM , Hyeon Uk KIM , Ji Soo KIM
摘要： An organ-type electronic brake pedal apparatus enables a pedal pad to be manipulated when a driver tries to manipulate the pedal pad by rotating his/her foot in the manner of manipulating an organ-type pedal or when the drivers tries to manipulate the pedal pad by stretching his/her foot forwards in the manner of manipulating a pendant-type pedal. The organ-type electronic brake pedal apparatus inhibits the pedal pad from being manipulated when the driver tries to manipulate a pedal arm part, which is positioned close to a hinge pin of the pedal pad.
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公开(公告)号：US20220144222A1
公开(公告)日：2022-05-12
申请号：US17325807
申请日：2021-05-20
发明人： Eun Sik KIM , Hyeon Uk KIM , Ji Soo KIM
摘要： An organ type electronic brake pedal apparatus having a high- load spring module and a hysteresis module is capable of tuning a pedal effort, a stroke and a hysteresis operation force, desired differently for each vehicle model, by changing a component of the high-load spring module or hysteresis module. In particular, the organ type electronic brake pedal apparatus includes: a pedal housing to be fixedly installed on a floor below a driver seat of a vehicle; a pedal pad pivotably coupled to the pedal housing to be operated by a driver of the vehicle; a high-load spring module including a first end and a second end pivotably coupled to the pedal housing and the pedal pad, respectively; and a hysteresis module to connect the pedal housing and the pedal pad and generate hysteresis when the pedal pad is operated by the driver.
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公开(公告)号：US20220055477A1
公开(公告)日：2022-02-24
申请号：US17147920
申请日：2021-01-13
发明人： Eun Sik KIM , Hyeon Uk KIM , Ji Soo KIM
摘要： A foldable accelerator pedal apparatus for a vehicle includes: a pedal housing fixedly installed in a lower space of a driver seat, a pedal pad rotatably coupled to the pedal housing, and a hysteresis module to generate hysteresis when a driver manipulates the pedal pad. In a manual driving mode in which a driver directly drives the vehicle, the pedal pad 200 protrudes from the pedal housing 100 and is popped up to be exposed to the driver, and in an autonomous driving mode in which the driver does not directly drive the vehicle, the pedal pad 200 is inserted into the pedal housing 100 and is in a hidden (hide) state in which the exposure to the driver is blocked. It is possible to implement hysteresis through the hysteresis module 300 when the pedal pad 200 is manipulated.
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公开(公告)号：US20230197590A1
公开(公告)日：2023-06-22
申请号：US17869267
申请日：2022-07-20
发明人： Hyeon Uk KIM , Myung Ill YOU , Hyun Koo LEE , Jun Hee PARK
IPC分类号： H01L23/498 , H01L23/00 , H01L21/48
CPC分类号： H01L23/49811 , H01L23/49833 , H01L24/32 , H01L24/48 , H01L24/73 , H01L23/49838 , H01L21/4846 , H01L24/90 , H01L2224/32225 , H01L2224/48175 , H01L2224/73215
摘要： A power module and a manufacturing method includes a chip; an upper substrate provided above the chip and formed with a circuit pattern; a lower substrate provided below the chip and formed with a circuit pattern; and a spacer including a plurality of metal portions electrically connecting at least two among the chip, the upper substrate and the lower substrate to transmit an electrical signal, and an insulating portion positioned between the plurality of metal portions and insulating the metal portions.
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