-
公开(公告)号：US20240186272A1
公开(公告)日：2024-06-06
申请号：US18218756
申请日：2023-07-06
发明人： Myung III YOU , Jun Hee PARK
IPC分类号： H01L23/66 , H01L23/00 , H01L23/495 , H05K1/18
CPC分类号： H01L23/66 , H01L23/49541 , H01L24/48 , H05K1/189 , H01L2224/48137 , H01L2224/48175 , H05K2201/095
摘要： A power module is provided. In the power module, electrical connection to the outside is enabled through a FPCB made to be flexible and deformable, and as terminals for signal transmission and wire bonding for connecting terminals are eliminated, insulation is ensured and the overall size is reduced.
-
公开(公告)号：US20230282549A1
公开(公告)日：2023-09-07
申请号：US17888918
申请日：2022-08-16
发明人： Nam Sik KONG , Jun Hee PARK , Tae Hwa KIM
IPC分类号： H01L23/46 , H01L23/495 , H01L23/498 , H01L23/367 , H01L23/31 , H01L21/56
CPC分类号： H01L23/46 , H01L23/495 , H01L23/49861 , H01L23/3672 , H01L23/3121 , H01L21/56
摘要： A power module for a vehicle includes: a circuit board including a circuit pattern; a semiconductor chip connected to a first side of the circuit board; a lead frame disposed on the circuit board as being spaced apart from the semiconductor chip, and electrically connected to the semiconductor chip; and a cooling channel coupled to a second side of the circuit board and inserted in and jointed to a coolant flow channel of a cooler.
-
公开(公告)号：US20240234327A9
公开(公告)日：2024-07-11
申请号：US18134437
申请日：2023-04-13
发明人： Sung Taek HWANG , So Eun JEONG , Jun Hee PARK , Nam Sik KONG
IPC分类号： H01L23/538 , H01L25/07
CPC分类号： H01L23/5385 , H01L23/5387 , H01L25/071
摘要： A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.
-
公开(公告)号：US20220115291A1
公开(公告)日：2022-04-14
申请号：US17409348
申请日：2021-08-23
发明人： Hyeon Uk KIM , Jun Hee PARK , Sung Won PARK
IPC分类号： H01L23/373 , H01L23/367
摘要： An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal diffusion inductor of a plurality of inner thermal diffusion inductors is inserted into the inner metal layer.
-
公开(公告)号：US20240136296A1
公开(公告)日：2024-04-25
申请号：US18134437
申请日：2023-04-12
发明人： Sung Taek HWANG , So Eun JEONG , Jun Hee PARK , Nam Sik KONG
IPC分类号： H01L23/538 , H01L25/07
CPC分类号： H01L23/5385 , H01L23/5387 , H01L25/071
摘要： A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.
-
公开(公告)号：US20240105573A1
公开(公告)日：2024-03-28
申请号：US18220134
申请日：2023-07-10
发明人： Jun Hee PARK , Sung Taek Hwang , Nam Sik Kong , Myung III You
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00
CPC分类号： H01L23/49833 , H01L21/4867 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/32238 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48175 , H01L2224/73215 , H01L2224/73265
摘要： A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate, the first spacer and the second spacer extending toward each other.
-
公开(公告)号：US20230197590A1
公开(公告)日：2023-06-22
申请号：US17869267
申请日：2022-07-20
发明人： Hyeon Uk KIM , Myung Ill YOU , Hyun Koo LEE , Jun Hee PARK
IPC分类号： H01L23/498 , H01L23/00 , H01L21/48
CPC分类号： H01L23/49811 , H01L23/49833 , H01L24/32 , H01L24/48 , H01L24/73 , H01L23/49838 , H01L21/4846 , H01L24/90 , H01L2224/32225 , H01L2224/48175 , H01L2224/73215
摘要： A power module and a manufacturing method includes a chip; an upper substrate provided above the chip and formed with a circuit pattern; a lower substrate provided below the chip and formed with a circuit pattern; and a spacer including a plurality of metal portions electrically connecting at least two among the chip, the upper substrate and the lower substrate to transmit an electrical signal, and an insulating portion positioned between the plurality of metal portions and insulating the metal portions.
-
公开(公告)号：US20240096737A1
公开(公告)日：2024-03-21
申请号：US18514862
申请日：2023-11-20
发明人： Myung Ill YOU , Jun Hee PARK
IPC分类号： H01L23/373
CPC分类号： H01L23/3735 , H01L23/4952
摘要： A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.
-
公开(公告)号：US20220199491A1
公开(公告)日：2022-06-23
申请号：US17407494
申请日：2021-08-20
发明人： Hyun Koo LEE , Jun Hee PARK , Sang Cheol SHIN , Kang Ho JEONG
摘要： A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.
-
公开(公告)号：US20240186217A1
公开(公告)日：2024-06-06
申请号：US18144691
申请日：2023-05-08
发明人： Suk Hyun LIM , Jun Hee PARK
IPC分类号： H01L23/427 , H01L25/07
CPC分类号： H01L23/427 , H01L25/072 , H01L23/49833
摘要： A power module include at least one substrate including an insulating layer and a metal circuit disposed on a first side of the insulating layer, a semiconductor chip, and at least one vapor chamber including a fluid flowing therein and disposed between the semiconductor chip and one of the at least one substrate, wherein each of the at least one vapor chamber includes a first side thereof including a plane area greater than or equal to a plane area of the semiconductor chip and connected to the metal circuit of the one of the at least one substrate, and a second side thereof facing the first side along a first direction and connected to the semiconductor chip.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.019 秒)
